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Thursday 5th September 2013
The company’s latest MEMS devices outperform competitive timing solutions and support integration with mobile chipsets and low-power wireless connectivity devices
Thursday 5th September 2013
Industry's first FPGA and hybrid memory cube demonstration paves the way for Altera’s Generation 10 FPGA and SoC breakthrough performance
Wednesday 4th September 2013
The new NSX 220 tool is designed for semiconductor, MEMS and LED packaging and test facilities to achieve productivity at a low price
Wednesday 4th September 2013
Atomic layer lithography has the potential to create ultra-small sensors with increased sensitivity using Scotch tape
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Tuesday 3rd September 2013
Cadence and ARM have deepened their collaboration on high-end mobile device development
Tuesday 3rd September 2013
Soaring demand for stacked-die devices endorses ams’ patented TSV fabrication technology
Tuesday 3rd September 2013
MEMS in therapeutic devices is foreseen to have the highest growth owing to rise in use of intrathecal pumps and other targeted drug delivery methods including insulin delivery pumps
Tuesday 3rd September 2013
The firm says its nano-composite coating enables critical process equipment to lower costs and meet next-generation scaling requirements
Tuesday 3rd September 2013
Both innovators are uniting to offer simple, cost-effective temporary bonding/debonding solution for high-performance 3D-IC packaging
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Monday 2nd September 2013
The firm will share its insights on the next big market for MEMS at Taiwan’s major technology event
Monday 2nd September 2013
Using a combination of different techniques, researchers can etch trenches and other high aspect ratio structures with nanometre scale features without using masks
Monday 2nd September 2013
Initial efforts using Imagination's PowerVR Series6 cores have boosted performance by 25 percent and 30 percent in key blocks
Friday 30th August 2013
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Friday 30th August 2013
The adoption of ultra-high-speed DDR4 in server systems this year is expected to revolutionise memory in multiple applications
Friday 30th August 2013
The firm's Bluetooth 4.0 network processor improves power consumption for longer battery life
Thursday 29th August 2013
The firm has had to move its discrete assembly facility to Prachinburi following the floods of 2011
Thursday 29th August 2013
Thursday 29th August 2013
The new series of pumps are suited to integrated power supplies for the semiconductor and flat panel display manufacturing industries and should enable cost reductions
Thursday 29th August 2013
New MEMS devices will account for 10 percent of the value of the total MEMS business by 2018
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