Wet wafer surface preparation equipment provider SEZ, now part of the LAM group, has confirmed that another 60 jobs will be lost. The arbitration commission of the Austrian county of Kärnten heavily criticised the redundancy packages the company is offering.
Following a dismal 2008, global spending on semiconductor manufacturing equipment in 2009 will fall to its lowest level in six years, due to weakening conditions in the chip and electronic equipment markets, according to iSuppli Corp.
The company deploys the next phase of step and flash imprint lithography (S-FIL) campaign across multiple industries. HDD industry standardising on S-FIL and semiconductor industry moving toward adoption.
Decline in European semiconductor industry putting up to halve a million European jobs at risk. SEMI Europe calls on EU and European national governments to invest in this key industry, jobs, and access to technology it guarantees.
Eyelit's integrated manufacturing execution (MES), quality and asset management software suite selected by SiCrystal for silicon carbide (SiC) wafer manufacturing. Selection continues Eyelit’s global expansion, sale by European partner Systema.