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Tuesday 4th December 2007
Samsung Electronics Company Limited and Toshiba Corporation have announced that they have licensed to one another the rights to produce, market and sell memory with the specifications and trademarks of Samsung's OneNAND and Toshiba's LBA-NAND memory chips.
Tuesday 4th December 2007
The leading manufacturers of semiconductor equipment project 2007 sales are to reach US$41.68 billion according to the year-end edition of the SEMI Capital Equipment Consensus Forecast, released by SEMI at the annual SEMICON Japan exposition.
Tuesday 4th December 2007
ATDF and SVTC Technologies have announced a merger that could change the landscape for semiconductor and nanotechnology development by expanding secure, cost-effective access to advanced process tools and capabilities for a wide range of technology companies.
Monday 3rd December 2007
Aviza Technology Incorporated, a supplier of advanced semiconductor capital equipment and process technologies for the global semiconductor industry and related markets, has reported results for the fourth quarter and year-end of fiscal year 2007.
Monday 3rd December 2007
Cymer Incorporated, a supplier of excimer laser light sources used in semiconductor manufacturing, announced the company reached its goal of demonstrating 100 watts of extreme ultraviolet (EUV) burst power at the 2007 International EUVL Symposium held recently in Sapporo, Japan.
Monday 3rd December 2007
Semilab Co. Limited and SSM Incorporation, both manufacturers of materials metrology solutions to the semiconductor and solar industries, have announced that they have jointly signed a letter of intent whereby Semilab will acquire SSM.
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Monday 3rd December 2007
Semiconductor sales in Europe grew faster than the worldwide market in October according to the World Semiconductor Trade Statistics (WSTS) organisation. This is the fourth successive month where the European market exhibited growth.
Monday 3rd December 2007
Intel Corporation and Advanced Micro Devices Incorporated (AMD) in the third quarter (Q3) both managed to gain share in the global microprocessor market due to robust sales of PCs and servers and the cessation of the companies' price war, according to iSuppli Corporations's final ranking.
Monday 3rd December 2007
Taiwan Semiconductor Manufacturing Company Limited has announced that it has shipped its one-millionth 12-inch 90-nanometer (nm) wafer in record time. The record was reached in just 53 months, surpassing the 58 months it took the 0.13-micron process to reach that milestone.
Monday 3rd December 2007
Tokyo Ohka Kogyo Company Limited (TOK) and Dow Corning Electronics have announced that their new, jointly developed bilayer photoresist is being used in production for the first time by a leading manufacturer of DRAM chips.
Friday 30th November 2007
Qimonda has announced measures to focus its production on 300mm capacities at increased competitiveness, reducing capacities at 200mm manufacturing facilities worldwide.
Thursday 29th November 2007
In an ironic twist of fate, a slowdown in semiconductor production and an associated drop in demand for silicon wafers will ease the shortage of polysilicon used for solar cell production and impact manufacturers as well as equipment suppliers according to a report by The Information Network.
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Thursday 29th November 2007
Trina Solar has announced that it has successfully reached 100% commercial production of 200 micron thickness wafers, down from the previously used 220 micron thickness as the company attempts to improve silicon usage and lower manufacturing costs.
Thursday 29th November 2007
Lam Research Corporation, a supplier of semiconductor wafer fabrication equipment and services, has announced the production release of its new Coronus plasma-based bevel cleaning system.
Thursday 29th November 2007
Amid strong growth in global NAND flash memory sales in the third quarter, Hynix Semiconductor Incorporated, Micron Technology Incorporated and Intel Corporation, impressively outperformed the competition, according to a preliminary ranking from iSuppli Corporation.
Wednesday 28th November 2007
Applied Materials Incorporated has unveiled its Applied UVision 3 system, the industry's highest productivity DUV1 Brightfield wafer inspection tool with the critical-defect detection sensitivity required for 45 nanometer (nm) FEOL2 and immersion lithography.
Wednesday 28th November 2007
Gigle Semiconductor, a developer of ‘any wire' multimedia home networking solutions, has announced that it has received US$20 million in Series B funding. The round was led by a new investor, SEP.
Tuesday 27th November 2007
MagnaChip Semiconductor Limited, an Asia-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications, have announced that it will hold its third Annual Foundry Symposium in Seoul, Korea, on Thursday, November 29th.
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Tuesday 27th November 2007
Global Sources has reported that nearly 90% of solar panel manufacturers in Greater China plan to lower or keep prices stable, despite higher polysilicon prices, to win market share.
Tuesday 27th November 2007
On Seminconductor, a supplier of efficient power solutions, has been honoured by the European Council for Nuclear Research (CERN), with an Industrial Award recognising the company's contribution in supplying complex ‘Pixel Particle Sensor' chips for use in CERN's ATLAS particle physics experiment.
Tuesday 27th November 2007
Atmel Corporation and the Fraunhofer Institute for Integrated Circuits (IIS), Germany, has announced a collaboration to develop systems-on-chip for their mutual clients.
Tuesday 27th November 2007
ENIAC has presented a fully revised version of its Strategic Research Agenda that in its previous releases has already influenced national, trans-national and European research programs in the advanced and strategic field of Nanoelectronics.
Tuesday 27th November 2007
At the MEDEA+ Annual Forum, held in Budapest, an outline of major achievements in;micro- and nanoelectronic innovations was delivered. In the rapidly changing global industrial landscape, Europe's high-tech industry is exposed to ever-increasing technological, economical and societal challenges but has a clear vision on how to exploit new market opportunities.
Monday 26th November 2007
MEMSCAP, a provider of innovative solutions based on MEMS (micro-electro-mechanical-systems) technology, has announces it has finalised the acquisition of 100% of the share capital and voting rights of French company Laboratoires La Licorne, the skin biodermatological treatment specialist.

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