Loading...
News Article

Intel names new representative to Si2 board

News

Intel has a new representative on the Silicon Integration Initiative board of directors.

Manoj Selva, vice president and general manager of the Intel Product Enablement Solutions Group, replaces Rahul Goyal, a 35-year Intel veteran who will retire from Intel later this year. Goyal served on the Si2 board for over 20 years, more than 10 years as chair.

Selva is responsible for leading the development and deployment of design tools, flows and methodologies to Intel's product development teams. His charter includes the delivery of design platforms for both Intel and external foundry technologies and the related design automation interaction. Selva joined Intel in 2006 and has led various teams across architecture, design TFM, platforms, and system integration validation.


SiMa.ai expands ONE Platform for Edge AI
An industry game-changer?
Intel names new representative to Si2 board
Faraday unveils advanced packaging coordinated platform for multi-source chiplets
Xenics Expands Its Advanced Imaging Portfolio
IDTechEx looks at sustainable helium use
Compact industrial 3kW programmable power supplies
PCIM Expo 2025 even bigger to meet growing demand for power electronics
Xiphera develops quantum-resilient hardware security solutions for space
Advantest to showcase IC test solutions at SEMICON India
ASMPT and TATA Electronics Private Limited form strategic partnership
Singapore and India sign MOU on semiconductor ecosystem partnership
The Netherlands expands export control measure for advanced semiconductor manufacturing equipment
Tech industry veteran Anders Storm named CEO of Dirac Research
Testing time in Taiwan
Electro Rent unveils large facility in Mechelen, Belgium
AEM expands system level test on AMPS Platform
Absolics turns to Solace
ACM Research receives orders for wafer-level packaging tools
En route towards the first German quantum computer
Element Six wins U.S. Department of Defense UWBGS program
ACM Research expands Fan-Out Panel-Level Packaging portfolio
Precision sealing for advanced semiconductor manufacturing: Greene Tweed leads the way
Electroninks launches Copper MOD Ink
Advanced thermal control techniques to improve wafer manufacturing yield
Advances in active alignment engines for efficient photonics device test and assembly
Automation in semiconductor test processes: a key factor in modern production
ATE testing challenges of heterogeneous silicon chips with advanced packaging
Urgent orders boost wafer foundry utilisation in Q2
High performance inspection solutions at SMTAI 2024
Imec at the 50th IEEE European Solid-State Electronics Research Conference
Keysight unveils Wire Bond Inspection solution
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: