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Friday 4th January 2008
Qimonda AG, a memory solutions company, has announced that it has signed an agreement with Macronix International Company Limited, Taiwan, on a joint development of non-volatile memory technologies.
Thursday 3rd January 2008
Worldwide sales of semiconductors rose to US$23.1 billion in November 2007, an increase of 2.3% from the US$22.5 billion in the same period last year, says a report.
Thursday 3rd January 2008
Taiwan Semiconductor Manufacturing Company Limited has announced that the Company has completed a share buyback plan approved by its Board on 13November 2007, which makes up the third phase of TSMC and Philips' multi-phased share release plan.
Wednesday 2nd January 2008
FEI Company and the Netherlands based FOM foundation have announced a joint nanotechnology research project.
Wednesday 2nd January 2008
It has been reported that chip makers are exploring a move to bigger silicon wafers to boost efficiency and help them grab market share as demand for gadgets from music players to cameras surges, but only if someone foots the multi-billion dollar price tag.
Wednesday 2nd January 2008
The market for organic electronics materials will be worth US$4.9 billion in 2012 surging to US$15.8 billion in 2015, according to a new report from NanoMarkets, an industry analyst firm.
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Monday 17th December 2007
STMicroelectronics, a semiconductor manufacturer and a supplier of silicon chips for wireless applications, has announced that it has successfully manufactured the first functional devices to be built using the CMOS 45nm Radio Frequency (RF) technology. This leading-edge technology will be essential for next-generation WLAN (Wireless Local Area Network) applications.
Monday 17th December 2007
Teradyne Incorporated and Nextest Systems Corporation have announced that they have signed a definitive agreement under which Teradyne will acquire Nextest.
Monday 17th December 2007
STATS ChipPAC Limited, an independent semiconductor test and advanced packaging service provider, has announced it has expanded the production floor in its Ulu Klang Free Trade Zone plant in Kuala Lumpur, Malaysia.
Monday 17th December 2007
In light of strong growth in the third quarter, China's semiconductor market appears to be on track to meet iSuppli Corporation's forecast of a 15% revenue expansion in 2007.
Monday 17th December 2007
Dow Corning Compound Semiconductor Solutions (DCCSS) has been awarded a US$4.2 million contract from the U.S. Office of Naval Research to develop semiconductor silicon carbide (SiC) materials technology.
Thursday 13th December 2007
REC has entered into a significant long-term agreement for supply of multi-crystalline silicon wafers to Solland Solar Cells BV.
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Wednesday 12th December 2007
INFICON, a leading manufacturer of instrumentation and process control software for the semiconductor and vacuum-coating industries and other industrial applications, today announced it has acquired Sigma Instruments Inc., a leading manufacturer of instrumentation for the measurement and control of thin film processes.
Tuesday 11th December 2007
Polymer Vision, a spin out of Royal Philips Electronics, has announced first production level rollable displays from its recently acquired manufacturing facility, Polymer Vision (UK) Ltd in Southampton, England.
Tuesday 11th December 2007
The SEZ Group has announced that its Board of Directors has signed a binding transaction agreement with Lam Research Corporation, headquartered in Fremont, Calif. U.S.
Tuesday 11th December 2007
The SEZ Group has announced that its Board of Directors has signed a binding transaction agreement with Lam Research Corporation, headquartered in Fremont, Calif., U.S.
Tuesday 11th December 2007
JSR Micro Incorporated, the US operations of JSR Corporation of Tokyo, Japan, have announced that it has entered a joint research agreement with IBM to explore new technologies for emerging semiconductor materials and processes.
Tuesday 11th December 2007
Nova Measuring Instruments Limited, a provider of stand-alone metrology and of integrated metrology solutions to the semiconductor process control market, announced that a major top 10 semiconductor memory manufacturer has selected the NovaScan platform as its integrated metrology solution for CMP process control in all manufacturing facilities in Korea and China.
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Tuesday 11th December 2007
EV Group, a supplier of wafer-bonding and lithography equipment for the MEMS and nanotech markets, and Brewer Science Incorporated, a developer of semiconductor technology, have claimed a ‘milestone’ in handling and processing of ultrathin wafers.
Tuesday 11th December 2007
The U.S. Department of Energy (DOE) has awarded Xidex Corporation, an Austin, Texas based nanotechnology company a contract for scaleable manufacturing of carbon nanotube (CNT) based field emission sources for use in scanning electron beam instruments such as scanning electron microscopes (SEMs) and transmission electron microscopes (TEMs).
Tuesday 11th December 2007
NIL Technology has increased the availability of cost-efficient nanostructures for nanoimprint lithography (NIL).
Tuesday 11th December 2007
Using room-temperature processing, researchers at the Georgia Institute of Technology have fabricated high-performance field effect transistors with thin films of Carbon 60, also known as fullerene.
Tuesday 11th December 2007
EV Group, a supplier of wafer-bonding and lithography equipment for the MEMS and nanotech markets, and Brewer Science Incorporated, a developer of semiconductor technology, have claimed a ‘milestone' in handling and processing of ultrathin wafers.
Monday 10th December 2007
Semiconductor analyst house Future Horizons has summarised what it describes as a disappointing year for the semiconductor industry in 2007 and gave its predictions for a more respectable 2008.

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