The supplier of specialised and custom wafer foundry services and a division of DALSA Corporation, announced the launch of the first phase of a 200mm MEMS (micro electro mechanical systems) manufacturing line at its semiconductor wafer foundry in Bromont, Quebec, Canada. The announcement closely follows several new MEMS supply contracts the Company has recently received for delivery of product in 2009 and for new product development.
Reactive NanoTechnologies, (RNT), announced that it has reached an agreement with GS PMC Korea, a supplier of technology based materials headquartered in Seoul, Korea. GS Korea PMC will manage the sale and distribution of NanoFoil products into a variety of applications including electronics assembly, solar, and sputter target bonding throughout Korea.
In a short statement 3M and the EV Group (EVG) have agreed to settle a patent infringement litigation brought by EVG against 3M in the U.S. District Court of the Southern District of New York relating to systems for temporary wafer bonding.
SPIE Advanced Lithography, the annual forum of the lithography community, will bring worldwide experts working in EUV, smart metrology, resist materials, processing technology, and other established and emerging topics to the 34th event next February in San Jose.
Applied Materials announced that its North American employees have raised more than $480,000 for local food banks in the past two months through a variety of fundraising activities, exceeding the company’s 2008 fundraising goal.
The news of late has not being inspiring so it was a pleasure that EuroAsia Semiconductor received Bill McLean’s latest monthly report providing a realistic look at what is likely to happen in 2009 and finds that it has been worse.