Loading...
Vendor View

Xenics Expands Its Advanced Imaging Portfolio

News

Xenics, part of Exosens, announces the expansion of its advanced imaging solutions with the launch of Cheetah+ series. Designed to set a new standard in high-speed short-wave infrared (SWIR) imaging, the Cheetah+ series is tailored for the most demanding process monitoring, medical, scientific and industrial machine vision applications.

Introducing Cheetah+ series: Unmatched performance in high-speed SWIR imaging

With its combination of exceptional high-speed, high-resolution and sensitivity in a reliable InGaAs array, Cheetah+ cameras are perfectly suitable for high-speed imaging in the SWIR range. It’s suitable for a variety of demanding applications like wave front sensing for Free Space Optical communication, hyperspectral imaging and semiconductor manufacturing inspection (including in-line inspection).

The new Cheetah+ series offers frame rates of 1700 Hz with options available in OEM and CAM versions – consisting of a high-resolution 640 x 512 pixels and pixel pitch of 20 µm. It is also offered with reliable and quick data transfer using CoaXPress interface.

Expanding Capabilities in Industrial and Scientific Imaging

“Xenics has been a leading technology brand offering innovative infrared solutions for its customers in a variety of markets. Once again, we paved the way as Cheetah+ is a one-of-a-kind infrared solution with its unique features and capabilities. This advanced version of the Cheetah camera is the solution for demanding requirements of customers in machine vision and scientific applications” said Paul Ryckaert, Executive GM of Exosens Advanced Imaging Business.

Xenics Expands Its Advanced Imaging Portfolio
IDTechEx looks at sustainable helium use
Compact industrial 3kW programmable power supplies
PCIM Expo 2025 even bigger to meet growing demand for power electronics
Xiphera develops quantum-resilient hardware security solutions for space
Advantest to showcase IC test solutions at SEMICON India
ASMPT and TATA Electronics Private Limited form strategic partnership
Singapore and India sign MOU on semiconductor ecosystem partnership
The Netherlands expands export control measure for advanced semiconductor manufacturing equipment
Tech industry veteran Anders Storm named CEO of Dirac Research
Testing time in Taiwan
Electro Rent unveils large facility in Mechelen, Belgium
AEM expands system level test on AMPS Platform
Absolics turns to Solace
ACM Research receives orders for wafer-level packaging tools
En route towards the first German quantum computer
Element Six wins U.S. Department of Defense UWBGS program
ACM Research expands Fan-Out Panel-Level Packaging portfolio
Electroninks launches Copper MOD Ink
Advanced thermal control techniques to improve wafer manufacturing yield
Advances in active alignment engines for efficient photonics device test and assembly
Automation in semiconductor test processes: a key factor in modern production
ATE testing challenges of heterogeneous silicon chips with advanced packaging
Urgent orders boost wafer foundry utilisation in Q2
High performance inspection solutions at SMTAI 2024
Imec at the 50th IEEE European Solid-State Electronics Research Conference
Keysight unveils Wire Bond Inspection solution
Biden-Harris Administration reveals preliminary terms with HP
STMicroelectronics joins Quintauris as sixth shareholder
IDTechEx explores advanced semiconductor packaging
RPI and Hokkaido University sign Letter of Intent for semiconductor collaboration
KoMiCo to establish Mesa cleaning and coating facility
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: