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Thursday 4th December 2008
Inventux Technologies opens facility to mass produce thin film solar silicon modules using Oerlikon Solar’s micromorph technology.
Thursday 4th December 2008
The slowdown in global semiconductor that became evident in September continues in October.
Wednesday 3rd December 2008
The partnership between Centipede Systems and TopLine will help users evaluate semiconductor test technologies.
Tuesday 2nd December 2008
iSuppli releases preliminary 2008 semiconductor rankings.
Monday 1st December 2008
The company announces progress on partnership discussions and delays release of results.
Monday 1st December 2008
Hitachi Data Systems to locate MENA headquarters at Dubai Silicon Oasis.
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Monday 1st December 2008
Dubai Circuit Design Centre receives award from Global Design Forum in Germany. Synopsys Users Group (SNUG) in Munich recognises DCD’s technical excellence.
Monday 1st December 2008
Infineon Technologies announced that Robert Bosch will be employing a chip from Infineon in its next generation of automotive radar systems.
Monday 1st December 2008
Both companies announce breakthrough results and collaboration on copper process technology for 2Xnm and beyond.
Monday 1st December 2008
The industry giant drives the acceleration of TSV adoption in 3DICs and delivers a high performance etch system.
Monday 1st December 2008
A new suit of aligners and measurement systems for 3D IC and other advanced semiconductor, MEMS and nanotechnology devices manufacturing has been introduced by EVG which is expected to increase performance significantly.
Thursday 27th November 2008
MAPPER Lithography has received a $5 million innovation loan from SenterNovem, the innovation agency of the Dutch Ministry of Economic Affairs, to further develop its highly innovative lithography machine for the manufacturing of chips.
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Wednesday 26th November 2008
The company completes relocation from United Kingdom to become first international high tech equipment supplier to move entire operation to New York’s Capital Region.
Wednesday 26th November 2008
A big step towards energy saving OLED lighting with efficiency of more than 60 lm/W. International standard for white colour requirements met.
Wednesday 26th November 2008
The company also received the second tranche of US$ 200 in cash.
Tuesday 25th November 2008
The company draws US$ 400 million under its revolving credit facility.
Tuesday 25th November 2008
OLOVO announces agreement for supplying advanced packaging wafer bumping plating anodes.
Tuesday 25th November 2008
SRAM with HK/MG process has yielded and complements foundry's 32/28nm technology.
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Tuesday 25th November 2008
The new system will help to reduce PFC pollution from dielectric film etching processes used in semiconductor manufacturing.
Monday 24th November 2008
The licensing of this Beyond Semiconductor technology will enable e3C to expand its consumer electronics product lines and deliver more cost competitively products to the market.
Monday 24th November 2008
Linde wins three new long term thin film contracts to capture over 50% of the market in China.
Monday 24th November 2008
The companies move into mass production of 34nm NAND Flash.
Friday 21st November 2008
Credit turmoil cuts 2009 PC outlook by nearly two thirds says iSuppli.
Friday 21st November 2008
Polysilicon facilities start up at Wacker’s Burghausen site and creates new jobs.

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