Info
Info
News search:

< Page of 407 >

News


Tuesday 23rd December 2008
SPIE Advanced Lithography, the annual forum of the lithography community, will bring worldwide experts working in EUV, smart metrology, resist materials, processing technology, and other established and emerging topics to the 34th event next February in San Jose.
Tuesday 23rd December 2008
2008 marks the 10th anniversary of the startup of Boin GmbH, a semiconductor software supplier. The company was founded 1998 and introduced the WAFERMAP metrology software.
Monday 22nd December 2008
The German Free State of Saxony, Qimonda and Infineon Technologies have jointly announced a financing package for Qimonda.
Monday 22nd December 2008
Applied Materials announced that its North American employees have raised more than $480,000 for local food banks in the past two months through a variety of fundraising activities, exceeding the company’s 2008 fundraising goal.
Friday 19th December 2008
The news of late has not being inspiring so it was a pleasure that EuroAsia Semiconductor received Bill McLean’s latest monthly report providing a realistic look at what is likely to happen in 2009 and finds that it has been worse.
Thursday 18th December 2008
The company takes action to adjust its organisation due to severe order slowdown, cuts 1000 jobs and closes training centre in the U.S.
Info
Tuesday 16th December 2008
The company announces multi billion Dollar investment to serve emerging global solar power industry. The investment provides critical raw materials to solar cell manufacturers.
Tuesday 16th December 2008
The German state of Saxony may help the troubled chipmaker Qimonda. But the state says Infineon needs to contribute.
Tuesday 16th December 2008
Wet wafer surface preparation equipment provider SEZ, now part of the LAM group, has confirmed that another 60 jobs will be lost. The arbitration commission of the Austrian county of Kärnten heavily criticised the redundancy packages the company is offering.
Monday 15th December 2008
Time To Market (TTM) well positioned to leverage SOI for low power applications, including in India’s chip design & services sector.
Monday 15th December 2008
IBM’s 12SO 45nm SOI process technology available in low volume MPW service.
Monday 15th December 2008
Fairchild Semiconductor has announced that the current financial crisis has initiated action to prevent more problems with a negative future being widely predicted.
Info
Thursday 11th December 2008
The company receives US patent for piezo actuator technology enabling higher reliability.
Wednesday 10th December 2008
The company completes next generation, 32nm process development phase international electron devices meeting.
Wednesday 10th December 2008
Following a dismal 2008, global spending on semiconductor manufacturing equipment in 2009 will fall to its lowest level in six years, due to weakening conditions in the chip and electronic equipment markets, according to iSuppli Corp.
Wednesday 10th December 2008
The company deploys the next phase of step and flash imprint lithography (S-FIL) campaign across multiple industries. HDD industry standardising on S-FIL and semiconductor industry moving toward adoption.
Wednesday 10th December 2008
Decline in European semiconductor industry putting up to halve a million European jobs at risk. SEMI Europe calls on EU and European national governments to invest in this key industry, jobs, and access to technology it guarantees.
Tuesday 9th December 2008
Strategic agreement with Honeywell Sensing & Control to increase products available to customers worldwide.
Info
Tuesday 9th December 2008
Under the terms of the agreement, RS will distribute FCI Electronics’ full product line to customers across Europe.
Tuesday 9th December 2008
HP and Arizona State University demo flexible and unbreakable displays.
Tuesday 9th December 2008
The company announces a quarterly cash dividend for its shares.
Tuesday 9th December 2008
The company announced a series of aggressive actions to accelerate its transformational strategy in light of current economic realities.
Monday 8th December 2008
The company is seeking approximately $691 million from creditors.
Thursday 4th December 2008
RUSNANO and Ministry of Employment and the Economy signed the memorandum on mutual understanding.

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info