ZEISS Microscopy showcases AI-powered failure analysis
ZEISS announces involvement at 50th Annual ISTFA Conference.
ZEISS announces its full schedule of activities at the 50th annual ISTFA Conference, taking place at the Hilton San Diego Bayfront Hotel, Oct. 28-Nov. 1, 2024. ZEISS will deliver four tutorials and six paper presentations showcasing its expertise in artificial intelligence (AI)-powered fault isolation, failure analysis (FA) and yield enhancement. ZEISS will also participate in two panel discussions about the industry roadmap and AI and will be part of the Tools of the Trade tour.
ZEISS will be located at Booth #601 on the ISTFA show floor discussing new solutions for analysis and preparation using the ZEISS Crossbeam 550 FIB-SEM and the new flagship 3D X-ray microscope, ZEISS VersaXRM 730. An in-booth virtual demonstration of the VersaXRM 730 will show its unparalleled 450 nanometer (nm) resolution imaging and ZEN navx™ automated user guidance and control system for streamlined workflows, optimized image quality and high throughput.
“We’re excited to participate in ISTFA again this year, as an exhibitor, strategic panelist, presenter and lead sponsor of the show. This year is especially important as ISTFA celebrates its 50th anniversary and focuses on the timely theme of AI,” said Dr. Thomas Rodgers, head of business sector electronics at ZEISS Microscopy. “To extend the capability of non-destructive imaging with higher throughput and resolution, ZEISS was the first in the industry to implement AI-powered reconstruction solutions for 3D XRM. Our DeepRecon Pro enables higher image quality and greater than 4x faster data acquisition than the industry standard. We look forward to sharing our AI knowledge via demos and presentations at the show.”
