Loading...
News Article

Hailo selects Avnet ASIC as Channel partner for TSMC silicon production

News

Avnet ASIC has been selected by Hailo, the pioneering chipmaker of edge artificial intelligence (AI) processors, as its silicon channel partner for future chips on its product roadmap.

Avnet ASIC, one of a select number of TSMC-certified Value Chain Aggregators (VCA), has already completed two projects with Hailo.


As a VCA partner, Avnet ASIC provides access to TSMC’s fabrication processes along with engineering support, production management, and process integration. The company has experience supporting chip production at 3nm and has access to TSMC’s upcoming 2nm technologies.


Avnet ASIC offers technical expertise across the chip development lifecycle, from design enablement to high-volume production. Its team supports customers with tapeout procedures, product management, and supply chain management.


TSMC’s VCA program provides mid-sized companies with access to its advanced fabrication processes through certified partners. This partnership allows Hailo to offload tapeout readiness and fab management to a reliable partner and focus on its core engineering activities instead of interacting directly with TSMC.


“We are honored to be the silicon channel partner of choice for Hailo’s groundbreaking AI processors,” said Yulia Milshtein, GM, Head of Business at Avnet ASIC. “TSMC has certified only a limited number of VCA partners worldwide, and Avnet ASIC’s extensive experience in design and production management enables us to provide high-value technical and product services, empowering companies like Hailo to bring innovative products to market efficiently.”


“Our collaboration with Avnet ASIC strengthens our AI processor production,” said Ina Shternberg, VP of Quality and Operations at Hailo. “This partnership ensures that we have engineering-driven support, high manufacturing standards, and access to TSMC’s most advanced silicon processes, giving us confidence in both quality and efficiency.”

CE3S introduces Millice StripAid X Series
IDTechEx explores emerging applications for PICs
Miniature hexapod designed for demanding applications
ACM Research receives 2025 3D InCites Technology Enablement Award
ROHM develops low ON-resistance, high-power MOSFETs
Exploring packaging technologies
AI tops tech growth charts
Hailo selects Avnet ASIC as Channel partner for TSMC silicon production
Innatera appoints Intralink to bring brain-inspired AI to Asia
ABLIC strengthens semiconductor portfolio
Infineon bolsters global lead in automotive semiconductors
Infineon to acquire Marvell’s Automotive Ethernet business
Ansys semiconductor solutions certified by TSMC
InfiniLink secures $10M funding from MediaTek, Sukna Ventures, and Egypt Ventures
UMC unveils new fab facility in Singapore
Tokyo Electron and IBM renew collaboration
Production system for double-sided wafer probe test for silicon photonics
Imec pioneers photonic code-division multiplexing FMCW 144GHz distributed radar
Lightmatter unveils Passage M1000 Photonic Superchip
Onto Innovation and LPKF set to accelerate mass production of glass core substrates
Quantum sensors: from lab to chip through semiconductor fabs
SONOTEC attends European CMP and WET Users Group Meeting in Leuven, Belgium
iPronics unveils World’s silicon photonics optical circuit switch
Marvell demonstrates silicon photonics light engine
Baden-Württemberg attracts imec to lead development of chiplet-based technology
Europe’s semiconductor industry focuses on sustainable growth
Arteris opens new Engineering Hub in Poland
SONOTEC attends European CMP and WET Users Group Meeting in Leuven, Belgium
High-accuracy packaging in panel level packaging
ImageIR 6300: Cooled Thermographic Camera for Continuous Industrial Operation
PhotonDelta and Silicon Catalyst form strategic collaboration
Sarcina Technology launches AI platform
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: