Ultratech wins repeat order for lithography tool from major OSAT
The company's AP300W system will be used for high-volume advanced packaging applications for communication devices
Ultratech, Inc. has received a repeat order from a leading outsourced semiconductor assembly and test (OSAT) company in Asia.
The AP300W lithography system built on Ultratech's customisable Unity Platform will be utilised for wafer-level packaging (WLP) applications to support growth driven by communication devices.
As the advanced packaging technology requirements evolve, OSATs will play an important role in establishing the supply chain.
"Demand for thinner mobile communication devices such as smartphones and tablets are driving much of the growth in WLP," according to Jan Vardaman , president and founder of TechSearch International. "Many of the suppliers of the integrated circuits used in these products depend on OSATs to meet their production needs. It is expected that the OSAT expansion will continue over the next several years to address this growth opportunity."
Ultratech Vice President, Advanced Packaging Technology/Nanotechnology Market Manish Ranjan adds, "Ultratech has maintained a leading market position over the last decade by delivering outstanding production performance with superior cost-of-ownership solutions. We look forward to working closely with our customers in the OSAT segment to support their high-volume production ramps."
