Advantest to showcase latest test technology at SEMICON West
Leading semiconductor test equipment supplier Advantest will showcase its latest IC test solutions at SEMICON West 2024 on July 9-11 at the Moscone Center in San Francisco.
Advantest will highlight its broad portfolio of leading-edge test technology for applications including AI and high-performance computing (HPC), 5G, automotive and advanced memory. In addition, as one of the founding members of SEMI’s Semiconductor Climate Consortium (SCC), the company plans to promote its ESG initiatives at this year’s SEMICON West.
Product Displays
Advantest will be located at booth #1039 in the South Hall. This year’s display will feature key test solutions that enable innovation and leading-edge technology essential to our daily lives. Products include:
- NEW: The DC Scale XHC32 power supply offers 32 channels with an unprecedented total current of up to 640A and unique safety capabilities for unmatched equipment protection to optimize test of AI, HPC, and other high-current devices.
- Pin Scale Multilevel Serial that is both the first native and fully integrated HSIO instrument expanding the V93000 EXA Scale platform to address signaling requirements for advanced communication interfaces.
- HA1200, offering die test capability with active thermal control to enable at-speed 100% test coverage before the dies are assembled into 2.5D/3D packages.
- CREA’s power semiconductor test equipment for a wide variety of power devices, including SiC and GaN power testing on wafer, single-die, substrate, PKG, and module, typically used in industrial and automotive applications.
- T2000 SoC test systems with Rapid Development Kit (RDK) for all SoCs, including automotive and power analog, and IP Engine 4 test solutions for fastest image processing to reduce CIS testing time and costs.
- ACS Real-Time Data Infrastructure (ACS RTDI™), an open solutions ecosystem enabling streaming data access and real-time analytics with integrated test software and hardware monitoring and control to improve semiconductor device yield, quality, and capacity.
- Next-generation Flash/NVM test solutions, such as T5851-STM32G capable of testing and covering the latest generation of embedded protocol NAND devices with UFS/PCIe interface up to 32 Gbps and T5230 with a combined array architecture to reduce test cost for NAND/NVM wafer test, including DRAM wafer-level burn-in (WLBI).
Presentations
In addition to hosting a product display, Advantest will participate in this year’s Test Vision Symposium on July 10-11, held concurrent with SEMICON West. Advantest’s Keith Schaub will be hosting a keynote, “The Rise of AI-Enhanced Test Engineering: Transforming Challenges into Opportunities,” on Wednesday, July 10, from 9:50-10:50 a.m. In addition, Advantest will deliver multiple presentations, including:
- “Revolutionizing AI Chip Testing with AI-Driven Solutions,” by Ira Leventhal.
- “Chiplet Ecosystem Testability for HVM,” by Bob Bartlett.
- “DPD (Digital Pre-Distortion) for RF Power Amplifier Test” by Yue Chen.
Advantest’s Ken Butler will be a panelist in the session, “A Foundation for a Data Driven Future: How To Define, Adapt, and Adopt Standards To Enable a More Intelligent Test Flow and Seamless Operations.” Also, Advantest’s Adrian Kwan will be moderating the session, “RF and Power Test Innovation.”
Sponsorship
Advantest is a sponsor of the SEMI Workforce Development (WFD) programs which address the industry-wide challenge of attracting the next generation of diverse talent. Through various sessions and hands-on activities, the company will help students, young professionals and job seekers explore future career possibilities in the semiconductor industry, and assist them with resume development, job search, and interviewing techniques.
