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Friday 16th November 2007
Tower Semiconductor Limited, an independent specialty foundry, has announced the opening of a representative office in Taiwan to support its increasing presence throughout the Asia Pacific region. Tower's new office will be located in Hsinchu and will serve existing and future regional customers.
Friday 16th November 2007
The global semiconductor market is expected to grow 3.8% on an annualised basis to US$27.2 billion in 2007, according to the autumn 2007 forecast of the World Semiconductor Trade Statistics (WSTS).
Friday 16th November 2007
One year after inaugurating its fourth manufacturing facilities in Wykroty, Poland, HMS has completed its fifth factory in Lodz, Poland, HMS Lodz II. With approximately 2.500 m² of office and manufacturing space the facilities will take up production on 15 December 2007. The HMS property allows for a total expansion of a further 20.000 m² in the future.
Thursday 15th November 2007
XinAo Group, a company with an energy and engineering-related history of over ten years, has become the latest new entrant to the solar market with plans to build a 500MW thin film large substrate plant in China, employing Applied Materials' turnkey ‘SunFab' equipment production line. A contract was signed on 13 November, 2007.
Thursday 15th November 2007
AIXTRON AG has announced the order of a novel pilot manufacturing system specialised for OLED lighting and organic photovoltaic products from the Fraunhofer Institute for Photonic Microsystems (IPMS) in Dresden, Germany.
Tuesday 13th November 2007
Infineon Technologies, a supplier of semiconductor and system solutions, and Advanced Semiconductor Engineering Incorporated (ASE), a semiconductor packaging and test company, have announced a partnership to introduce semiconductor packages with a higher integration level of package size with an almost infinite number of contact elements.
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Tuesday 13th November 2007
Greenlight Energy Resources, an operator of renewable energy projects and an investor in early stage renewable energy companies, Avista Corporation, and several other investors have put US$10 million in Series A funding in GreenVolts, a leader in high concentrating photovoltaic technology and wholesale distributed energy.
Tuesday 13th November 2007
Infineon Technologies AG has announced a strategic technology collaboration for the development of optimised chip solutions for high-density (HD) SIM cards with Intel Corporation.
Tuesday 13th November 2007
S.E.T. (former SUSS MicroTec Device Bonder Division), a supplier of high accuracy die-to-die, die-to-wafer bonding and nanoimprint lithography solutions has announced that the partnership between S.E.T. and CEA Leti has resulted in a radically new generation high accuracy (0.5 µm), high force (4,000 N) device bonder for wafer diameters up to 300 mm. It includes a built-in chamber for collective reflow in a gas or vacuum environment. The system also features nanoimprinting capabilities.
Monday 12th November 2007
Intel Corporation has announced that it will introduce its newest generation of microprocessors, with a sophisticated new approach that crams up to 40% more transistors onto a chip.
Monday 12th November 2007
Aquest Systems, a developer of innovative automation solutions for the global semiconductor industry, has announced the availability of its new FabEX ;No-Wait-ProductivitySM Improvement (NPI) solution.
Monday 12th November 2007
The IBM-led Common Platform alliance plans to increase its investment in semiconductor packaging technology to pave the way to 32nm devices.
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Monday 12th November 2007
BASF has opened its new Electronic Materials Centre Europe in Ludwigshafen, Germany
Friday 9th November 2007
It has been reported PC microprocessor shipments worldwide grew 14.3% sequentially to reach record levels in the third calendar quarter of 2007 (3Q07), according to IDC researchers. Consequently, worldwide PC microprocessor revenue rose 14.8% to US$7.95 billion in the quarter.
Friday 9th November 2007
Chipmaker, ON Semiconductor Corporation, has announced that it has signed an agreement to acquire voltage regulation and thermal monitoring products for computing applications from Analog Devices Incorporated (ADI).
Friday 9th November 2007
According to Jin Seog Choi, chief technology officer at Hynix Semiconductor Incorporated, Korea, Lithography is among the top productivity challenges facing the semiconductor industry, but packaging and testing costs are another area that must be addressed
Friday 9th November 2007
Nanometrics Incorporated, a supplier of advanced metrology equipment to the semiconductor industry, has announced that AIXTRON AG, a provider of deposition tools used in the worldwide production of advanced components for electronic and opto-electronic applications, has purchased the Nanometrics VerteX photoluminescence (PL) mapping system to determine material composition, measure layer thickness and improve the wafer uniformity performance of its equipment.
Thursday 8th November 2007
First Solar, Incorporated of Phoenix, AZ, USA has announced that it has entered into new long term module supply agreements with a subsidiary of international investment and funds and asset manager Babcock & Brown in Australia and Ecostream Switzerland GmbH, a subsidiary of Econcern BV, which focuses on developing solutions for sustainable energy supply.
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Thursday 8th November 2007
Wolfgang Ziebart, chairman of the board at Infineon Technologies AG, has stated that Germany will only be able to remain a prime site for the microelectronics industry if it changes its economic policies.
Thursday 8th November 2007
Rudolph Technologies Incorporated, has announced the launch and first shipments of its new Transparent Thin Film Metrology System.
Thursday 8th November 2007
The Secretary of State for Innovation, Universities and Skills, John Denham, has announced that the Technology Strategy Board will invest a further £100m in innovation, and invited businesses to submit proposals for collaborative research and development in innovation and new technology.
Thursday 8th November 2007
The Secretary of State for Innovation, Universities and Skills, John Denham, has announced that the Technology Strategy Board will invest a further £100m in innovation, and invited businesses to submit proposals for collaborative research and development in innovation and new technology.
Thursday 8th November 2007
It has been reported that in an effort to diversify and expand its business, Peak International has started selling 300mm wafer shippers and is expected to bring to market several more versions in 2008. The company has secured its first customer for its ‘UltraCare' wafer shipper and has built a new dedicated cleanroom to ramp production with a third cleanroom already under construction, the company said.
Thursday 8th November 2007
Synopsys Incorporated, a leader in software and IP for semiconductor design and manufacturing, and the semiconductor foundry, UMC, have announced the release of a 65-nanometer (nm) hierarchical, multi-voltage RTL-to-GDSII reference design flow.

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