+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Wave Photonics launches QPICPAC Chip Packaging solution

News

Wave Photonics, a Cambridge-based deep tech start-up, has launched an 'easy-to-use' turnkey packaging solution for prototyping and R&D.

Wave Photonics, SENKO Advanced Components, a company producing high-quality optical components, and Alter Technology, who offer advanced packaging solutions, have worked together as part of an Innovate UK project referred to as Quantum Photonic Integrated Circuit PACkaging (QPICPAC), to produce packaging solutions for Quantum Photonic Integrated Circuits (QPICs).

The packaging solution, which includes design templates and components, can minimise custom development requirements and costs for quantum technology companies.

Jiangbo Zhu, Senior Photonics Engineer at Wave Photonics who led the photonics design work on the project said “We are thrilled to introduce our new packaging service for QPICs, which is specifically designed to meet the needs of quantum companies requiring rapid prototyping and dependable packaging. Our service is meticulously verified, ensuring streamlined processes and high reliability, all while maintaining cost efficiency. With this offering, we aim to accelerate innovation and support our customers in pushing the boundaries of quantum technology.”

Bernard Lee, Director of Technology and Innovation at SENKO Advanced Components, said, “SENKO is honoured to have been part of this project and has continued to actively invest in many quantum international standards and industrial bodies. We hope to continue to introduce the very best in leading edge optical interconnect technology for future quantum applications.”

Liam Moroney, Business Development Manager – Photonics (Alter Technology, UK) said “This represents a (quantum) leap towards the much-needed standardised approach to affordable complex photonic integrated circuit (PIC) based product realisation. Demonstrated here is a full UK supply chain and workflow for an end-to-end PIC solution, beginning with manufacturing-compatible PIC design and layout guidance using process and assembly design kits (PDK, ADK), and finishing up with robust packaging and device characterisation available in low to high volumes with a quick turnaround”.

Advanced Energy introduces power and measurement solutions
Nordic Semiconductor recognised for greenhouse gas milestone
Ansys enables 3D multiphysics visualisation
Wave Photonics launches QPICPAC Chip Packaging solution
GlobalFoundries acquires Tagore Technology’s GaN technology
Nordic Semiconductor named as one of “World’s Most Sustainable Companies”
Lattice introduces Secure Control FPGA family
EV Group tops customer rankings
scia Systems highlights advances in ion beam processing
Seica to showcase Advanced Flying Probe Test System Pilot VX
Keysight streamlines and automates Samsung's 5G Field-to-Lab Workflow
International power electronics conference comes to South Wales
INFICON launches three extensions for more efficient helium leak detection
Nordic Semiconductor launches new component reels made from recycled plastics
Better throughput and quality for high-precision laser processes
Trident IoT introduces new Zigbee Chip and SDK
TRI expands with new office in Guadalajara, Mexico
Omdia research finds weak demand leads to declining quarter for semiconductor market
BAE Systems and GlobalFoundries collaborate
Custom CMOS image sensor design on a budget
Radiation hard CMOS sensor for satellite instrument
Data centre semiconductor market sees significant growth
Ultrafast laser enables new high energy particle strike simulation technique
OTTO Digital Services for Systems
OMRON introduces VT-X850
Fujifilm completes Korea factory
Soitec extends partnership with UMC
Revenue decline for top five wafer fab equipment makers
Texas Instruments and Delta Electronics collaborate to advance electric vehicle onboard charging
NY CREATES and CEA-Leti form strategic research partnership
Providing ultra-fast, RF-synchronised tuning to multilevel pulse states
CEA-Leti launches FAMES Pilot Line
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: