Loading...
News Article

Greene Tweed welcomes Adam Phan as General Manager, Sealing Systems

News

Greene Tweed has appointed Adam Phan as the company’s new General Manager of Sealing Systems.

Phan brings more than two decades of extensive cross-functional leadership and industry experience in aerospace and defense to his new position. As General Manager, he will guide the Sealing Systems business and product management strategies, technology development, and operational footprint to deliver high-performance sealing solutions for the industry’s most demanding environments and critical applications.


“We are thrilled to bring Adam Phan on board as Greene Tweed’s new General Manager of Sealing Systems,” says President and CEO Magen Buterbaugh. “Adam’s proven record of strategic planning, product management excellence, and talent development speaks for itself. His leadership will be invaluable to the business as we strengthen our ability to meet the evolving needs of our customers through new product capabilities and innovation.”


Most recently, Phan served as Vice President and General Manager of Space, Aerospace, and Defense at Fralock, a solutions provider of engineered components, where he drove business operations to achieve record revenue and market share growth. Previously, he held senior strategic roles elsewhere in the aerospace and defense industry, consistently delivering outstanding performance and value in competitive manufacturing and technical product markets. Phan holds BS degrees in Engineering Physics and Chemistry from Hope College, as well as an MBA in International Business from Wayne State University.

Aeluma wins $11.717 million DARPA contract
EnSilica joins TSMC Design Center Alliance
Greene Tweed welcomes Adam Phan as General Manager, Sealing Systems
Support for semiconductor firms to grow, powering growth in £10bn UK industry
Advantest Wins 2024 Supplier of the Year Award from Qualcomm
Intel awarded up to $3B for Secure Enclave
Valens Semiconductor celebrates automotive design wins
Benchmark celebrates Penang, Malaysia opening
TRI releases Core Features 3D AOI solution
Industry plans to invest $400 billion in 300mm fab equipment
Polymatech and ECM Group forge strategic JV
Building success with sustainable semiconductor waste
US Department of Commerce awards semiconductor grants
Tokyo Electron and TATA Electronics Private form strategic partnership
Carbon dioxide capture success
SEMI and IESA join to strengthen semiconductor ecosystem at SEMICON India 2024
Keysight Technologies to acquire Optical Solutions Group from Synopsys
Optogenetic OLED-on-CMOS stimulators for neurosensory therapies
Discover innovative inspection solutions at electronica 2024
OptiMOS 6 135 V and 150 V MOSFETs enable higher efficiency in drives and SMPS applications
Infineon and Oxford Ionics awarded contract to build a mobile quantum computer
Mouser Electronics and Altium team up
Tech companies forge commercial links at SEMICON Taiwan
North Carolina State University orders Ion Beam Etching Equipment
TD Shepherd joins Silicon Catalyst
Physik Instrumente aims to triple capacity
Chiplet Summit 2024 shows how advanced packaging keeps Moore’s Law alive
Infineon introduces the XENSIV PAS CO2 5V sensor
SiMa.ai expands ONE Platform for Edge AI
An industry game-changer?
Intel names new representative to Si2 board
Faraday unveils advanced packaging coordinated platform for multi-source chiplets
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: