Loading...
News Article

SiMa.ai expands ONE Platform for Edge AI

News

Industry’s first multi-modal, software-centric edge AI platform supports any edge AI model from CNNs to multi-modal GenAI and everything in between with scalable performance per watt.

SiMa.ai has introduced MLSoC™ Modalix, said to be the industry’s first multi-modal edge AI product family. SiMa.ai MLSoC Modalix supports CNNs, Transformers, LLMs, LMMs and Gen AI at the edge, and delivers industry leading performance – more than 10X the performance per watt of alternatives.

The rise of generative AI is changing the way humans and machines work together. The next wave of the AI technology revolution will advance multi-modal machines with the ability to understand and process multiple forms of inputs across text, image, audio and visual. This shift will ripple across every industry, from agriculture and logistics, to medicine, defense, transportation and more. SiMa.ai is the breakthrough multi-modal edge AI platform that organizations can now rely on for the ultra-responsive, power-efficient, reliable and secure insights their critical innovations demand – in any modality they prefer.

MLSoC Modalix will enable developers to push the envelope on performance with a small power envelope and physical footprint across a wide breadth of applications. They will be able to run end to end GenAI application-pipelines on just a single chip while delivering measurable contributions to business top and bottom lines.

SiMa.ai MLSoC Modalix is the second generation of the successful, commercially deployed first generation MLSoC. MLSoC Modalix is offered in 25 (Modalix 25 or “M25”), 50 (Modalix 50 or “M50”), 100 (Modalix 100 or “M100”) and 200 (Modalix 200 or “M200”) TOPS configurations, in multiple form factors, and is purpose-built to provide effortless deployment of Generative AI for the embedded edge ML market. Fully software compatible with first generation MLSoC, the MLSoC Modalix product family was designed to enable the capability to run DNNs, as well as advanced Transformer models, including LLMs, LMMs and Generative AI. Samples of MLSoC Modalix will be available to customers in Q4 of 2024.

“SiMa.ai is leading the edge AI market and building increasing momentum as customers around the world continue to adopt our (first generation) MLSoC. We are excited to introduce the MLSoC Modalix family to give customers even greater choice and flexibility to embrace multi-modal AI,” said Krishna Rangasayee, Founder and CEO at SiMa.ai. “With the introduction of MLSoC Modalix, SiMa.ai’s ONE Platform for Edge AI now provides coverage from CNNs to Gen AI and everything in between with industry leading performance and power efficiency.”

SiMa.ai Broadens ONE Platform for Edge AI with New MLSoC Modalix Family

SiMa.ai ONE Platform for Edge AI is a software-centric framework offering compatibility across the entire MLSoC platform family to provide a seamless experience for upgrades, transitions and mix-and-match, minimizing TCO for adopters of SiMa.ai at the edge.

First generation SiMa.ai MLSoC is a market leader in performance and power efficiency, validated most recently by MLCommons® MLPerf Inference benchmark (4.0) results in March 2024. First generation SiMa.ai MLSoC will continue to support CNN-based models across Industrial Inspection, Retail, Aerospace and Defense, and Smart Vision (Ethernet-based cameras only).

Customers leveraging MLSoC Modalix will be able to accelerate deep learning, transformer, and Generative AI models - pushing the envelope on models like Llama2 7B to beyond 10 tokens per second. With an on-chip application processor, integrated ISP, vision and digital signal processors, and innovations like BF16 in the hardware, MLSoC Modalix will accelerate all known CNN and transformer models: language, vision and speech, delivering inference-accuracy close to fp32 at significantly lower cost and power.

Generative AI applications running on MLSoC Modalix will:

• Benefit from the SiMa.ai Palette software patented Compiler with layered direct proactive data prefetch, ensuring each data layer is always available, on time, when it is needed;

• Leverage the improved Machine Learning Accelerator to run DNNs and Large Multi-Modal Models at high performance without sacrificing power.

In addition new hardware components of MLSoC Modalix include:

• An integrated ISP module supporting 4 x 4 lanes of MIPI CSI 2, allowing the chip to interface with MIPI cameras as well as Ethernet-based cameras via 4 x 10G Ethernet ports on-chip;

• Eight lanes of PCIe Gen 5 facilitating quicker ingress and egress of data to and from the chip;

• 8 Arm® Cortex®-A65 dual-threaded CPUs, further extending SiMa.ai’s reach to customers with specialized use cases through Arm’s unrivaled and diverse software partner ecosystem;

• TSMC’s N6 technology.

SiMa.ai expands ONE Platform for Edge AI
An industry game-changer?
Intel names new representative to Si2 board
Faraday unveils advanced packaging coordinated platform for multi-source chiplets
Xenics Expands Its Advanced Imaging Portfolio
IDTechEx looks at sustainable helium use
Compact industrial 3kW programmable power supplies
PCIM Expo 2025 even bigger to meet growing demand for power electronics
Xiphera develops quantum-resilient hardware security solutions for space
Advantest to showcase IC test solutions at SEMICON India
ASMPT and TATA Electronics Private Limited form strategic partnership
Singapore and India sign MOU on semiconductor ecosystem partnership
The Netherlands expands export control measure for advanced semiconductor manufacturing equipment
Tech industry veteran Anders Storm named CEO of Dirac Research
Testing time in Taiwan
Electro Rent unveils large facility in Mechelen, Belgium
AEM expands system level test on AMPS Platform
Absolics turns to Solace
ACM Research receives orders for wafer-level packaging tools
En route towards the first German quantum computer
Element Six wins U.S. Department of Defense UWBGS program
ACM Research expands Fan-Out Panel-Level Packaging portfolio
Precision sealing for advanced semiconductor manufacturing: Greene Tweed leads the way
Electroninks launches Copper MOD Ink
Advanced thermal control techniques to improve wafer manufacturing yield
Advances in active alignment engines for efficient photonics device test and assembly
Automation in semiconductor test processes: a key factor in modern production
ATE testing challenges of heterogeneous silicon chips with advanced packaging
Urgent orders boost wafer foundry utilisation in Q2
High performance inspection solutions at SMTAI 2024
Imec at the 50th IEEE European Solid-State Electronics Research Conference
Keysight unveils Wire Bond Inspection solution
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: