News Article

Teijin Develops Polishing Pads Using Ultra-fine Fibre

Teijin Frontier, the Teijin Group's fibres and products converting company, has announced that it has developed polishing pads that are expected to enhance silicon wafer quality control while also lowering production costs. The new silicon pads are made with nonwoven NANOFRONT ultra-fine nanofiber, which is made with a flexible, water-absorbent polymer impregnated with polyurethane resin.

Features of the silicon pads:

NANOFRONT's expansive surface area created by its undulating nonwoven nanofiber, resulting in high absorbency, the pad surfaces offer excellent adherence to abrasive particles and abrasive fluids, allowing lower concentrations of abrasive fluids to be used.

NANOFRONT is flexible enough to be used in polishing pads capable of producing silicon wafers with mirror finishes.

NANOFRONT's large surface area inhibits aggregation of abrasive particles in the fluids, contributing to enhanced polishing quality

Teijin frontier will begin selling its new polishing pads to manufacturers of semiconductors and flat-panel displays within the current fiscal year. It is targeting annual sales of one billion yen (9 million U.S. dollars) by the fiscal year ending in March 2026. Going forward, the company expects to expand its lineup of polishing pads in response to market needs by maximizing the synergies of NANOFRONT polymer, polyurethane impregnation techniques and abrasive fluids.

Demands are growing for semiconductors that offer higher performance and lower prices. To produce such semiconductors, polishing pads of different hardness are required. Polishing pads are used variously to enable nanometer wiring on semiconductor surfaces, to create mirror finishes that help to prevent crystal silicone damage, and to maintain silicon wafer quality characteristics. Reducing the amount of abrasive fluids without losing quality is a major challenge, but necessary to help lower silicon wafer manufacturing costs because the fluids account for a large portion of the costs. Teijin Frontier succeeded in development of new silicon pads realizing both stable quality and reducing cost by adopting ultra-fine fiber NANOFRONT utilizing its propriety yarn technology.

Photo: Polishing pads using NANOFRONT® Photo: Existing Product

Polishing pads using NANOFRONT® NANOFRONT® Existing Product

Pfeiffer Vacuum Presents A Cloud-based Solution For Service Management
SEMI Applauds European Chips Act
Xenics Expands Its Bobcat Product Family And Makes SWIR Cameras Affordable.
Webinar: Next Generation Optical Spectrum Analyzer
PragmatIC Semiconductor Secures $80 Million Funding
SkyWater Signs Technology Transfer And License Agreement With Deca
Edwards Officially Opens New Flagship Service Technology Centre In Dublin
Tektronix Releases Results Of Its Global Engineer Survey 2021
Merck Launches Semiconductor Materials Webinar Series
Leybold Launches Small High Vacuum System For R&D
Excellent Batch Process Results With Picosun New Generation Tools
Path To Sensors Interoperability - IEEE SA Sensors Series Live Webinar
SiTime Enables Up To 25% Faster Wireless Charging
Advantest Introduces Evolutionary V93000 EXA Scale SoC Test System
New OmniControl Universal Control Unit For Pumps And Measurement Instruments From Pfeiffer Vacuum
Renault To Create Better Brand Visibility For Qualcomm In EV Market
Applied Materials Unveils EBeam Metrology System
Linton Crystal Technologies Uses AI To Detect Crystal Structure Loss, Notify Operator
YES Acquires Kanthal’s Semiconductor Equipment Business
Edwards Opens Lab At Hillsboro Innovation Center
Picosun Strengthens Its Position In The Semiconductor Market
EV Power Electronics: Driving Semiconductor Demand In A Chip Shortage
PragmatIC Semiconductor Re-invents Iconic Processor
Sivers Semiconductors’ Japanese Customer Takes Step Towards Mass Production

Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
Live Event