+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

SkyWater invests in MEBL

News

Positions SkyWater’s Minnesota fab with the most advanced 200 mm lithography offering in the world.

SkyWater Technology has received from Multibeam Corp., a first-of-a-kind Multicolumn E-Beam Lithography (MEBL) system for volume production. The Multibeam (MB) platform is a landmark for the semiconductor industry, offering a high-throughput direct write patterning system that is orders of magnitude faster and more productive than conventional e-beam tools. The MB system will be available to SkyWater customers for early concept prototyping and rapid production.

“We are excited to offer new lithography capabilities to our customers enabled by Multibeam’s revolutionary technology. The deployment of the MB platform will expand capabilities and time to market for innovators on the concept-to-production journey in secure defense, biomedical, thermal imaging, high reliability and advanced compute markets.”

MEBL enables several new production capabilities for SkyWater’s customers including secure chip ID for anti-counterfeit applications and full wafer patterning to support focal plane read-out ICs and other types of large format die. MEBL also offers large depth of focus for a range of high topology microfluidic and MEMS architectures, curvilinear designs for photonics, and high-density MOS. In addition, it is the only production lithography tool capable of sub 50 nm geometries on 200 mm wafers.

Uniquely configured with multiple miniaturized electron beam columns, the MB platform elevates E-Beam Lithography (EBL) to a breakthrough maskless lithography production system with compelling performance and cost advantages for today’s IC fabs. The delivery of the first Multibeam system follows a close collaboration with SkyWater over the past two years. This partnership provided critical fab operational insights which were used to define key system performance specifications before delivery of the MB platform to SkyWater.

According to Multibeam Chairman and CEO, Dr. David K. Lam, “This is a significant milestone for Multibeam and we are immensely proud to share it with SkyWater. From the outset of our engagement with SkyWater they supported our mission to re-innovate EBL for high-volume production and provided critical user perspectives that helped us accelerate our development program and commercialize a world-class maskless lithography system. We are grateful for their collaboration and thrilled to place our first production tool in a SkyWater fab.”

SkyWater CEO and Director, Thomas Sonderman emphasized the value of this technology for customers across target growth markets, “We are excited to offer new lithography capabilities to our customers enabled by Multibeam’s revolutionary technology. The deployment of the MB platform will expand capabilities and time to market for innovators on the concept-to-production journey in secure defense, biomedical, thermal imaging, high reliability and advanced compute markets.”

Sonderman added: “Our engagement with Multibeam exemplifies the power of partnerships in developing breakthrough equipment to accelerate chip innovation in the U.S. and positions SkyWater’s Minnesota fab with the most advanced 200 mm lithography in the world.”

SkyWater will enable access to the tool for initial customer designs in 4Q24.

Development of a fully digitised biological world
SkyWater invests in MEBL
Adeia enters into hybrid bonding agreement with Hamamatsu Photonics
Biden-Harris Administration unveils preliminary terms with GlobalWafers
UK-India Technology Security Initiative launches in New Delhi
Chiplets increase performance and lower cost
Physik Instrumente opens Technology Hub in Southwest Germany
42 Technology partners with INFICON
Imec achieves record-low charge noise for Si MOS quantum dots
Infineon and Amkor sign MoU
Lattice extends Small FPGA portfolio
Nearfield Instruments secures €135 million in funding round
Experts urge EU to increase investment in photonics or risk falling behind China
Reality AI Explorer Tier offers free AI/ML development access
AEM introduces new generation of Automated Burn-In Systems
NPUs are emerging as the main rival to Nvidia’s AI dominance, says DAI Magister
Camtek receives a $20M order from a Tier-1 OSAT
Free samples of every STMicroelectronics NPI IC available from Anglia
NY CREATES and SEMI sign MoU
Major government investment to 'propel' Canada
QuickLogic announces $5.26 million contract award
ASNA and Athinia collaborate
Global sales forecast to reach record $109 billion in 2024
AMD to acquire Silo AI
Nanotronics unveils 'groundbreaking' Gen V AI Model
Aitomatic unveils SemiKong
Biden-Harris Administration reveals first CHIPS for America R&D facilities and selection processes
Collaboration to produce cutting-edge AI accelerator chips
Oxford Ionics breaks global quantum performance records
Adeia wins ECTC Award for paper on “Fine Pitch Die-to-Wafer Hybrid Bonding”
AEM introduces new generation of Automated Burn-In Systems
Sydney council forges vital semiconductor agreement
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: