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Monday 14th July 2008
The company announced the sale of lead scanner assets to BKM Technology Partners.
Monday 14th July 2008
Aviza Technology announces licensing of VTR Vertical Furnace product line to Expertech. The license agreement is part of the company’s market diversification strategy to expand into growing markets.
Monday 14th July 2008
The company has signed a two year system support contract with DRAM manufacturer.
Monday 14th July 2008
The system provides process capabilities for advanced wafer processes.
Monday 14th July 2008
Both companies sign a memorandum to improve services for the customer.
Monday 14th July 2008
IMEC gathers all major supply chain players for its 3D integration programme.
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Friday 11th July 2008
The $18.8 billion transaction marks a historic point in both companies transformation.
Friday 11th July 2008
Acquisition expands Impinj product portfolio and increases customer base.
Friday 11th July 2008
The company strengthens sorter market position with $15 million Spartan win.
Friday 11th July 2008
The company will commercialise next generation semiconductor CMP pad technology with the funding. Nano domains coupled with the ability to tune pad properties enable next generation planarisation.
Friday 11th July 2008
The company enters PV market with revolutionary wafering technology. The so called 'kerf free' wafering equipment moves into pilot line.
Friday 11th July 2008
Cost effective devices expected on market soon. The technology could be used to convert glass buildings into big energy plants. Scientists from the Massachusetts Institute of Technology (MIT) have developed a way to coat substrates most effectively.
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Thursday 10th July 2008
Advance could lead to next generation computer chips, solar cells, and more.
Thursday 10th July 2008
The company has named the successor of Joe Cestari, who has stepped down from the post of CEO. Cestari will remain with the company, instead as a charter member of the company’s advisory board.
Thursday 10th July 2008
Both companies co-operate on research into silicon based materials for 3 dimensional transistors.
Thursday 10th July 2008
The acquisition will open new market for Ceradyne semiconductor product line.
Thursday 10th July 2008
The ALD system will be used for sub 45nm logic IC production in Japan.
Thursday 10th July 2008
System’s enhanced performance enables high volume immersion and double patterning at lower operating costs.
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Wednesday 9th July 2008
The equipment is for the manufacture of image sensors using TSV technology. Significant multi million Euro order win furthers EVG's reach in the 3D interconnect space.
Wednesday 9th July 2008
This partnership could indicate a growing XLR technology adoption among chipmakers.
Tuesday 8th July 2008
Cypress Semiconductor and Tower Semiconductor have announced the successful completion of Cypress’s first 0.18 micron stitched large format Contact Image Sensor (CIS) device. The plans state that the product will be manufactured using Tower Semiconductor’s latest generation of stitching technology at Tower’s Fab 2, in Israel.
Tuesday 8th July 2008
The consortium keeps growing and adds several working groups in reflection of industry demands.
Tuesday 8th July 2008
The Economic Development Board Chairman, Applied Materials executives, and U.S. Ambassador Patricia Herbold have broken ground for the construction of a new Singapore operations facility that will serve Applied’s business activities throughout Asia. The facility is due for completion in late 2009.
Tuesday 8th July 2008
Rohm and Haas Electronic Materials announced the recent opening of its new $60 million immersion lithography facility to support its extensive research and development of advanced 193 nanometre (nm) lithography materials used in the manufacture of semiconductor devices. The milestone was marked by an opening ceremony held on June 26 that was attended by employees, vendors and representatives from the local community.

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