Loading...
News Article

Keysight enables Samsung Electronics

News

Test performed with Keysight’s ultra-wideband testing solution using Samsung's U100 chipset - ensures the robustness and security of the ultra-wideband devices.

Keysight Technologies, Inc. has enabled Samsung Electronics to validate FiRa ® 2.0 secure test cases on its Exynos Connect U100 chipset. This was achieved using Keysight’s Ultra-Wideband (UWB) test solution, which meets the requirements needed for physical layer conformance testing.

UWB is a low-energy radio technology used for short-range and high-bandwidth communications over a wide spectrum. In dense and challenging environments, it provides better precision, reliability, security, and power consumption performance than other communication technologies. UWB devices must be designed to ensure that they are secure from physical layer attacks. The FiRa 2.0 test specification introduces test cases to check the robustness of products against certain PHY layer attack scenarios.

To enable device manufacturers to meet the stringent testing requirements for UWB devices, Keysight integrated the secure-ranging test cases defined by FiRa 2.0 in its solution. With this tool, Samsung can perform fully automated secure-ranging test scenarios on its U100 chipset.

Key benefits of the UWB test solution include:

Enhanced Radio frequency (RF) performance: ensures optimal RF performance of the UWB device.

Precise Positioning: automated time of flight (ToF) and angle of arrival (AoA) tests to enhance and secure UWB device positioning for improved performance and accuracy.

Improved reliability and security: ensures conformity and security of the UWB device utilising automated FiRa PHY layer conformance tests against the FiRa 2.0 Technical and Test Specifications, covering the secure ranging test scenarios.

Acceleration of UWB device manufacturing: speeds up RF validation on the production line, increasing productivity.

Supports future UWB solutions: support for the next generation of UWB technology (802.15.4ab) ensures long-term compatibility.

Joonsuk Kim, Executive Vice President of the Connectivity Development Team, Samsung Electronics Representative, said: "We are excited to partner with Keysight in our joint commitment to verifying secure ranging test cases for UWB, a critical pillar of ranging applications. The FiRa 2.0 Secure Ranging features mark a significant advancement in maintaining the growth momentum of the UWB ecosystem, and we believe our continued collaboration will ensure an optimised user experience."

Clint Chaplin, Board Chair of FiRa Consortium, said: “Ensuring robust security and reliable performance is critical for ultra-wideband technology’s continued adoption and success. This collaboration underscores the commitment of both companies to deliver state-of-the-art solutions that meet the FiRa Consortium’s rigorous standards and pave the way for future innovations in UWB technology.”

Peng Cao, Vice President and General Manager of Keysight's Wireless Test group, said: “Ultra-wideband technology is rapidly emerging as a transformative force, and security is essential for its effective implementation. Secure-ranging test cases contribute to the UWB ecosystem's advancement into markets with higher security requirements. Keysight is committed to offering cutting-edge test solutions that ensure our customers’ devices meet FiRa 2.0 test specifications and interoperability standards.”

Silicon photonics: accelerating growth in the race for high-speed optical interconnects
CCD-in-CMOS technology enables ultra-fast burst mode imaging
2025 6G A look forward
Critical Manufacturing climbs Deloitte’s Technology Fast 50
Semiconductors: The most important thing you probably know the least about
Imec and partners unveil SWIR sensor with lead-free quantum dot photodiodes
Lattice introduces small and mid-range FPGA offerings
SEMI and SMT inspection solutions at NEPCON Japan 2025
Nordic Semiconductor and Kigen demonstrate Remote SIM Provisioning for Massive IoT
Spirent collaborates with Siemens
Quobly forges strategic collaboration with STMicroelectronics
New standards in pressure measurement systems for the semiconductor industry
IBM delivers optics breakthrough
Semiconductor equipment sales to reach $139 Billion in 2026
Marvell introduces 1.6 Tbps LPO Chipset
ACM research strengthens Atomic Layer Deposition portfolio
CEA-Leti demonstrates embedded FeRAM platform compatible with 22nm FD-SOI node
Lattice introduces small and mid-range FPGA offerings
Solace unlocks full potential of event-driven integration
Advantest to showcase latest test solutions at SEMICON Japan 2024
CEA-Leti device integrates light sensing and modulation
Nordic launches Thingy:91 X prototyping platform for cellular IoT and Wi-Fi locationing
Imec achieves seamless InP Chiplet integration on 300mm RF Silicon Interposer
High-precision SMU
Powering India’s energy future
China’s Nvidia probe puts global investors ‘on notice’
POET Technologies appoints new director
Imec demonstrates core building blocks of a scalable, CMOS-fab compatible superconducting digital technology
Imec proposes double-row CFET for the A7 technology node
ULVAC launches new deposition system
Beebolt and SEMI Announce Strategic Partnership to Drive Supplier Resilience and Agility
esmo group introduces Automated Final Test Manipulator
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: