Loading...
News Article

UTEP establishes collaboration with DoD and NSA

News

The University of Texas at El Paso has revealed new collaborations with the Department of Defense (DoD) and the National Security Agency (NSA) that support research and training to strengthen the nation’s leadership in semiconductor, or microchips, technology.

NSA, the signals intelligence and cybersecurity agency for the United States, also recently named UTEP as an NSA Center of Academic Excellence in Cybersecurity Research, making UTEP one of only 11 universities nationwide to hold all three NSA Center of Excellence designations in Cybersecurity Defense, Cybersecurity Operations and Cybersecurity Research.

“We are deepening our relationship with the nation’s premier cybersecurity agency,” said UTEP President Heather Wilson. “In both computer science and electrical and computer engineering, UTEP conducts exceptional research and develops talented students. We will build on this.”

Under the Office of the Under Secretary of Defense for Research and Engineering (OUSD(R&E)) Trusted and Assured Microelectronics (T&AM) program’s Scalable Asymmetric Lifecycle Engagement (SCALE) initiative, UTEP students and faculty are undertaking DoD-relevant microelectronics research in the fields of physics, engineering, materials science and cybersecurity. The University’s SCALE participation seeks to enhance the education and experience of students and equip them upon graduation to meet the needs of the defense industry’s microelectronics workforce.

“The DoD and NSA require a semiconductor-savvy workforce who can pair expertise in microelectronics design and manufacturing with right-sized cybersecurity protections,” said Meredith Dyck, Ph.D., chief strategist for microelectronics at NSA. “By collaborating with UTEP, we aim to create a pipeline of exceptional graduates who are poised to tackle the most challenging national security problems. Today’s event is a significant step in the right direction.”

UTEP semiconductor research will begin with a focus on making 3D printed microchips capable of higher performance at a reduced cost.

“A big trend in the industry is, how do we pack more and more capabilities onto one chip? Can we combine more complicated parts into a single package to make things faster, better, and cheaper?” said Robert C. Roberts, Ph.D., assistant professor in the Department of Electrical and Computer Engineering at UTEP. “This is a pivotal research area in the semiconductor technology industry.”

Salamah Salamah, Ph.D., professor and chair of the UTEP Computer Science Department explained that the new NSA cybersecurity research designation recognizes the quality of the University’s doctoral program in computer science, which has existed since 2005. The cyber defense and cyber operations designations recognize the rigor of undergraduate programs in computer science, which prepare students with the skills needed to protect networks against cyberattacks and to gain a decisive advantage for the nation through cyber operations in support of national security.

“This new designation solidifies UTEP’s standing as a leader in cybersecurity education and research throughout the nation,” he added. “We are preparing graduates who contribute to the workforce in areas of great significance to the nation’s defense and global economic standing and creating new knowledge that can make our cyber infrastructure more secure.”

SONOTEC presents Compact Flow Meter Series at ICPT Conference
SIAE MICROELETTRONICA selects EnSilica
Veeco Instruments reduces critical shortages by 50% with LeanDNA
Central State University to spearhead semiconductor research
UTEP establishes collaboration with DoD and NSA
Purdue receives grant funding in all three areas of NSF semiconductor research program
POET and Mitsubishi Electric collaborate
Critical Manufacturing welcomes Jeff Winter as head of business strategy
Fraunhofer IPMS bids farewell to its long-standing institute director
Sivers Semiconductors receives CHIPS Act funding
Aeluma wins $11.717 million DARPA contract
EnSilica joins TSMC Design Center Alliance
Greene Tweed welcomes Adam Phan as General Manager, Sealing Systems
Support for semiconductor firms to grow, powering growth in £10bn UK industry
Advantest Wins 2024 Supplier of the Year Award from Qualcomm
Intel awarded up to $3B for Secure Enclave
Valens Semiconductor celebrates automotive design wins
Benchmark celebrates Penang, Malaysia opening
TRI releases Core Features 3D AOI solution
Industry plans to invest $400 billion in 300mm fab equipment
Polymatech and ECM Group forge strategic JV
Building success with sustainable semiconductor waste
US Department of Commerce awards semiconductor grants
Tokyo Electron and TATA Electronics Private form strategic partnership
Carbon dioxide capture success
SEMI and IESA join to strengthen semiconductor ecosystem at SEMICON India 2024
Keysight Technologies to acquire Optical Solutions Group from Synopsys
Optogenetic OLED-on-CMOS stimulators for neurosensory therapies
Discover innovative inspection solutions at electronica 2024
OptiMOS 6 135 V and 150 V MOSFETs enable higher efficiency in drives and SMPS applications
Infineon and Oxford Ionics awarded contract to build a mobile quantum computer
Mouser Electronics and Altium team up
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: