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Monday 1st December 2008
Infineon Technologies announced that Robert Bosch will be employing a chip from Infineon in its next generation of automotive radar systems.
Monday 1st December 2008
Both companies announce breakthrough results and collaboration on copper process technology for 2Xnm and beyond.
Monday 1st December 2008
The industry giant drives the acceleration of TSV adoption in 3DICs and delivers a high performance etch system.
Monday 1st December 2008
A new suit of aligners and measurement systems for 3D IC and other advanced semiconductor, MEMS and nanotechnology devices manufacturing has been introduced by EVG which is expected to increase performance significantly.
Thursday 27th November 2008
MAPPER Lithography has received a $5 million innovation loan from SenterNovem, the innovation agency of the Dutch Ministry of Economic Affairs, to further develop its highly innovative lithography machine for the manufacturing of chips.
Wednesday 26th November 2008
The company completes relocation from United Kingdom to become first international high tech equipment supplier to move entire operation to New York’s Capital Region.
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Wednesday 26th November 2008
A big step towards energy saving OLED lighting with efficiency of more than 60 lm/W. International standard for white colour requirements met.
Wednesday 26th November 2008
The company also received the second tranche of US$ 200 in cash.
Tuesday 25th November 2008
The company draws US$ 400 million under its revolving credit facility.
Tuesday 25th November 2008
OLOVO announces agreement for supplying advanced packaging wafer bumping plating anodes.
Tuesday 25th November 2008
SRAM with HK/MG process has yielded and complements foundry's 32/28nm technology.
Tuesday 25th November 2008
The new system will help to reduce PFC pollution from dielectric film etching processes used in semiconductor manufacturing.
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Monday 24th November 2008
The licensing of this Beyond Semiconductor technology will enable e3C to expand its consumer electronics product lines and deliver more cost competitively products to the market.
Monday 24th November 2008
Linde wins three new long term thin film contracts to capture over 50% of the market in China.
Monday 24th November 2008
The companies move into mass production of 34nm NAND Flash.
Friday 21st November 2008
Credit turmoil cuts 2009 PC outlook by nearly two thirds says iSuppli.
Friday 21st November 2008
Polysilicon facilities start up at Wacker’s Burghausen site and creates new jobs.
Friday 21st November 2008
The Semiconductor Equipment Association of Japan (SEAJ) posts its book to bill ratio based on three months average for October 2008.
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Friday 21st November 2008
Silicon Foundry Holding can immediately start production without modifications to the facility, rapidly addressing an existing market demand.
Friday 21st November 2008
The companies collaborate at MIT on ultra low power microcontroller devices.
Friday 21st November 2008
The company sets new world record in microscopy resolution using scanning helium ions.
Friday 21st November 2008
The company will develop RF WiMAX production test solution for Fujitsu Microelectronics’ new WiMAX PCMCIA card and WiMAX USB dongle devices.
Thursday 20th November 2008
FSI International receives repeat order for photolithography system from a gallium arsenide foundry. The company experiences continued growth in broadband wireless and wireline communications market.
Thursday 20th November 2008
Overall revenues increase more than 15% based on growing demand among 3D interconnect and nanoimprint lithography markets.

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