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Tuesday 16th December 2008
The company announces multi billion Dollar investment to serve emerging global solar power industry. The investment provides critical raw materials to solar cell manufacturers.
Tuesday 16th December 2008
The German state of Saxony may help the troubled chipmaker Qimonda. But the state says Infineon needs to contribute.
Tuesday 16th December 2008
Wet wafer surface preparation equipment provider SEZ, now part of the LAM group, has confirmed that another 60 jobs will be lost. The arbitration commission of the Austrian county of Kärnten heavily criticised the redundancy packages the company is offering.
Monday 15th December 2008
Time To Market (TTM) well positioned to leverage SOI for low power applications, including in India’s chip design & services sector.
Monday 15th December 2008
IBM’s 12SO 45nm SOI process technology available in low volume MPW service.
Monday 15th December 2008
Fairchild Semiconductor has announced that the current financial crisis has initiated action to prevent more problems with a negative future being widely predicted.
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Thursday 11th December 2008
The company receives US patent for piezo actuator technology enabling higher reliability.
Wednesday 10th December 2008
The company completes next generation, 32nm process development phase international electron devices meeting.
Wednesday 10th December 2008
Following a dismal 2008, global spending on semiconductor manufacturing equipment in 2009 will fall to its lowest level in six years, due to weakening conditions in the chip and electronic equipment markets, according to iSuppli Corp.
Wednesday 10th December 2008
The company deploys the next phase of step and flash imprint lithography (S-FIL) campaign across multiple industries. HDD industry standardising on S-FIL and semiconductor industry moving toward adoption.
Wednesday 10th December 2008
Decline in European semiconductor industry putting up to halve a million European jobs at risk. SEMI Europe calls on EU and European national governments to invest in this key industry, jobs, and access to technology it guarantees.
Tuesday 9th December 2008
Strategic agreement with Honeywell Sensing & Control to increase products available to customers worldwide.
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Tuesday 9th December 2008
Under the terms of the agreement, RS will distribute FCI Electronics’ full product line to customers across Europe.
Tuesday 9th December 2008
HP and Arizona State University demo flexible and unbreakable displays.
Tuesday 9th December 2008
The company announces a quarterly cash dividend for its shares.
Tuesday 9th December 2008
The company announced a series of aggressive actions to accelerate its transformational strategy in light of current economic realities.
Monday 8th December 2008
The company is seeking approximately $691 million from creditors.
Thursday 4th December 2008
RUSNANO and Ministry of Employment and the Economy signed the memorandum on mutual understanding.
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Thursday 4th December 2008
Eyelit's integrated manufacturing execution (MES), quality and asset management software suite selected by SiCrystal for silicon carbide (SiC) wafer manufacturing. Selection continues Eyelit’s global expansion, sale by European partner Systema.
Thursday 4th December 2008
Inventux Technologies opens facility to mass produce thin film solar silicon modules using Oerlikon Solar’s micromorph technology.
Thursday 4th December 2008
The slowdown in global semiconductor that became evident in September continues in October.
Wednesday 3rd December 2008
The partnership between Centipede Systems and TopLine will help users evaluate semiconductor test technologies.
Tuesday 2nd December 2008
iSuppli releases preliminary 2008 semiconductor rankings.
Monday 1st December 2008
The company announces progress on partnership discussions and delays release of results.

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