Loading...
News Article

SEMIFIVE concludes HyperAccel contract

News

Collaboration on design and development using 4nm process technology, with mass production targeted for Q1 2026.

SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, has announced the conclusion of a contract with HyperAccel to develop a generative AI chip, Bertha, for mass production. Bertha will be developed using 4nm process technology, and the mass production is targeted to commence in the first quarter of 2026.


HyperAccel has developed a LLM Processing Unit (LPU), an AI chip specifically designed for transformer-based Large Language Model (LLM). This is the world's first semiconductor LPU tailored for LLM inference, offering low cost, low latency, and domain-specific features. It is expected to replace existing high-cost and low-efficiency Graphics Processing Units (GPUs) with performance improvements of up to 2 times and a price/performance ratio that is 19 times better than that of a typical supercomputer.


SEMIFIVE specializes in SoC platforms and ASIC design solutions. The company focuses on developing expert SoC design platforms for AI chips these days with plans to expand its roadmap to respond to customer demand for AI custom silicon. To achieve this goal, SEMIFIVE is actively developing its SoC chiplet platform in collaboration with industry-leading partners.


"We are delighted to work with SEMIFIVE, a leading provider of SoC platforms and comprehensive ASIC design solutions, for the development of Bertha to be mass-produced," said Joo-Young Kim, CEO of HyperAccel. "By collaborating with SEMIFIVE , we are excited to offer customers AI semiconductors that provide more cost-effective and power-efficient LLM features than GPU platforms. This advancement will significantly reduce the operational expenses of data centers and expand our business scope to other industries that require LLMs."


"HyperAccel is a company with the most efficient and scalable LPU technology for LLMs. As the demand for LLM computation is skyrocketing, HyperAccel has the potential to become a new powerhouse in the global processor infrastructure," said Brandon Cho, CEO and co-founder of SEMIFIVE. "We are extremely excited to be the production partner for HyperAccel's groundbreaking Bertha chip, and we are thrilled to contribute to yet another innovative success story built on the SEMIFIVE platform."

Silicon photonics: accelerating growth in the race for high-speed optical interconnects
CCD-in-CMOS technology enables ultra-fast burst mode imaging
2025 6G A look forward
Critical Manufacturing climbs Deloitte’s Technology Fast 50
Semiconductors: The most important thing you probably know the least about
Imec and partners unveil SWIR sensor with lead-free quantum dot photodiodes
Lattice introduces small and mid-range FPGA offerings
SEMI and SMT inspection solutions at NEPCON Japan 2025
Nordic Semiconductor and Kigen demonstrate Remote SIM Provisioning for Massive IoT
Spirent collaborates with Siemens
Quobly forges strategic collaboration with STMicroelectronics
New standards in pressure measurement systems for the semiconductor industry
IBM delivers optics breakthrough
Semiconductor equipment sales to reach $139 Billion in 2026
Marvell introduces 1.6 Tbps LPO Chipset
ACM research strengthens Atomic Layer Deposition portfolio
CEA-Leti demonstrates embedded FeRAM platform compatible with 22nm FD-SOI node
Lattice introduces small and mid-range FPGA offerings
Solace unlocks full potential of event-driven integration
Advantest to showcase latest test solutions at SEMICON Japan 2024
CEA-Leti device integrates light sensing and modulation
Nordic launches Thingy:91 X prototyping platform for cellular IoT and Wi-Fi locationing
Imec achieves seamless InP Chiplet integration on 300mm RF Silicon Interposer
High-precision SMU
Powering India’s energy future
China’s Nvidia probe puts global investors ‘on notice’
POET Technologies appoints new director
Imec demonstrates core building blocks of a scalable, CMOS-fab compatible superconducting digital technology
Imec proposes double-row CFET for the A7 technology node
ULVAC launches new deposition system
Beebolt and SEMI Announce Strategic Partnership to Drive Supplier Resilience and Agility
esmo group introduces Automated Final Test Manipulator
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: