ACM Research receives orders for wafer-level packaging tools
ACM Research has received purchase orders for four wafer-level packaging tools, including two from a U.S.-based customer and two from a U.S.-based research and development (R&D) center.
“We are pleased to receive these strategic orders from both a U.S.-based customer and a leading U.S.-based research center,” said Dr. David Wang, ACM’s President and Chief Executive Officer. “We believe these orders demonstrate the broad range of our advanced wafer level packaging tools, reaffirm ACM’s commitment to innovation in semiconductor manufacturing, and highlight growing traction with U.S.-based customers.”
The four tools support a range of advanced packaging processes, including coating, developing, wet etching and scrubbing, and are scheduled for delivery in the first half of 2025. The orders from the U.S.-based customer are for first tools subject to technical qualification, which we expect could lead to follow-on orders for volume production. The orders from the R&D center are intended to further advance wafer-level packaging research and development and serve as a demonstration platform to showcase ACM’s technological capabilities to other prospective customers.
