Global silicon wafer shipments to remain soft in 2024
Strong expected rebound in 2025, SEMI reports.
Global shipments of silicon wafers are projected to decline 2% in 2024 to 12,174 million square inches (MSI) with a strong rebound of 10% delayed until 2025 to reach 13,328 MSI as wafer demand continues to recover from the downcycle, SEMI has reported in its annual silicon shipment forecast.
Strong silicon wafer shipment growth is expected to continue through 2027 to meet increasing demand related to AI and advanced processing, driving improved fab utilization rate for global semiconductor production capacity. Moreover, new applications in advanced packaging and high-bandwidth memory (HBM) production, which require additional wafers, are contributing to the rising need for silicon wafers. Such applications include temporary or permanent carrier wafers, interposers, device separation into chiplets, and memory/logic array separation.
Silicon wafers are the fundamental building material for the majority of semiconductors, which are vital components of all electronic devices. The highly engineered thin disks, produced in diameters of up to 300 mm, serve as the substrate material on which most semiconductor devices, or chips, are fabricated.
