+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Trident IoT introduces new Zigbee Chip and SDK

News

Trident IoT to introduce & demonstrate developer-focused SDK designed to enhance IoT development at Connectivity Standards Alliance 2024 Member Meeting.

Trident IoT has announced the upcoming release of its new Zigbee chip and accompanying Software Development Kit (SDK).


The latest offering represents the next step forward in Trident IoT’s strategy to provide comprehensive IoT solutions that simplify IoT development. While the chip itself incorporates the latest silicon technology, what sets this apart is the developer-focused SDK designed by product engineers who have collectively developed and shipped millions of IoT products. This announcement further underscores Trident IoT’s commitment to IoT development by expanding its product portfolio to now include both Zigbee and Z-Wave offerings.


“Designed by product engineers for product engineers, our latest Zigbee chip and accompanying SDK has been purpose-built to make IoT development faster, easier, and more efficient,” said Mariusz Malkowski, CTO and co-founder of Trident IoT. “With this new offering, Trident IoT customers can expect more predictable development cycles, faster time to revenue and simply better products.”


Since the official company incorporation announcement less than one year ago, Trident IoT has more than doubled engineering resources. Trident IoT has amassed some of the industry’s foremost experts on wireless connectivity, across all protocols including Zigbee, Z-Wave, Matter, and more. The latest offering has been designed from the ground up by the Trident IoT engineering team backed by over a century of collective end-to-end product development experience to ensure it meets the real-world needs of today’s developers.


Trident IoT engineers will be on-site at the at the Connectivity Standards Alliance (Alliance) Member Meeting presently being held in Washington, DC. to demonstrate this new technology live.


The three pillars of Trident IoT include advanced silicon offerings, best-in-class design and development services and US-based accredited certification services. To provide enhanced support and services to manufacturers within the industry, Trident IoT is in the process of becoming an Alliance authorized test lab.


“We are excited to have Trident IoT in attendance at this year’s Alliance Member Meeting where they will showcase and demo their newest technology offerings,” said Chris LaPré, Head of Technology, Connectivity Standards Alliance. “The pending confirmation of Trident IoT as an authorized test lab is significant as it further strengthens the Alliance’s commitment to support our members bringing compliant and certified devices to market both efficiently and effectively.”

Nordic Semiconductor launches new component reels made from recycled plastics
Better throughput and quality for high-precision laser processes
Trident IoT introduces new Zigbee Chip and SDK
TRI expands with new office in Guadalajara, Mexico
Omdia research finds weak demand leads to declining quarter for semiconductor market
BAE Systems and GlobalFoundries collaborate
Custom CMOS image sensor design on a budget
Radiation hard CMOS sensor for satellite instrument
Data centre semiconductor market sees significant growth
Ultrafast laser enables new high energy particle strike simulation technique
OTTO Digital Services for Systems
OMRON introduces VT-X850
Fujifilm completes Korea factory
Soitec extends partnership with UMC
Revenue decline for top five wafer fab equipment makers
Texas Instruments and Delta Electronics collaborate to advance electric vehicle onboard charging
NY CREATES and CEA-Leti form strategic research partnership
Providing ultra-fast, RF-synchronised tuning to multilevel pulse states
CEA-Leti launches FAMES Pilot Line
Ansys enables 3D multiphysics visualisation of 3D-IC designs
Adeia selects PulseForge Photonic Debonding equipment
Fab capacity predicted to expand six percent in 2024
SEMIFIVE announces commercialisation of its 5nm HPC SoC Platform
Baya Systems to transform and accelerate Intelligent Computing
Computing and AI for automotive: toward centralisation and connectivity
CEA-Leti presents complementary developments in 3D Integration Technologies
Redefining X-ray Beam Monitoring?
Semiconductors in a world without PFAS
QP Technologies expands die preparation business
Advanced Quantum Processing Unit delivered by Pasqal to GENCI and CEA
High-speed, high-temperature pumps address the challenges of advanced ALD processes
Imec introduces 'best-in-class' ADCs
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: