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Thursday 2nd October 2008
“With the industry sailing in uncharted waters, it’s time to get back to basics,” comments Future Horizons’ Malcolm Penn.
Wednesday 1st October 2008
Using the echoes from the top and the bottom of a layer, the company achieves accurate measurements of the thickness of the bondline.
Wednesday 1st October 2008
The introduction of new international standards uses XRF analysis to detect toxic heavy metals and homogeneous polymers.
Wednesday 1st October 2008
The company completes acquisition of Microelectronic Inspection Equipment (MIE) business unit of Vistec Semiconductor Systems.
Wednesday 1st October 2008
Oberkochen based optical company Carl Zeiss has acquired approximately 40 percent of Karlsruhe start up Nanoscribe.
Wednesday 1st October 2008
The test and advanced packaging company selects E2open's supplier collaboration system to enhance visibility, control and collaboration across its multi-enterprise demand and supply network.
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Tuesday 30th September 2008
Silicon on Sapphire (SoS) enjoyed a substantial growth and the sapphire material business is anticipated to exceed $400 million by 2012.
Tuesday 30th September 2008
The company aims to increase its market and technology development opportunities.
Tuesday 30th September 2008
The company updates the industry on significant progress in EUV lithography and reveals the roadmap that extends semiconductor manufacturing to 11 nanometres and beyond.
Tuesday 30th September 2008
The U.S. Government rejected the $700 billion rescue package on Monday and the broader market including the shares of semiconductor companies fell alongside.
Tuesday 30th September 2008
Both companies join forces to help manufacturers speed development of mobile WiMAX devices.
Monday 29th September 2008
The company intends to appeal. The application to transfer listing to NASDAQ capital market is denied.
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Monday 29th September 2008
Next generation 28nm process provides first comprehensive manufacturing platform featuring both high-k metal gate and silicon oxynitride.
Monday 29th September 2008
The companies join forces to enable energy efficient 32nm and 28nm systems on chip.
Friday 26th September 2008
The company announces signing and closing of definite agreements with its lenders in a bid to reduce a $250 million debt and restructure the balance sheet. The agreement will increase the shareholders' equity, improve cash flow and finances.
Friday 26th September 2008
The company has been named exclusive US reseller of IT innovation semiconductor and solar equipment automation software and is also named service partner to integrate and deploy equipment automation software for 200mm and 300mm semiconductor equipment as well as solar manufacturing equipment.
Thursday 25th September 2008
Equipped with its ESD design portfolio, Sarnoff Europe announced that it has joined the TSMC Design Centrer Alliance (DCA). The DCA Programme helps align IC companies and TSMC qualified providers.
Thursday 25th September 2008
SPIE Photomask will explore issues of the deep sub wavelength era at a photomask technology symposium.
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Thursday 25th September 2008
New NanoMarkets report states that OLED lighting markets will reach $4.5 billion by 2013.
Thursday 25th September 2008
The semiconductor company's expertise applied to US government programme to develop carbon electronics for RF applications (CERA).
Wednesday 24th September 2008
Negotiations with the new potential shareholders are proceeding. Closing of the deal expected in the near future.
Wednesday 24th September 2008
The commission announces its 72nd member country.
Wednesday 24th September 2008
The company has updated its financial targets following the delay of raw material deliveries from its suppliers due to the effects of Hurricane Ike.
Tuesday 23rd September 2008
Latest round of funding primes Altair's global expansion and future developments in mobile WiMAX, LTE and XGP chip technologies.

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