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Monday 3rd December 2007
Intel Corporation and Advanced Micro Devices Incorporated (AMD) in the third quarter (Q3) both managed to gain share in the global microprocessor market due to robust sales of PCs and servers and the cessation of the companies' price war, according to iSuppli Corporations's final ranking.
Monday 3rd December 2007
Taiwan Semiconductor Manufacturing Company Limited has announced that it has shipped its one-millionth 12-inch 90-nanometer (nm) wafer in record time. The record was reached in just 53 months, surpassing the 58 months it took the 0.13-micron process to reach that milestone.
Monday 3rd December 2007
Tokyo Ohka Kogyo Company Limited (TOK) and Dow Corning Electronics have announced that their new, jointly developed bilayer photoresist is being used in production for the first time by a leading manufacturer of DRAM chips.
Friday 30th November 2007
Qimonda has announced measures to focus its production on 300mm capacities at increased competitiveness, reducing capacities at 200mm manufacturing facilities worldwide.
Thursday 29th November 2007
In an ironic twist of fate, a slowdown in semiconductor production and an associated drop in demand for silicon wafers will ease the shortage of polysilicon used for solar cell production and impact manufacturers as well as equipment suppliers according to a report by The Information Network.
Thursday 29th November 2007
Trina Solar has announced that it has successfully reached 100% commercial production of 200 micron thickness wafers, down from the previously used 220 micron thickness as the company attempts to improve silicon usage and lower manufacturing costs.
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Thursday 29th November 2007
Lam Research Corporation, a supplier of semiconductor wafer fabrication equipment and services, has announced the production release of its new Coronus plasma-based bevel cleaning system.
Thursday 29th November 2007
Amid strong growth in global NAND flash memory sales in the third quarter, Hynix Semiconductor Incorporated, Micron Technology Incorporated and Intel Corporation, impressively outperformed the competition, according to a preliminary ranking from iSuppli Corporation.
Wednesday 28th November 2007
Applied Materials Incorporated has unveiled its Applied UVision 3 system, the industry's highest productivity DUV1 Brightfield wafer inspection tool with the critical-defect detection sensitivity required for 45 nanometer (nm) FEOL2 and immersion lithography.
Wednesday 28th November 2007
Gigle Semiconductor, a developer of ‘any wire' multimedia home networking solutions, has announced that it has received US$20 million in Series B funding. The round was led by a new investor, SEP.
Tuesday 27th November 2007
MagnaChip Semiconductor Limited, an Asia-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications, have announced that it will hold its third Annual Foundry Symposium in Seoul, Korea, on Thursday, November 29th.
Tuesday 27th November 2007
Global Sources has reported that nearly 90% of solar panel manufacturers in Greater China plan to lower or keep prices stable, despite higher polysilicon prices, to win market share.
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Tuesday 27th November 2007
On Seminconductor, a supplier of efficient power solutions, has been honoured by the European Council for Nuclear Research (CERN), with an Industrial Award recognising the company's contribution in supplying complex ‘Pixel Particle Sensor' chips for use in CERN's ATLAS particle physics experiment.
Tuesday 27th November 2007
Atmel Corporation and the Fraunhofer Institute for Integrated Circuits (IIS), Germany, has announced a collaboration to develop systems-on-chip for their mutual clients.
Tuesday 27th November 2007
ENIAC has presented a fully revised version of its Strategic Research Agenda that in its previous releases has already influenced national, trans-national and European research programs in the advanced and strategic field of Nanoelectronics.
Tuesday 27th November 2007
At the MEDEA+ Annual Forum, held in Budapest, an outline of major achievements in;micro- and nanoelectronic innovations was delivered. In the rapidly changing global industrial landscape, Europe's high-tech industry is exposed to ever-increasing technological, economical and societal challenges but has a clear vision on how to exploit new market opportunities.
Monday 26th November 2007
MEMSCAP, a provider of innovative solutions based on MEMS (micro-electro-mechanical-systems) technology, has announces it has finalised the acquisition of 100% of the share capital and voting rights of French company Laboratoires La Licorne, the skin biodermatological treatment specialist.
Friday 23rd November 2007
SEMI has reported that worldwide semiconductor manufacturing equipment billing reached US$11.13 billion in the third quarter of 2007.
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Thursday 22nd November 2007
AIXTRON AG have announced the installation and commissioning of a Nanoinstruments Black Magic 2 inch R&D piece of equipment for carbon nanotube (CNT) growth at the Physics and Chemistry Research Facility, University of Tuebingen, Germany.
Wednesday 21st November 2007
The MEMS Industry Group (MIG), a trade association representing MEMS and microstructure industries, and the MicroElectronics Packaging and Test Engineering Council (MEPTEC) have formed an alliance to support each other's goals and industry events, through a variety of marketing programs.
Wednesday 21st November 2007
Freescale Semiconductor, which has been designing chips and developing software in India since 1998, are planning to establish an International Centre of Excellence for Innovation in Bengaluru, India.
Wednesday 21st November 2007
STATS ChipPAC Limited, an independent semiconductor test and advanced packaging service provider, have announced that it is expanding its flip chip offering to provide customers a complete turnkey solution in China.
Wednesday 21st November 2007
Suss MicroTec has received multiple orders for its lithography production equipment from the ASE Group, a provider of independent semiconductor manufacturing services in assembly and test.
Monday 19th November 2007
North American-based manufacturers of semiconductor equipment posted US$1.23 billion in orders in October 2007 (three month average basis) and a book-to-bill ratio of 0.83 according to the October 2007 Book-to-Bill Report published today by SEMI.

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