Loading...
News Article

James Culp of GlobalFoundries joins Si2 Board

News

The Silicon Integration Initiative has added James Culp, a GlobalFoundries corporate fellow, to its board of directors. He replaces Richard Trihy, who served on the Si2 board for eight years.

Culp, who currently leads the GlobalFoundries CAD and design methodology teams, has more than 30 years of semiconductor industry and military experience. His teams are responsible for deploying 3Di design kits for RF/AMS applications utilized in next-generation consumer and A&D applications.

Culp is IBM Master inventor and a Si2 Distinguished Service Award recipient. His expertise also includes parametric yield modeling, DTCO/STCO application development and AI-based design methodologies.

James Culp of GlobalFoundries joins Si2 Board
Infineon presents new ASIL-D-compliant 3-phase gate driver IC
JST names Dr. Ismail Kashkoush as Chief Technology Officer
DuPont earns Best Partner Award for Innovation from Samsung Electronics
Advantest to showcase latest semiconductor test solutions
Infineon introduces DEEPCRAFT brand for Edge AI software solutions
Leading university selects Veeco system
Global Wafer Fab Equipment revenue poised to surge
New educational initiative for the German chip industry
ZEISS launches Crossbeam 550 Samplefab FIB-SEM
Critical Manufacturing brings highly advanced MES solution to SEMICON Europa
Infineon at electronica 2024: Solutions for decarbonisation and digitalisation
Infineon unveils 'world’s thinnest' silicon power wafer
Sunlit Chemical expands global reach with US facility opening in Phoenix
Semiconductor patent applications up 22% globally to 81,000 a year
Promoting collaboration and novel IC design technologies
EV Group announces board expansion In light of unabated growth
MIT team takes a major step toward fully 3D-printed active electronics
TSMC recognises Ansys
Quantum foundry nears completion
Global silicon wafer shipments to remain soft in 2024
DELO introduces UV-approach for fan-out wafer-level packaging
New 10-point guide to humidity control in cleanrooms
High memory bandwidth in the spotlight
Improved materials for microchip interconnections
SEMICON Europa 2024 to explore innovations in Advanced Packaging and Fab Management
SEMIExpo Vietnam 2024 heralds Vietnam’s position as 'dynamic new player'
Next Gen 3D X-Ray Inspection for Advanced Packaging: To see better. Faster. More.
New strategic collaboration between FRAMOS and NXP Semiconductors
Splitting hairs to ten to the power of four
TANAKA introduces “TK-SK” Palladium alloy for test equipment
Rebellions collaborates on next-gen AI computing chiplet technology
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: