Loading...
News Article

SEMIFIVE concludes HyperAccel contract

News

Collaboration on design and development using 4nm process technology, with mass production targeted for Q1 2026.

SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, has announced the conclusion of a contract with HyperAccel to develop a generative AI chip, Bertha, for mass production. Bertha will be developed using 4nm process technology, and the mass production is targeted to commence in the first quarter of 2026.


HyperAccel has developed a LLM Processing Unit (LPU), an AI chip specifically designed for transformer-based Large Language Model (LLM). This is the world's first semiconductor LPU tailored for LLM inference, offering low cost, low latency, and domain-specific features. It is expected to replace existing high-cost and low-efficiency Graphics Processing Units (GPUs) with performance improvements of up to 2 times and a price/performance ratio that is 19 times better than that of a typical supercomputer.


SEMIFIVE specializes in SoC platforms and ASIC design solutions. The company focuses on developing expert SoC design platforms for AI chips these days with plans to expand its roadmap to respond to customer demand for AI custom silicon. To achieve this goal, SEMIFIVE is actively developing its SoC chiplet platform in collaboration with industry-leading partners.


"We are delighted to work with SEMIFIVE, a leading provider of SoC platforms and comprehensive ASIC design solutions, for the development of Bertha to be mass-produced," said Joo-Young Kim, CEO of HyperAccel. "By collaborating with SEMIFIVE , we are excited to offer customers AI semiconductors that provide more cost-effective and power-efficient LLM features than GPU platforms. This advancement will significantly reduce the operational expenses of data centers and expand our business scope to other industries that require LLMs."


"HyperAccel is a company with the most efficient and scalable LPU technology for LLMs. As the demand for LLM computation is skyrocketing, HyperAccel has the potential to become a new powerhouse in the global processor infrastructure," said Brandon Cho, CEO and co-founder of SEMIFIVE. "We are extremely excited to be the production partner for HyperAccel's groundbreaking Bertha chip, and we are thrilled to contribute to yet another innovative success story built on the SEMIFIVE platform."

Accelerating semiconductor designs for AI applications
Heidelberg Instruments launches nanolithography tool
SEMIFIVE concludes HyperAccel contract
Nova Prism 2 selected by logic manufacturer
Baya Systems expands through partnership with IPro Silicon IP
SensiML and Efabless partner
How to bring photonic chips to the market faster?
Pfeiffer Vacuum becomes Pfeiffer Vacuum+Fab Solutions
Infineon combines silicon and silicon carbide in an e-mobility power module
Jacobs awarded CG Semi contract
Klika Tech joins Nordic Semiconductor Partner Program
Experts warn UK semiconductor firms are at risk from global trade war
Seoul Semiconductor illuminates its wired and wireless networking experience
Amkor and TSMC to expand partnership
Visualisation first for UC Santa Barbara
Plurilock achieves US$1.7 million cybersecurity sale
SIAE MICROELETTRONICA selects EnSilica
Mitsubishi Electric begins supplying power semiconductor chips
Advanced Energy announces STEM Scholarships for 2025-2026 academic year
Electronic System Design industry posts $4.7 billion in revenue
Survey predicts photomask growth
Shaping tomorrow's semiconductor industry
Terecircuits unveils new bonding material
Busch Group promotes Vacuum Technology and Gas Abatement solutions
Photonics key to limitless clean energy
PhotonDelta launches €50,000 global photonics engineering contest
ZEISS Microscopy showcases AI-powered failure analysis
New generation of photodiodes from X-FAB
imec accelerates Automotive Chiplet Program
Accelerating clean energy adoption in Singapore’s semiconductor industry
Advantest announces Call for Papers for VOICE 2025 Developer Conference
SEMICON Europa 2024 to spotlight innovation and collaboration
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: