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News

News

Friday 21st March 2014

Toshiba launches 600V MOSFET DTMOS IV-H series

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Friday 21st March 2014

Renesas Singapore to transfer manufacturing assets to J-Devices

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Friday 21st March 2014

SEMI: Equipment industry book-to-bill ratio 1.0 in Feb 2014

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Thursday 20th March 2014

Tessera and Renesas make amends

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Thursday 20th March 2014

MEI's MEMS tool set to lift off

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Wednesday 19th March 2014

Globalfoundries to help manufacture Toshiba's FFSA devices

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Wednesday 19th March 2014

IHS: MEMS combo sensor market to hike 37 percent

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Wednesday 19th March 2014

Wacker Chemie reaches polysilicon agreement with China

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Tuesday 18th March 2014

EVG establishes China headquarters in Shanghai

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Tuesday 18th March 2014

Nanoscale optical switch breaks miniaturisation barriers

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Tuesday 18th March 2014

Silicon carbide goes quantum

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Tuesday 18th March 2014

6 and 9-axis DOF MEMS sensors to lift combos business

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Tuesday 18th March 2014

SEMI awards SMIC CEO TY Chiu

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Tuesday 18th March 2014

Yamaha and Cadence halve leakage power in smartphones

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Monday 17th March 2014

TSMC upgrades financial guidance

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Monday 17th March 2014

Micron wins three patent victories against the University of Illinois

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Monday 17th March 2014

MEMS startup QualtrÃ© secures $8 million strategic round

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Friday 14th March 2014

Altium branches out in East Coast US

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Friday 14th March 2014

SanDisk files lawsuit against SK Hynix for theft of trade secrets

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Thursday 13th March 2014

A tiny chip could transform phones into projecters

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Thursday 13th March 2014

New Plasma Etch tools require no CF4 for PCBs

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Thursday 13th March 2014

Cadence and Globalfoundries test ARM chip in 28nm process

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Wednesday 12th March 2014

STATS ChipPAC flexible packaging set to enable 450mm

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Wednesday 12th March 2014

Samsung mass producing 4Gb DDR3 chips with 20nm technology