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Wednesday 17th October 2007
IMEC has reached an agreement with ASML to install an ASML EUV pre-production tool in IMEC's 300mm facility in 2010.
Wednesday 17th October 2007
The Microsystems Packaging Research Center (PRC) at the Georgia Institute of Technology in Atlanta and IMEC have invited interested parties from global industry to join their advanced research program on next-generation flip-chip and substrate technology.
Tuesday 16th October 2007
Molecular Imprints, Inc. (MII) has announced that Toshiba Semiconductor Company, a global leader in the development and manufacturing of powerful semiconductor devices, has validated the use of MII's imprint lithography technology in developing 22-nm node CMOS devices.
Tuesday 16th October 2007
IMEC has announced two separate steps forward on research aimed at pushing chip technology to 32-nm and below.
Tuesday 16th October 2007
Hitachi Global Storage Technologies could soon offer users 4-terabyte desktop drives.
Tuesday 16th October 2007
A team of researchers at IBM Corporation has reported that they have measured the distribution of electrical charges in tubes of carbon measuring smaller than 2-nm in diameter, which is 50,000 times thinner than a human hair.
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Monday 15th October 2007
Researchers at SEMATECH and University College London (UCL) have identified a potential cause of a perplexing tendency of novel dielectric materials to capture electrons and holes, making the performance of advanced devices unstable.
Monday 15th October 2007
Atmel Corporation and Advanced Semiconductor Technology Ltd. (AST), has announced a collaboration, based on Atmel’s CAP ARM based customisable microcontroller that allows their mutual clients to develop systems-on-chip.
Monday 15th October 2007
Synova, a patent holder of water jet-guided laser technology, has announced that two major Chinese customers have placed orders for systems incorporating Synova's state-of-the-art Laser MicroJet(R) technology for semiconductor and micro-machining applications.
Monday 15th October 2007
Broadcom Corporation , have announced a new single-chip HSPA (high-speed packet access) processor that integrates all of the key 3G (third generation) cellular and mobile technologies on an extremely low power, single 65 nanometer CMOS die.
Monday 15th October 2007
Rim Semiconductor Company, has announced that it has entered into an agreement to evaluate the next generation Cupria IPSL solution in the service network of Canby Telcom of Canby, Oregon.
Monday 15th October 2007
It has been reported that Royal Philips Electronics NV have announced a fall in third quarter earnings, reflecting the sale of the company's semiconductor arm a year ago.
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Monday 15th October 2007
Nextreme has integrated cooling and power generation into the widely accepted copper pillar bumping process used in high-volume electronic packaging.
Monday 15th October 2007
Cadence Design Systems, Inc. has announced the opening of a third research and development facility in Noida.
Friday 12th October 2007
Bede X-ray Metrology, a global provider of X-ray metrology systems to the semiconductor industry, has announced that it has installed a BedeMetrix-F tool at a leading Asian foundry.
Friday 12th October 2007
The Nobel prize for chemistry has been awarded to Gerhard Ertl, now based at Fritz-Haber-Institut der Max-Planck-Gesellschaft in Berlin, for his work in establishing a fundamental experimental approach to surface chemistry.
Friday 12th October 2007
TriQuint Semiconductor, a RF front-end product manufacturer and foundry services provider, was named the world’s largest Gallium Arsenide (GaAs) foundry in a report issued by Strategy Analytics this week.
Friday 12th October 2007
MVTS Technologies (MVTS) has expanded its global presence by appointing EBTECH as its regional agent to market and sell MVTS products, legacy test systems and parts, and support services in Italy.
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Thursday 11th October 2007
The leading suppliers of silicon wafers participated in a consensus survey, obtained from SEMI surveying the SMG members.
Thursday 11th October 2007
The slow down of DRAM manufacturing continues to impact on company orders. In the third quarter 2007, the SEZ Group have announced a preliminary order intake of 48 million Swiss Francs (CHF)-26 percent below its expectations due to the absence of expected orders from the DRAM memory segment, which is still under pricing pressures.
Tuesday 9th October 2007
The SOI Industry Consortium is a non-profit organization composed of 19 founding companies spanning the entire electronics industry infrastructure.
Tuesday 9th October 2007
Flash vendor, Silicon Storage Technology Inc (SST) and Insyde Software Corp, a leading provider of UEFI-based firmware, BIOS and engineering services, have announced the joint development of FlashMate technology, enabling new usage models to notebook PC consumers that will revolutionise their portable computing experience.
Tuesday 9th October 2007
NXP Semiconductors, the independent company founded by Philips, has announced that Hi-Tech Wealth (HTW) has selected its Nexperia Cellular System Solution 5110 for the world’s first commercial solar-powered mobile phone, S116.
Tuesday 9th October 2007
TSMC has said it has signed a deal with Atmel to buy the firm's eight-inch wafer fab equipment in Britain for $82 million.

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