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Tuesday 4th March 2008
Order for second fab is part of multi million dollar deal to supply combination of stand alone and integrated metrology solutions.
Tuesday 4th March 2008
Global Semiconductor Alliance (GSA) and India Semiconductor Association (ISA) form organisational alliance.
Tuesday 4th March 2008
Strengthened magnets from bacteria could be used to target cancer.
Tuesday 4th March 2008
Agilent acquisition and portfolio enhancement announcements in support of disease and nanotechnology research.
Tuesday 4th March 2008
European Semiconductor Industry Association (ESIA) reveals semiconductor sales data.
Monday 3rd March 2008
Chief Executive Officer (CEO) Eric Meurice accepts extension of contract at ASML.
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Monday 3rd March 2008
The agreement has been signed for test, evaluation and training support services.
Friday 29th February 2008
New Kauffman Foundation paper advances regional policies for fostering entrepreneurially driven economic growth.
Friday 29th February 2008
European Consortium to push the speed limit of silicon based transistor up to 0.5 Tera Hertz (THz).
Friday 29th February 2008
Zygo Corporation announced that it has acquired the assets of Solvision, Inc., a Canadian based company, including the shares of its Singapore subsidiary.
Friday 29th February 2008
The SIMOX-SOI implantation equipment provider is assessing the potential sale of the company with BlueLake Partners LLC.
Friday 29th February 2008
The company reorganises to improve structural profitability and strengthen customer partnership.
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Friday 29th February 2008
Nano construction capability stands to impact future direction of information technology.
Friday 29th February 2008
Company expects transaction will be accretive to Fiscal 2009 earnings by approximately US$0.05 per share.
Thursday 28th February 2008
The devices were made using Extreme Ultra Violet (EUV) lithography on test chip.
Wednesday 27th February 2008
Latest design flow streamlines development and testing of low power systems-on-a-chip. Reduced design and test costs.
Wednesday 27th February 2008
New study paves way for using nanofluids in cameras, microdevices, and displays.
Wednesday 27th February 2008
Technology companies to collaborate on New Copper CMP solutions for 32 nm and 22 nm nodes.
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Wednesday 27th February 2008
The company has received a subsidy of approximately € 3.5 million from the European Union to enable the further development of its innovative lithography machine for producing next generation chips.
Wednesday 27th February 2008
The company becomes an associate member in SEMATECH's 3D Interconnect Programme.
Tuesday 26th February 2008
Board views unsolicited proposal by Japanese company, Sumitomo Heavy Industries and TPG as not in best interests of Axcelis and its shareholders.
Tuesday 26th February 2008
Photomask registration and overlay metrology to enable double patterning lithography.
Tuesday 26th February 2008
A framework contract with module manufacturer Signet Solar has been signed to run until 2011 for the supply of solar modules with a peak output of around 50 megawatt.
Tuesday 26th February 2008
DRAM roadmap to 30nm generation. Step change technology to significantly improve productivity.

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