Loading...
News Article

ROHM develops low ON-resistance, high-power MOSFETs

News

ROHM has developed N-channel power MOSFETs featuring 'industry-leading' low ON-resistance and wide SOA capability. They are designed for power supplies inside high-performance enterprise and AI servers.

The advancement of high-level data processing technologies and the acceleration of digital transformation have increased the demand for data center servers. At the same time, the number of servers equipped with advanced computing capabilities for AI processing is on the rise and is expected to continue to grow. These servers operate 24 hours a day, 7 days a week – ensuring continuous operation. As a result, conduction losses caused by the ON-resistance of multiple MOSFETs in the power block have a significant impact on system performance and energy efficiency. This becomes particularly evident in AC-DC conversion circuits, where conduction losses make up a substantial portion of total power loss – driving the need for low ON-resistance MOSFETs.


Additionally, servers equipped with a standard hot-swap function, which allow for the replacement and maintenance of internal boards and storage devices while powered ON, experience a high inrush current during component exchanges. Therefore, to protect server components and MOSFETs from damage, a wide Safe Operating Area (SOA) tolerance is essential.


To address these challenges, ROHM has developed its new DFN5060-8S package that supports the packaging of a larger die compared to conventional designs, resulting in a lineup of power MOSFETs that achieve industry-leading low ON-resistance along with wide SOA capability. These new products significantly contribute to improving efficiency and enhancing reliability in server power circuits.


The new lineup includes three products. The RS7E200BG (30V) is optimized for both secondary-side AC-DC conversion circuits and hot-swap controller (HSC) circuits in 12V power supplies used in high-performance enterprise servers. The RS7N200BH (80V) and RS7N160BH (80V) are ideal for secondary AC-DC conversion circuits in 48V AI server power supplies.


All three models feature the newly developed DFN5060-8S package (5.0mm × 6.0mm). The package increases the internal die size area by approximately 65% compared to the conventional HSOP8 package (5.0mm × 6.0mm). As a result, the RS7E200BG (30V) and RS7N200BH (80V) achieve ON-resistances of 0.53mΩ and 1.7mΩ (at VGS = 10V), respectively – both of which rank among the best in the industry in the 5.0mm × 6.0mm class, significantly contributing to higher efficiency in server power circuits.


Moreover, ROHM has optimized the internal clip design to enhance heat dissipation, further improving SOA tolerance, which contributes to ensuring application reliability. Notably, the RS7E200BG (30V) achieves an SOA tolerance of over 70A at a pulse width of 1ms and VDS = 12V, which is twice that of the conventional HSOP8 package MOSFETs under the same conditions, ensuring industry-leading SOA performance in a 5.0mm × 6.0mm footprint.


Going forward, ROHM plans to gradually begin mass production of power MOSFETs compatible with hot-swap controller circuits for AI servers in 2025, continuing to expand its lineup that contributes to greater efficiency and reliability across a wide range of applications.

CE3S introduces Millice StripAid X Series
IDTechEx explores emerging applications for PICs
Miniature hexapod designed for demanding applications
ACM Research receives 2025 3D InCites Technology Enablement Award
ROHM develops low ON-resistance, high-power MOSFETs
Exploring packaging technologies
AI tops tech growth charts
Hailo selects Avnet ASIC as Channel partner for TSMC silicon production
Innatera appoints Intralink to bring brain-inspired AI to Asia
ABLIC strengthens semiconductor portfolio
Infineon bolsters global lead in automotive semiconductors
Infineon to acquire Marvell’s Automotive Ethernet business
Ansys semiconductor solutions certified by TSMC
InfiniLink secures $10M funding from MediaTek, Sukna Ventures, and Egypt Ventures
UMC unveils new fab facility in Singapore
Tokyo Electron and IBM renew collaboration
Production system for double-sided wafer probe test for silicon photonics
Imec pioneers photonic code-division multiplexing FMCW 144GHz distributed radar
Lightmatter unveils Passage M1000 Photonic Superchip
Onto Innovation and LPKF set to accelerate mass production of glass core substrates
Quantum sensors: from lab to chip through semiconductor fabs
SONOTEC attends European CMP and WET Users Group Meeting in Leuven, Belgium
iPronics unveils World’s silicon photonics optical circuit switch
Marvell demonstrates silicon photonics light engine
Baden-Württemberg attracts imec to lead development of chiplet-based technology
Europe’s semiconductor industry focuses on sustainable growth
Arteris opens new Engineering Hub in Poland
SONOTEC attends European CMP and WET Users Group Meeting in Leuven, Belgium
High-accuracy packaging in panel level packaging
ImageIR 6300: Cooled Thermographic Camera for Continuous Industrial Operation
PhotonDelta and Silicon Catalyst form strategic collaboration
Sarcina Technology launches AI platform
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Adblocker Detected
Please consider unblocking adverts on this website