Advanced packaging in Europe: Swissbit hosts EuroPAT Workshop 2024
On September 9 and 10, Berlin will become the center of the European semiconductor packaging community.
Under the umbrella of SEMI Europe, the 3rd European Packaging, Assembly, and Test-Workshop (EuroPAT-WS) will take place on both days. The event aims to promote mutual cooperation and strengthen the semiconductor packaging ecosystem in Europe. The conference will bring together experts from all areas of the semiconductor supply chain and offer the opportunity to network and exchange information. This year’s EuroPAT-WS is being hosted by Swissbit Germany AG, which invites workshop participants to take a tour of its electronics production facility on the first day of the event. Registrations for the EuroPAT-WS 2024 are now open.
The third edition of the two-day EuroPAT-WS will be held under the motto “Semiconductor Packaging Manufacturing in Europe – Growing or Vanishing?“. Key topics will include the role of European OSATs (outsourced semiconductor assembly and test providers) and SPAT-SPs (semiconductor packaging, assembly and test service providers) as well as the significance of the EU Chips Act for packaging. The workshop will highlight the strengths and weaknesses of the European markets and examine technology transfers from pilot lines in research organizations and industrial pilot lines.
“A semiconductor chip alone is not microelectronics. With the EuroPAT workshop, we are therefore focusing our attention on the increasingly important integration and comprehensive understanding of systems along the entire microelectronics supply chain. We are looking forward to two exciting days,” says Lars Lust, General Manager APATS (Advanced Packaging, Assembly & Test Solutions) at Swissbit.
Varied program with fab tour at Swissbit
The event will begin on September 9 at the Swissbit site in Berlin. In addition to a company presentation and the opportunity for attendees to network, the agenda includes a tour of Swissbit’s new electronics production facility, which opened in 2019 in an area of 20,000 square meters. The second day, which will be held at the Mercure Hotel MOA Berlin, will be dedicated to a full-day workshop with guest lectures and keynote speeches by high-ranking guests from industry and politics. A panel discussion on “The future of semiconductor packaging in Europe” will complete the program.
The EuroPAT-WS is aimed at managers from the semiconductor packaging, assembly and test industry and their supply chains. It is also aimed at those responsible for business development and corporate strategies as well as customers with a need for packaging solutions. Registration is possible at https://www.semi.org/eu/event/semi-european-packaging-assembly-and-test-workshop.
Largest semiconductor packaging event in Europe
The EuroPAT-WS 2024 takes place in the run-up to the IEEE Electronics System-Integration Technology Conference (ESTC). The ESTC is the most important international event for electronics packaging and system integration and is held every two years in Europe. The 10th edition will also take place at the Mercure Hotel MOA Berlin from September 11 to 13. Together with the EuroPAT-WS, it is the largest semiconductor packaging event in Europe with around 400 participants. More information is available at www.estc-conference.net.
