Adeia selects PulseForge Photonic Debonding equipment
Adeia Inc., a leading innovator in research and development who has pioneered hybrid bonding in the semiconductor industry, has chosen PulseForge equipment for advanced heterogeneous integration in semiconductors. The photonic debonding tool was installed at Adeia’s San Jose, CA, facility.
“We are excited to partner with PulseForge and incorporate their state-of-the-art photonic debonding equipment into our advanced packaging facility,” stated Dr. Laura Mirkarimi, senior vice president of engineering at Adeia. “This enhanced capability enables us to process thinned wafers and further drive innovation in the industry.”
Debonding is a critical process in semiconductor packaging, allowing for the separation of temporarily bonded carriers from thinned wafers. Adeia recognizes the performance of PulseForge’s photonic debonding tool and its unique inorganic light-absorbing layer, which ensures improved yield and a clean debond.
“We are proud to be selected by Adeia as a tool supplier,” said Jonathan Gibson, CEO at PulseForge. “Our photonic debonding technology provides a cost-effective alternative to existing industry methods, and with its unique advantages, we are confident that it will enable Adeia to achieve new levels of performance in their advanced packaging applications.”
The partnership between Adeia and PulseForge underscores the importance of innovation and collaboration in the semiconductor industry. The equipment manufacturer innovations must meet the process technology developer requirements to drive future semiconductor packaging technology advancement
