+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

OMNIVISION introduces 'smallest camera module'

News

New OCH2B30 CameraCubeChip® module is a compact wafer-level module with superior video quality.

OMNIVISION has introduced the new OCH2B30 camera module for three-dimensional (3D) intraoral dental scanners. The OCH2B30 features a compact CameraCubeChip® package in an ultra-small form factor (2.6 mm x 2.6 mm) with exceedingly high image quality and MIPI interface for cameras in benchtop, standalone and portable intraoral scanners.

“Intraoral scanners are quickly replacing the use of traditional dental impression in dentistry today. We are leveraging our proven technology from the medical endoscopy market to help advance intraoral scanners for dentistry,” said Aaron Chiang, marketing director, OMNIVISION. “Our CameraCubeChip® technology enables the smallest camera modules for 3D intraoral dental scanners. Similar in size to the actual CMOS image sensor inside the camera, the CameraCubeChip® enables ultra-compact, high-resolution cameras, which is especially important when there are multiple cameras in each scanning device. We expect the new OCH2B30 camera module to play an important role in driving the growth of the intraoral dental scanner market and, ultimately, in improving patient care.”

The global dental intraoral scanner market is growing with a compound annual growth rate (CAGR) of 11.1% in the forecast period of 2023 to 2030 and is expected to reach USD 1,325.80 million by 2030 from USD 573.76 million in 2022.1 This growth is being driven by the increasing demand for cosmetic dentistry, the prevalence of dental diseases and new technological advancements in dentistry. Intraoral scanners are used primarily by orthodontists, endodontists, periodontists, prosthodontists and general dentists.

The OCH2B30 camera module has a 2-megapixel (MP) resolution square-format CMOS image sensor with a 1.12-micron (µm) pixel built on OMNIVISION’s latest PureCel®Plus-S stacked-die technology, which enables its ultra-small size. At 1500 x 1500 resolution, the OCH2B30 achieves 60 frames per second (fps), and at 720p resolution, 120 fps.

Medical Certifications Streamline FDA Approval Process

OMNIVISION is ISO13485-certified. The OCH2B30 is tested for EMC/EMI compliance and sterilization, and it is biocompatible and waterproof. Because it passes OMNIVISION’s rigorous production testing, it is guaranteed to be within the stated electrical, mechanical and optimal specifications, and hence does not require tuning or calibration.

OMNIVISION introduces 'smallest camera module'
Socionext joins the Global Semiconductor Alliance
Imec unveils CMOS-based 56Gb/s zero-IF D-band beamforming transmitter
Flip chip technology market to reach $45.22 billion in 2032
EV Group and Fraunhofer IZM-ASSID expand partnership
Company founder Ayhan Busch celebrates her 90th birthday
Moxa 5G expert to discuss Private 5G Networks
Nordson Test & Inspection to showcase Advanced Semiconductor Technologies
Greene Tweed extends global reach
5G chipset market worth $92.billion in 2030
KYZEN to showcase Multi-Process Power Module Cleaner
Fractilia has introduced FAME OPC for improved OPC modeling
Critical Manufacturing and RoviSys expand strategic alliance
Mouser Electronics and Analog Devices publish Collaborative eBooks
Infineon introduces Product Carbon Footprint data for customers
Alphawave Semi collaborates with Arm
VIS and NXP to establish fab JV
Infineon drives decarbonisation and digitalisation
The future of flexible technology?
CEA-Leti reports three-layer integration breakthrough
Nidec Advance Technology signs agreement with Synergie Cad Group
Flip-chip die bonder promises speed improvement
Raspberry Pi selects Hailo to enable advanced AI capabilities
Gartner forecasts worldwide AI chips revenue to grow 33% in 2024
Imec demonstrates die-to-wafer hybrid bonding with a Cu interconnect pad pitch of 2µm
Doubling throughput of layer transfer technology
Accelerating lab to fab
Advanced packaging in the spotlight
ASML and imec open joint High NA EUV Lithography Lab
TRI to drive AI innovation, working with NVIDIA
AlixLabs receives 2,5 MSEK grant for green semiconductor production
Applied Research Initiative advances Arizona’s semiconductor ecosystem
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: