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Wednesday 29th October 2008
Both companies announce seminar series in Asia on innovative process solutions for 3D integration.
Wednesday 29th October 2008
Dispute is now resolved with three of four defendants in patent infringement lawsuit.
Wednesday 29th October 2008
The 150 mm fab is available for immediate operation.
Tuesday 28th October 2008
The company aims to streamline its global business.
Tuesday 28th October 2008
The company reports 6% revenue and 10% earnings growth in the third quarter, weakened demand environment expected for remainder of 2008 due to economic headwinds.
Tuesday 28th October 2008
The company announces sale of metallic and semiconducting carbon nanotubes.
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Tuesday 28th October 2008
Introducing the industry’s largest density SLC NAND chip at16Gb chip and enhanced SLC line ups.
Tuesday 28th October 2008
United States Court awards judgement to Seoul Semiconductor against Nichia.
Monday 27th October 2008
The semiconductor test company is now officially present in Petach Tikva, Israel.
Monday 27th October 2008
Double patterning immersion lithography and advanced strained silicon technology is used to deliver fully functional 28nm chips.
Monday 27th October 2008
The company can now start flash R&D in its manufacturing facilities.
Monday 27th October 2008
The company ranks in top three fastest growing technology companies in the UK in the 2008 Deloitte Technology Fast 50. picoChip attributes Its 4483% revenue growth to the emergence of the femtocell market.
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Friday 24th October 2008
Successful in action: SESAM high performance microscope from Carl Zeiss in the Stuttgart Centre for Electron Microscopy of the Max-Planck-Institute for metals research. Carl Zeiss also received the EuroAsia IC Industry Awards Subsystems/Components Improvement in October this year for the Libra 200 MC.
Friday 24th October 2008
The company draws $460 million under its revolving credit agreement.
Thursday 23rd October 2008
The foundry successfully developed 0.11 Micron CIS process technology.
Thursday 23rd October 2008
Ultra thin chip fabrication capability will be a key enabler in future microelectronics and microsystems applications, such as three dimensional integrated circuits (3D IC) and systems in foil (SiF).
Thursday 23rd October 2008
Advanced Micro Fabrication Equipment (AMEC), an Asia based semiconductor equipment maker and this year's EuroAsia IC Industry Award's Start Up of the Year recipient, secured $58 million in Series C financing.
Thursday 23rd October 2008
The company aims to ramp up its Femtocell production.
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Wednesday 22nd October 2008
The funding comes from from Intel Capital and current investors. The company aims to expand global sales and marketing and grow the HiveGo solution portfolio for mobile phones and mobile internet devices.
Wednesday 22nd October 2008
Solvay joins Holst Centre research programme on systems in foil (SIF).
Wednesday 22nd October 2008
The company receives two IC Industry Awards from EuroAsia Semiconductor.
Wednesday 22nd October 2008
The company issues a statement with regard to the withdrawal of proposal from Samsung.
Wednesday 22nd October 2008
New investment to enhance customer support and spur growth.
Wednesday 22nd October 2008
The company aims to enhance its portfolio of motion control and manufacturing process.

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