Loading...
News Article

En route towards the first German quantum computer

News

Joint project "QSolid" project reaches halfway milestone.

Together with 24 German research institutions and companies under the coordination of Forschungszentrum (FZ) Jülich, Fraunhofer IPMS is working on an integrated German quantum computer based on superconducting quantum chips and with improved error rates. Halfway through the project, the first demonstrator can now be put into operation. The CNT at Fraunhofer IPMS is contributing its expertise of state-of-the-art, industry-compatible CMOS semiconductor manufacturing.


The Center Nanoelectronic Technologies (CNT) at Fraunhofer IPMS is researching new processes and concepts for memory modules in GlobalFoundries chip technologies within several research projects on behalf of GlobalFoundries. In addition to the development of processes for the 22nm FDX® technology, the focus of the development projects that have now been launched lies on the optimization of magnetic, ferroelectric and resistive embedded data storage. An important goal is to develop scalable and energy-efficient memory solutions. This is particularly advantageous for the Internet of Things and automotive sectors. The research projects are being implemented on behalf of GlobalFoundries as part of the "Important Project of Common European Interest" (IPCEI), which is funded proportionately by Saxony and the federal government and was launched in 2023.


Quantum computers are seen as the central solution for the increasing demand for more and more computing power and larger amounts of data. However, in order to make quantum processors applicable and scalable, there are still various hurdles that need to be overcome. The error-proneness of quantum bits, or qubits for short, is currently considered one of the biggest challenges in quantum computer development. The aim of the partners is to develop a system with various quantum processors based on next-generation superconducting circuits and that has a very low error rate. This means that the qubits achieve a higher quality. The approach is world-leading and is likewise being pursued by Google, IBM and Intel.

As an overall milestone, a first prototype of the QSolid half-time demonstrator with 10 qubits, an integrated software stack and cloud user access will soon go into operation at Forschungszentrum (research center) Jülich, making it possible to test applications and benchmarks for industry standards. The project is supported by the German Federal Ministry of Education and Research (BMBF) with a total of € 76.3 million.



Achievements from semiconductor manufacturing used for quantum processors

Fraunhofer IPMS is part of the work package "Technology for Hardware Integration".Together with GlobalFoundries and Fraunhofer IZM-ASSID, it is working on the co-integration of a CMOS control logic together with the quantum processing unit (QPU) in order to reduce complex cabling and lines in the quantum computer. These complex structures could reduce the conductivity of the processor and thus make it more difficult to keep the temperature of the whole system low - especially if the number of qubits increases in future processors. To this end, an interposer technology is being developed that focuses on high-density, superconducting connections and thermal decoupling through advanced packaging. The challenge is to keep the CMOS chips usable under cryogenic conditions as the temperature of the processors needs to remain low for the qubits.


The Center Nanelectronic Technologies (CNT) utilizes its expertise and infrastructure in state-of-the-art, industry-compatible CMOS semiconductor production in the 300 mm wafer standard. This concerns, for example, manufacturing processes such as deposition and nanostructuring at wafer scale or cryo-electric characterization. “Together with our partners in Dresden, we were able to define the design for the joint CMOS and quantum chip integration as well as suitable materials regarding the temperature management. Based on this, a first generation interposer was manufactured and successfully tested under cryogenic conditions. This also included the demonstration of superconducting properties of the materials used, such as the indium-based bumps. In addition, the tests for the cryogenic characterization of the CMOS chips by GlobalFoundries were successful,” announces Marcus Wislicenus, head of Quantum Technologies at Fraunhofer IPMS.



A shared quantum computing infrastructure at FZ Jülich

The 10-qubit prototype is only an intermediate step towards higher scaling. By the end of the project in December 2026, the system is to be further developed so that it can control 30 qubits at best and with the greatest possible error correction. “Over the last two and a half years, we have built up excellent capacities and launched a system with promising performance values. While we are still integrating and controlling the final subsystems, we are already working on increasing the performance of the prototype, which is intended to handle complex computing operations for applications in industry and science,” says project coordinator Professor Frank Wilhelm-Mauch.


In order to achieve the ambitious goal of an independent quantum computer manufactured in Germany, QSolid brings together 25 research institutions companies and start-ups from all over Germany. Together, the project partners want to pave the way for commercialization and develop a demonstrator that will be available to external users via the "Jülich UNified Infrastructure for Quantum computing" (JUNIQ) and tailored to their individual needs.

Silicon photonics: accelerating growth in the race for high-speed optical interconnects
CCD-in-CMOS technology enables ultra-fast burst mode imaging
2025 6G A look forward
Critical Manufacturing climbs Deloitte’s Technology Fast 50
Semiconductors: The most important thing you probably know the least about
Imec and partners unveil SWIR sensor with lead-free quantum dot photodiodes
Lattice introduces small and mid-range FPGA offerings
SEMI and SMT inspection solutions at NEPCON Japan 2025
Nordic Semiconductor and Kigen demonstrate Remote SIM Provisioning for Massive IoT
Spirent collaborates with Siemens
Quobly forges strategic collaboration with STMicroelectronics
New standards in pressure measurement systems for the semiconductor industry
IBM delivers optics breakthrough
Semiconductor equipment sales to reach $139 Billion in 2026
Marvell introduces 1.6 Tbps LPO Chipset
ACM research strengthens Atomic Layer Deposition portfolio
CEA-Leti demonstrates embedded FeRAM platform compatible with 22nm FD-SOI node
Lattice introduces small and mid-range FPGA offerings
Solace unlocks full potential of event-driven integration
Advantest to showcase latest test solutions at SEMICON Japan 2024
CEA-Leti device integrates light sensing and modulation
Nordic launches Thingy:91 X prototyping platform for cellular IoT and Wi-Fi locationing
Imec achieves seamless InP Chiplet integration on 300mm RF Silicon Interposer
High-precision SMU
Powering India’s energy future
China’s Nvidia probe puts global investors ‘on notice’
POET Technologies appoints new director
Imec demonstrates core building blocks of a scalable, CMOS-fab compatible superconducting digital technology
Imec proposes double-row CFET for the A7 technology node
ULVAC launches new deposition system
Beebolt and SEMI Announce Strategic Partnership to Drive Supplier Resilience and Agility
esmo group introduces Automated Final Test Manipulator
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: