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Tuesday 15th May 2007
AP&S International is continuing to focus attention on its headquarters in Donaueschingen/Aasen in Germany.
Tuesday 15th May 2007
Qimonda has announced that it has started the shipment of new DDR3 components and modules to leading motherboard vendors and manufacturers of overclocking memory modules.
Tuesday 15th May 2007
Anchor Semiconductor and Semiconductor Manufacturing International Corporation (SMIC) have jointly announced the expanded applications and commitment of Anchor's NanoScope Platform solutions in SMIC's advanced manufacturing flows at 65nm node and beyond.
Tuesday 15th May 2007
Signet Solar, Inc. has announced its entry into the fast growing segment of the renewable energy market with its silicon thin film solar technology.
Tuesday 15th May 2007
e2v technologies plc (e2v) has announced that it has agreed to acquire MiCS MicroChemical Systems from Renaissence PME, Saia Burgess Electronics Holding.
Tuesday 15th May 2007
Mentor Graphics Corporation has announced that UMC has expanded its support for the Calibre nm Platform with Calibre YieldAnalyser for all major design flows for its 90 nanometre (nm) and 65nm processes.
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Tuesday 15th May 2007
Extreme DA and Semiconductor Technology Academic Research Centre (STARC) are collaborating to jointly develop and validate a variability-aware timing analysis flow for integrated circuits (ICs) manufactured in 65- and 45-nanometer (nm) processes.
Tuesday 15th May 2007
Members of the International SEMATECH Manufacturing Initiative (ISMI) have agreed to draft a "green fab standard" aimed at building semiconductor factories that will use less energy and water, minimise waste and air pollution, and ultimately save money for chip-makers.
Tuesday 15th May 2007
Spansion Inc. and Taiwan Semiconductor Manufacturing Company have announced the signing of a definitive agreement to begin joint development of variations of MirrorBit technology at 40nm and below.
Tuesday 15th May 2007
STATS ChipPAC has announced plans to establish a new research and development (R&D) facility located in Singapore which will be dedicated to developing next generation technology including through silicon via (TSV) and microbump bonding for three dimensional (3D) die, silicon substrate based packaging solutions, and embedded active die technology.
Tuesday 15th May 2007
FSI International has announced that the U.S. Patent and Trademark;Office has awarded the company a patent for a method which produces ultra-uniform etch results in combination with a rinse/dry step in a single immersion tank for front-end-of-line (FEOL) critical cleans
Monday 14th May 2007
austriamicrosystems and NemeriX have announced shipment of the five millionth NemeriX NJ1006A RF IC.
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Monday 14th May 2007
Samsung Electronics Co has announced that 21 of its DDR3 solutions have been validated on Intel Corporation's reference platform to work with Intel's next generation DDR3 (Double Data Rate – Version 3) chipsets.
Monday 14th May 2007
IBM has announced plans to redistribute $1 billion per annum across its businesses, mobilising the company's resources in a dramatic attempt to increase the level of energy efficiency in IT.
Monday 14th May 2007
STMicroelectronics has announced that it has shipped over 250 million units of energy-saving products in 2006.
Monday 14th May 2007
Micralyne Inc has announced plans for a partnership with Polychromix to manufacture MEMS near-infrared (NIR) devices for the Polychromix Phazir product line.
Monday 14th May 2007
Asyst Technologies, Inc. announced that its 200mm products have been selected by multiple semiconductor fabs including EM Microelectronic of Switzerland, Shanghai Huahong NEC Electronics Co., (HHNEC) of China and additional semiconductor fabs in China and Russia.
Monday 14th May 2007
Elite Semiconductor Memory Technology Inc., Taiwan (ESMT) and Cypress Semiconductor Corp. have announced a Technology Transfer Agreement under which ESMT will acquire Cypress's Pseudo Static Random Access Memory (PSRAM) product line.
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Friday 11th May 2007
Semiconductor Industry Association (SIA) President George Scalise has heralded a bipartisan agreement between the Administration and Members of Congress that will pave the way for progress on key trade opening agreements
Friday 11th May 2007
SUSS MicroTec has announced the official opening of its Application & Measurement Centre in Singapore.
Thursday 10th May 2007
Teridian Semiconductor Corp. celebrated a major company milestone, the shipment of 100 million ICs into cable and satellite digital set-top boxes worldwide.
Thursday 10th May 2007
SMIC (Semiconductor Manufacturing International Company) has signed six Letters of Intent (LOI) outlining plans to purchase semiconductor manufacturing equipment from top American equipment vendors.
Wednesday 9th May 2007
BIOIDENT Technologies Inc has announced its first complete, functional lab-on-a-chip system—the PhotonicFlow System.
Wednesday 9th May 2007
Micronit Microfluidics has introduced four glass microfluidic mixers enabling high-quality mixing of micro or nanoliters of fluids, in fractions of seconds.

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