Loading...
News Article

JST names Dr. Ismail Kashkoush as Chief Technology Officer

News

Dr. Kashkoush is a proven technology leader with decades of experience in process engineering, leading JST’s next chapter in product development.

JST Manufacturing has appointed Dr. Ismail Kashkoush as Chief Technology Officer. Bringing over 30 years of engineering and industry expertise, Dr. Kashkoush will lead JST’s engineering, technology, and product line teams in the development of JST’s surface preparation products and processes.


In his role, he will oversee the development and strategy for JST’s engineering teams in driving product advancement to support profitable growth. He’ll also introduce the company’s products and technology globally and maintain the technology roadmap to support company growth objectives for all surface preparation and technology nodes requirements. Dr. Kashkoush will work with partners to lead new technology advancements and guide next-generation technologies that JST will bring to customers.

“Ismail brings a wealth of expertise, a fresh perspective, and a transformative vision to our technology teams. As we amplify our commitment to technology innovation, Ismail will help us focus on delivering groundbreaking solutions to our clients, partners, and key stakeholders, said Ryan Zrno, CEO of JST.


Previously, Dr. Kashkoush was the Chief Technology Officer for Akrion Technologies Inc. He maintained the company’s technology roadmap to support company growth objectives for all FEOL/BEOL processes. In addition to his patent portfolio, Dr. Kashkoush has many technical publications and conducted regular seminars on wafer surface preparation technology for the IC, MEMS, FPD, and PV sectors. Dr. Kashkoush earned a Ph.D. in Engineering Sciences from Clarkson University in 1993.


“I’ve spent my career understanding the technical challenges often plaguing customers within the wet processing space and look forward to bolstering innovative product and technology development during this pivotal time in JST’s growth, showcasing JST’s ability to address wide-ranging customer requirements with flexible technologies and top-notch service,” said Dr. Ismail Kashkoush, CTO of JST.


Dr. Kashkoush joins at a crucial time for JST as the company witnesses growth in single-wafer processing and batch processing across both silicon and compound semiconductor markets for key target applications including MEMS and sensors, optoelectronics, lasers, LEDs, and photodiodes. The rapid acceleration of artificial intelligence, internet of things, 5G and other emerging technologies will require accelerated development of advanced cleaning technologies to support the manufacturing of smaller, complex semiconductor devices.

JST names Dr. Ismail Kashkoush as Chief Technology Officer
DuPont earns Best Partner Award for Innovation from Samsung Electronics
Advantest to showcase latest semiconductor test solutions
Infineon introduces DEEPCRAFT brand for Edge AI software solutions
Leading university selects Veeco system
Global Wafer Fab Equipment revenue poised to surge
New educational initiative for the German chip industry
ZEISS launches Crossbeam 550 Samplefab FIB-SEM
Critical Manufacturing brings highly advanced MES solution to SEMICON Europa
Infineon at electronica 2024: Solutions for decarbonisation and digitalisation
Infineon unveils 'world’s thinnest' silicon power wafer
Sunlit Chemical expands global reach with US facility opening in Phoenix
Semiconductor patent applications up 22% globally to 81,000 a year
Promoting collaboration and novel IC design technologies
EV Group announces board expansion In light of unabated growth
MIT team takes a major step toward fully 3D-printed active electronics
TSMC recognises Ansys
Quantum foundry nears completion
Global silicon wafer shipments to remain soft in 2024
DELO introduces UV-approach for fan-out wafer-level packaging
New 10-point guide to humidity control in cleanrooms
High memory bandwidth in the spotlight
Improved materials for microchip interconnections
SEMICON Europa 2024 to explore innovations in Advanced Packaging and Fab Management
SEMIExpo Vietnam 2024 heralds Vietnam’s position as 'dynamic new player'
Next Gen 3D X-Ray Inspection for Advanced Packaging: To see better. Faster. More.
New strategic collaboration between FRAMOS and NXP Semiconductors
Splitting hairs to ten to the power of four
TANAKA introduces “TK-SK” Palladium alloy for test equipment
Rebellions collaborates on next-gen AI computing chiplet technology
Semiconductor giants add $2.7 trillion to their stock values
Test early and test often
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: