Berkeley Design Automation, Inc has announced that Luminary Micro has chosen the company's Analog FastSPICE circuit simulator for full-circuit verification as well as to verify complex blocks 5x-10x faster – both with full SPICE accuracy.
OneSpin Solutions has announced that it has accepted an invitation from standards body Accellera to become a member and serve on the Unified Coverage Interoperability Standard (UCIS) Technical Subcommittee.
MainConcept has announced that it has signed a partnership agreement with InterQoS, a semiconductor company based in Hong Kong, to jointly develop and market a complete embedded solution capable of addressing the needs of mobile video gadgets.
Samsung Electronics Co. has announced that it has developed a four gigabyte (GB) MCP (multi-chip package) for mobile phones, an industry first, forgoing the need for an external memory card slot and also eliminating the need to develop interface software for all types of NAND memory.
Reported in the new Strategy Analytics study, "Automotive Semiconductor Vendor 2006 Market Shares" the automotive electronics industry saw an increase of $1.12 billion in chip vendor revenues in 2006 in compared to 2005.
Vivace Semiconductor has announced it has signed an agreement with the IGRS Engineering Lab, to jointly develop reference designs based on Vivace's chips that can be used to develop products that are compliant with the new home networking standard.
Brion Technologies has announced the availability of Tachyon Lithography Aware Design (LAD), an extension of the company's Tachyon suite for optical proximity correction (OPC) verification and OPC application.
Oki Electric Industry Co. has announced it has succeeded in developing what is thought to be the world’s first ultra small DSRC (Dedicated Short Range Communication)(1) wireless module for embedding in mobile phones to be used for DSRC inter-vehicle communication systems.