+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
News Article

Ansys enables 3D multiphysics visualisation


Ansys demonstrates 3D multiphysics visualisation of electromagnetic and thermal effects in semiconductor packages at Design Automation Conference.

Ansys is adopting NVIDIA Omniverse application programming interfaces (APIs) to offer 3D-IC designers valuable insights from Ansys’ physics solver results through real-time visualisation. Ansys is ushering in the next generation of semiconductor system design to improve outcomes in applications including 5G/6G, Internet of Things (IoT), artificial intelligence (AI)/machine learning (ML), cloud computing, and autonomous vehicles.

3D-ICs, or multi-die chips, are vertically stacked assemblies of semiconductor chips. A 3D-IC’s compact form factor offers significant performance gains without increasing power consumption. However, denser 3D-ICs complicate design challenges related to electromagnetic issues and the management of heat and stress. It also makes tracing the origins of these problems more difficult. To understand the interactions between 3D-IC components for more advanced applications, 3D multiphysics visualisation becomes a requirement for effective design and diagnostics.

Ansys’ integration of NVIDIA Omniverse, a platform of APIs for developing OpenUSD- and NVIDIA RTX-enabled 3D applications and workflows, will deliver the real-time 3D-IC visualisation of results from Ansys solvers, including Ansys HFSS™, Ansys Icepak™, and Ansys RedHawk-SC™. This will help designers interact with 3D models to evaluate critical phenomena like electromagnetic fields and temperature variations. This interactive solution allows designers to optimise next-generation chips to deliver faster data rates, increased functionality, and improved reliability.

“Advanced manufacturing relies on marrying the physical world with the digital,” said Prith Banerjee, chief technology officer at Ansys. “At Ansys, we are harnessing the power of the NVIDIA Omniverse platform to comprehensively simulate and design everything — from tiny semiconductors to the expansive factories where they are produced. Ansys tools, such as RedHawk-SC, already offer visualisation features, which are integrated with Omniverse to unlock a new realm of potential”

In addition to integrating Omniverse, RedHawk-SC is now accelerated by NVIDIA Grace CPU Superchips, helping it deliver more performant multiphysics designs.

“Accelerated computing, AI physics, and physically based visualisation will drive the next era of industrial digitalisation,” said Rev Lebaredian, vice president of Omniverse and simulation technology at NVIDIA. “Ansys semiconductor solutions connected to Omniverse Cloud APIs will help accelerate the electronics ecosystem’s design and engineering processes.”

Reality AI Explorer Tier offers free AI/ML development access
AEM introduces new generation of Automated Burn-In Systems
NPUs are emerging as the main rival to Nvidia’s AI dominance, says DAI Magister
Camtek receives a $20M order from a Tier-1 OSAT
Free samples of every STMicroelectronics NPI IC available from Anglia
Major government investment to 'propel' Canada
QuickLogic announces $5.26 million contract award
ASNA and Athinia collaborate
Global sales forecast to reach record $109 billion in 2024
AMD to acquire Silo AI
Nanotronics unveils 'groundbreaking' Gen V AI Model
Aitomatic unveils SemiKong
Biden-Harris Administration reveals first CHIPS for America R&D facilities and selection processes
Collaboration to produce cutting-edge AI accelerator chips
Oxford Ionics breaks global quantum performance records
Adeia wins ECTC Award for paper on “Fine Pitch Die-to-Wafer Hybrid Bonding”
AEM introduces new generation of Automated Burn-In Systems
Sydney council forges vital semiconductor agreement
EV Group's EVG880 LayerRelease wins 2024 Best of West
Biden-Harris Administration to invest up to $1.6 billion
Cyient sets up subsidiary for semiconductor business
EMD Electronics network leaders honoured
Accenture acquires Cientra
Introducing Park FX200
Deep learning chipset market to surge to $72.8 billion by 2033
PI Innovation Award 2024: Nanobodies for Diagnostic and Therapeutic Applications
Graphcore joins Softbank Group
Kaman Measuring highlights high precision displacement sensors
Si2 reveals recipients of Annual Power of Partnerships Award
Advantest achieves ASPICE Level 2 Certification for V93000 SmarTest 8 Software
Semiconductors to become a trillion-dollar industry by 2030
Search the news archive

To close this popup you can press escape or click the close icon.
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: