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Trymax Receives Multi-System Orders Semiconductor Packaging House

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Trymax Semiconductor Equipment BV (Trymax), has announced it
has received multi-system orders for its NEO 2000 and NEO 3000 series from a
leading Taiwanese packaging house. This order will expand the existing NEO
install base at the customer in Taiwan and allows Trymax to break into the
customer's fab in China. Shipping of the systems will start in Q2 and continue
during Q3 2019.

“We are pleased to receive this order for several shipments
in two different fabs”, said Jonathan Lee, General Manager of Trymax in Asia.
“Many companies claim to deliver the best Cost of Ownership but these repeat
and expansion orders are a concrete example that our solutions are truly
delivering it”.

NEO 2000 series is a dual chamber system for wafers up to
200mm. NEO 3000 series is a dual chamber system for wafers up to 300mm. All
systems will be configured with Trymax's dual source plasma technology
combining RF and microwave to provide the best ashing rate and uniformity
trade-off. The dual source technology is the choice recommended by Trymax for
many wafer level packaging applications such as bumping or Fan-Out Wafer Level
Packaging.

This month, Trymax will be sponsoring the Plasma Etch and
Strip in Microtechnology workshop (PESM) in Grenoble (France) in May 20-21, and
the SEMI Fab Owner Alliance meeting in Lowell (USA) in May 22-23. Trymax will
be exhibiting at the Electronic Components and Technology Conference (ECTC) in
Las Vegas (USA) in May 28-31. Staff of the company can be met at these events
to learn more about NEO series.

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