+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

OMRON introduces VT-X850

News

OMRON has launched the VT-X850, a 3D Computed Tomography Automatic X-ray Inspection (3D CT AXI) solution engineered to meet critical inspection needs in the electric vehicle (EV) and electronics manufacturing sectors.

The VT-X850 addresses the complexities of inspecting large, intricate, and dense materials, joining innovative design with the latest technology. With the integration of a high-voltage X-ray tube and Artificial Intelligence (AI), the VT-X850 delivers on speed, accuracy, and ease of use. The new VT-X850 Xray solution enhances the inspection process of assembly modules, primarily focusing on the barrel fill of connectors, and power devices, with an emphasis on detecting voids or insufficient solder.


“Our focus was to create a solution that not only addresses the technical challenges but also empowers professionals of all expertise levels to conduct efficient and effective inspections,” said Kevin Youngs, Sales Manager EMEA - Inspection Systems Division at OMRON Europe. “The VT-X850 underlines OMRON’s commitment to driving innovation that combines technological sophistication with user accessibility.”


Key Features of the VT-X850:


Higher speed & higher repeatability: Employing a high-voltage X-ray tube up to 160kV ensures stable, clear images in shorter time spans, even for intricate materials like heat sinks or aluminium die casts.


Handling of large and heavy modules: The design accommodates modules up to 335mm in height and 40kg in weight, ensuring broad applicability and versatility.


AI-Powered inspection: AI binarization ensures superior image processing, making the VT-X850 a user-friendly solution for individuals with varied technical expertise.


Automated solder and void detection: The innovative design eliminates dependency on manual settings, offering precise and efficient inspections without the need for specialized skills.


Enhancing user experience


The VT-X850’s pull-out structure ensures ease of maintenance and the replacement of the X-ray tube using a hand lifter. The unit is specifically designed to meet the escalating demands of inspecting complex and hard materials, particularly in the burgeoning EV market.


“As the EV market continues to grow, the need for precise, efficient, and user-friendly inspection solutions becomes key,” added Kevin Youngs. “The VT-X850 is ideal for manufacturers aiming for impeccable quality control while navigating the complexities of varied materials and components.”

Reality AI Explorer Tier offers free AI/ML development access
AEM introduces new generation of Automated Burn-In Systems
NPUs are emerging as the main rival to Nvidia’s AI dominance, says DAI Magister
Camtek receives a $20M order from a Tier-1 OSAT
Free samples of every STMicroelectronics NPI IC available from Anglia
NY CREATES and SEMI sign MoU
Major government investment to 'propel' Canada
QuickLogic announces $5.26 million contract award
ASNA and Athinia collaborate
Global sales forecast to reach record $109 billion in 2024
AMD to acquire Silo AI
Nanotronics unveils 'groundbreaking' Gen V AI Model
Aitomatic unveils SemiKong
Biden-Harris Administration reveals first CHIPS for America R&D facilities and selection processes
Collaboration to produce cutting-edge AI accelerator chips
Oxford Ionics breaks global quantum performance records
Adeia wins ECTC Award for paper on “Fine Pitch Die-to-Wafer Hybrid Bonding”
AEM introduces new generation of Automated Burn-In Systems
Sydney council forges vital semiconductor agreement
EV Group's EVG880 LayerRelease wins 2024 Best of West
Biden-Harris Administration to invest up to $1.6 billion
Cyient sets up subsidiary for semiconductor business
EMD Electronics network leaders honoured
Accenture acquires Cientra
Introducing Park FX200
Deep learning chipset market to surge to $72.8 billion by 2033
PI Innovation Award 2024: Nanobodies for Diagnostic and Therapeutic Applications
Graphcore joins Softbank Group
Kaman Measuring highlights high precision displacement sensors
Si2 reveals recipients of Annual Power of Partnerships Award
Advantest achieves ASPICE Level 2 Certification for V93000 SmarTest 8 Software
Semiconductors to become a trillion-dollar industry by 2030
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: