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Thursday 8th November 2007
Synopsys Incorporated, a leader in software and IP for semiconductor design and manufacturing, and the semiconductor foundry, UMC, have announced the release of a 65-nanometer (nm) hierarchical, multi-voltage RTL-to-GDSII reference design flow.
Thursday 8th November 2007
Sony Corporation has announced that it is withdrawing from a joint research project with IBM and Toshiba to develop the production of microchips with a circuitry of 32-nanometres or less.
Thursday 8th November 2007
Tokyo Electron Limited (TEL) has become the first semiconductor supplier company to join SEMATECH's 3D interconnect programme, teaming with several leading;chip-makers who are the programmme's founding members.
Thursday 8th November 2007
Agilent Technologies Incorporated and Velocity11 have announced that they have signed an agreement for Agilent to acquire Velocity11.
Wednesday 7th November 2007
It has been reported that SAFC Hitech has followed up on a previous announcement made in September 2007, when it said it would invest in a facility at the Wuxi-New District Park to make specialty electronic chemicals to meet the growing worldwide demand for its products, with news that further expansions may soon be made that now include South Korea.
Wednesday 7th November 2007
Credence Systems, a provider of test and analytical solutions from design to production for the semiconductor industry, has announced additions to its range of integrated analytical tools designed to meet the complex challenges facing manufacturers of today's advanced 65nm, 45nm and beyond device technologies.
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Wednesday 7th November 2007
Air Liquide has reported that, due to demand levels, it would invest €15 million in a new Electronics Material Centre (EMC) in Japan, which will be dedicated to silane bundle transfilling as well as other high value molecules.
Wednesday 7th November 2007
It has been reported that Oerlikon Corporation have announced that Oerlikon Solar will become a new segment within the Oerlikon Group as the company continues to expand its commitment to its solar business. This new business segment is under the leadership of Oerlikon Solar CEO Jeannine Sargent.
Wednesday 7th November 2007
Total silicon wafer area shipments were 2,174 million square inches during the most recent quarter, up around 5% year-over-year, yet essentially flat sequentially, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.
Wednesday 7th November 2007
In a spirited and entertaining opening ceremony AMD, Carl Zeiss SMT and Qimonda launched a co-operation within the framework of the joint ‘Nanoanalysis' project funded by the German Federal Ministry of Education and Research (BMBF) with a grant of €12 million.
Wednesday 7th November 2007
;Agilent Technologies Incorporated and BioNanomatrix Incorporated have announced that they have entered into a collaboration to develop a new genetic analysis system combining the two companies' technologies.
Tuesday 6th November 2007
It has been announced that Samsung Electronics Company Limited (Korea) has started sampling 1.8-inch and 2.5-inch 64-gigabyte solid state drives with a super-fast SATA (Serial ATA) II/native SATA interface.
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Tuesday 6th November 2007
A free brochure is now available from IDEX Health & Science which describes the technologies and products available from experts in precision fluid handling for ultrapure environments.
Monday 5th November 2007
Mouser Electronics Incorporated has announced it is stocking the CAT4016 16-channel, constant-current sink LED driver from Catalyst Semiconductor Incorporated, a leading supplier of analog, mixed-signal, and non-volatile memory semiconductors.
Monday 5th November 2007
STMicroelectronics today have announced the closing of their deal, to deepen their collaboration on the licensing and supply of integrated circuit designs and modem technologies for 3G and its evolution.
Monday 5th November 2007
SiGe Semiconductor of Ottawa, Canada has revealed plans to expand in Asia by relocating its Hong Kong operations to the Hong Kong Science and Technology Park (HKSTP), a US$1.5 billion project occupying an area of 22 hectares.
Monday 5th November 2007
;STMicroelectronics has laid the first stone at the site of its future chip packaging and test facility in Longgang, Guangdong Province, China.
Monday 5th November 2007
Texas Instruments (TI) has announced the expansion of its commitment to technology innovation in China, by inviting three universities in China, Tsinghua University, Shanghai Jiaotong University, and University of Electronic Science and Technology, to join its Worldwide Leadership University program.
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Monday 5th November 2007
Tower Semiconductor Limited, Israel, has held discussions with Indian chip fabrication and design companies. It is looking to establish technology co-operations with fabs and chip development partnerships with design firms, especially those with analog and mixed-signal expertise.
Monday 5th November 2007
National Semiconductor Corporation has introduced a new line of buck switching regulators that feature high power density and self-synchronisation.
Friday 2nd November 2007
Engineers at IBM’s Burlington, Vermont, semiconductor facility have developed and introduced a novel process for pattern removal on wafers that significantly reduces the process costs and environmental waste. The new process is also currently being implemented at IBM's East Fishkill facility.
Friday 2nd November 2007
ASML Holding NV (ASML) believes there is a potential for the global semiconductor lithography market to grow to above €10 billion (US$14.4 billion) by 2012 from €5 billion (US$7.2 billion) in 2006, representing a 13% annual growth for the market over the period.
Friday 2nd November 2007
It has been reported that Ushio Incorporated, Tokyo, Japan, has said that it has signed a letter of intent to form a partnership with Koninklijke Philips Electronics NV and Jenoptik Laser Optik Systeme GmbH to co-develop extreme ultra violet light (EUV) sources for lithography.
Thursday 1st November 2007
MIT is reporting that they have developed a new ‘tractor beam'. In a feat that seems like something out of a microscopic version of Star Trek, MIT researchers have found a way to use a ‘tractor beam' of light to pick up, hold and move around individual cells and other objects on the surface of a microchip.

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