Denton Vacuum reveals Exilis 1 ALD system
Denton Vacuum LLC, a manufacturer of thin film technology products, has announced the introduction of the Exilis 1 tool.
This is a new atomic layer deposition (ALD) system that is claimed to deliver breakthrough results for users in the semiconductor research, aerospace, optics, and medical communities.
We've talked to ALD system users all over the world, and they are not happy with what's now available on the market," says Vince McGinty, president and CEO of Denton Vacuum.
He adds, "Many commercially available ALD systems are limited in capability, while others have proven to be maintenance nightmares, with such simple tasks as chamber cleaning, precursor loading and valve changes turning into complex events that lead to extended, even indeterminate downtime. "
McGinty continues, "Users in the corporate community often find that systems designed for research and development bear no resemblance to systems designed for manufacturing-scale activities. Exilis 1 addresses these issues, with broader capability, improved productivity and maintainability, and direct paths to production scale-up."
Denton Vacuum claims its Exilis 1 brings new capability in several key areas, including:
Multi-wafer and 3D component capability
Expanded process chamber adaptability (remote plasma source, a vacuum load lock, and even integration into a Denton cluster tool)
An automated load/unload arm that enables immediate, safe removal of hot substrates from the process chamber
Reliable and quick replacement of precursor canisters and ALD valves (the hard-mounted, easy-access manifold incorporates an internal heater assembly, enabling canister or ALD valve changes in less than ten minutes)
