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News

News

Friday 31st May 2013

Peregrine completes sourcing and UltraCMOS license agreement with Murata

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Friday 31st May 2013

UMC awarded by iML for Six Sigma quality

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Friday 31st May 2013

ASML completes acquisition of Cymer

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Friday 31st May 2013

MEMC reinvents itself into SunEdison

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Thursday 30th May 2013

Global semiconductor leaders unite to strengthen industry

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Thursday 30th May 2013

Cadence tools endorsed by TSMC for 16nm FinFET & 20nm processes

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Thursday 30th May 2013

ams IC reduces stress on processors in phones and tablets

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Thursday 30th May 2013

IEEE to promote industry adoption of global standards

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Thursday 30th May 2013

IDC on shipments: Global tablets to leapfrog portable PCs

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Wednesday 29th May 2013

Signetics to further increase Flip Chip Package assembly capacity

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Wednesday 29th May 2013

Xilinx and TSMC to speed up time-to-market of 16nm FinFETs

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Wednesday 29th May 2013

SPTS & QMF unite to grow SiC on 300mm silicon

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Wednesday 29th May 2013

Axcelis implanter sent to leading foundry

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Wednesday 29th May 2013

Europe to boost micro- and nanoelectronic industries

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Tuesday 28th May 2013

Intel invests $1.5 million in Tyndall for research

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Tuesday 28th May 2013

STATS ChipPAC expands packaging facilities in Singapore

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Tuesday 28th May 2013

ST-Ericsson sells off GNSS assets and IP to major semiconductor company

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Tuesday 28th May 2013

Cadence acquires Cosmic Circuits

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Tuesday 28th May 2013

Plasma-Therm comes top in VLSI research survey

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Tuesday 28th May 2013

SFT reveals products for ESD & electro-thermal analysis

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Friday 24th May 2013

IDC: Semi market slumped in 2012 but should recover in 2013

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Friday 24th May 2013

AMD chips enhance mobile experience

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Friday 24th May 2013

VLSI awards top chip suppliers

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Friday 24th May 2013

UMC 300mm Singapore fab to advance CMOS, Memory & TSV