STATS ChipPAC recognised for patent innovations
STATS ChipPAC has been ranked for the third consecutive year among the world's top 20 semiconductor manufacturing companies in the '2013 Patent Power Scorecard' published by IEEE Spectrum.
This is the flagship magazine of the Institute of Electrical and Electronics Engineers (IEEE), the world's largest professional association for the advancement of technology, and 1790 Analytics, an Intellectual Property (IP) evaluation firm.
STATS ChipPAC is the only Outsourced Semiconductor Assembly and Test (OSAT) service provider ranked among the top twenty companies in the 'Semiconductor Manufacturing' category.
The Patent Power Scorecards are based on quantitative benchmarking of the patent portfolios of more than 5,000 leading commercial enterprises, academic institutions, non profit organisations and government agencies worldwide.
The benchmarking process takes into account not only the size of an organisation's patent portfolio, but also the quality of that portfolio in terms of growth, impact, originality and general applicability.
"Today's consumers want more powerful yet increasingly smaller electronic devices. Semiconductor packaging technology is a driving force in achieving smaller, faster, multi-functional devices. With consistent investments in research and development and focus on technology innovation, we are enabling our customers to overcome increasingly complex performance and form factor challenges in order to deliver industry leading products," says Han Byung Joon, Executive Vice President and Chief Technology Officer, STATS ChipPAC.
STATS ChipPAC has been granted more than 1,000 patents by the U.S. Patent and Trademark Office (USPTO), which it says is more than any other company in the global OSAT industry. With over 60 percent of its IP in wafer level packaging, flip chip interconnect and 2.5D/3D integration, STATS ChipPAC offers its customers innovative packaging solutions that provide performance, size and cost advantages.
Han summarises, "We have developed a continuous path of innovative and cost effective advanced packaging solutions that provide numerous advantages to customers in the mobile communications market as well as new and evolving markets such as cloud computing and wearable devices. Our strong patent portfolio and culture of innovation are key factors why STATS ChipPAC is the go-to OSAT provider that our customers can rely on for a comprehensive portfolio of advanced packaging and test solutions."
