STMicroelectronics today have announced the closing of their deal, to deepen their collaboration on the licensing and supply of integrated circuit designs and modem technologies for 3G and its evolution.
SiGe Semiconductor of Ottawa, Canada has revealed plans to expand in Asia by relocating its Hong Kong operations to the Hong Kong Science and Technology Park (HKSTP), a US$1.5 billion project occupying an area of 22 hectares.
Texas Instruments (TI) has announced the expansion of its commitment to technology innovation in China, by inviting three universities in China, Tsinghua University, Shanghai Jiaotong University, and University of Electronic Science and Technology, to join its Worldwide Leadership University program.
Tower Semiconductor Limited, Israel, has held discussions with Indian chip fabrication and design companies. It is looking to establish technology co-operations with fabs and chip development partnerships with design firms, especially those with analog and mixed-signal expertise.
Engineers at IBM’s Burlington, Vermont, semiconductor facility have developed and introduced a novel process for pattern removal on wafers that significantly reduces the process costs and environmental waste. The new process is also currently being implemented at IBM's East Fishkill facility.
ASML Holding NV (ASML) believes there is a potential for the global semiconductor lithography market to grow to above €10 billion (US$14.4 billion) by 2012 from €5 billion (US$7.2 billion) in 2006, representing a 13% annual growth for the market over the period.
It has been reported that Ushio Incorporated, Tokyo, Japan, has said that it has signed a letter of intent to form a partnership with Koninklijke Philips Electronics NV and Jenoptik Laser Optik Systeme GmbH to co-develop extreme ultra violet light (EUV) sources for lithography.
MIT is reporting that they have developed a new ‘tractor beam'. In a feat that seems like something out of a microscopic version of Star Trek, MIT researchers have found a way to use a ‘tractor beam' of light to pick up, hold and move around individual cells and other objects on the surface of a microchip.
Engineers at Florida State University's National High Magnetic Field Laboratory have successfully tested a groundbreaking new magnet design that could literally shed new light on nanoscience and semiconductor research.
The National Microelectronics Institute (NMI), the trade association representing the semiconductor industry in the UK and Ireland, has introduced a free legal assistance service for its members. The service will be provided through Manches LLP, a commercial law firm specialising in technology and intellectual property work.
Cenamps, a national centre for emerging technologies, has secured a major contract to manage the newly created ‘Nanotechnology Knowledge Transfer Network' (KTN), funded by the Government's Technology Strategy Board (TSB).
It has been announced that Silicon & Software Systems (S3) has acquired the analog IP company, Acacia Semiconductor, for an undisclosed sum. The takeover will involve the integration of Acacia's technology and designers to combine with S3's products and design.
Sun Microsystems has formed an ‘eco consortium' in India as part of its eco innovation initiative. The group's member companies, including Wipro Infotech, APC-MGE, Advanced Micro Devices and Hitachi Data Systems, will work to address industry's concerns about limited power, space and energy in India as demand grows here for infrastructure utilisation.
It has been reported Microsemi Corporation of Irvine, CA, USA has been awarded US$1.6m by the USA's Air Force Research Laboratory (AFRL) for its Power Products Group (formerly Advanced Power Technology of Bend, OR, USA) to develop silicon carbide (SiC) RF power semiconductor technology for use in military avionics, communications and radar systems.
It has been reported that global orders in September for chipmaking equipment manufactured by Japanese companies dropped 42.4% from the previous year to 119.5 billion yen, dropping for the seventh consecutive month.
Underscoring its commitment to the mobile market, QuickLogic announces the addition of a serial peripheral interconnect (SPI) Host Controller to its customer specific standard product (CSSP) functional library.
Rising consumer demand for electronics with greater functionality drives semiconductor manufacturers to aggressively scale to smaller device features and generate high volumes in order to offer competitive product prices.
It has been reported that SEMATECH engineers have made significant advances in moving forward the infrastructure that will prepare extreme ultraviolet lithography (EUVL) for cost-effective manufacturing.