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Wednesday 7th March 2007
Enuclia Semiconductor, Inc has announced the opening of an international design centre in Taiwan.
Wednesday 7th March 2007
Freescale Semiconductor is setting up a pilot production line at its facility in Tempe, Ariz. for its recently announced Redistributed Chip Packaging (RCP) technology in preparation for volume manufacturing.
Wednesday 7th March 2007
Vette Corp has announced that it has closed $27 million in Series C financing.
Wednesday 7th March 2007
Axcelis Technologies, Inc. has announced that it has received another order for an Optima HD high dose implanter from a major Asian memory manufacturer.
Wednesday 7th March 2007
Infineon Technologies AG has signed a Memorandum of Understanding (MoU) with the Hindustan Semiconductor Manufacturing Corporation (HSMC) to license its 130nm CMOS process technology.
Tuesday 6th March 2007
Intel Corporation and AmberWave Systems Corporation have settled all patent infringement suits pending between them related to AmberWave Systems strained silicon patent portfolio.
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Tuesday 6th March 2007
ARC International has announced new licensing agreements with leading European semiconductor companies and system-on-chip (SoC) design teams.
Tuesday 6th March 2007
TranSwitch Corporation has announced a workforce reduction that is being implemented in two phases.
Tuesday 6th March 2007
Virtus Advanced Sensors (VAS) has announced the establishment of Virtus Asia Limited (VAL), an affiliated Hong Kong company which will focus on R&D, new product development, and sales and marketing in the Chinese Pearl River Delta and southeast Asian region.
Tuesday 6th March 2007
Reflect Scientific Inc. has announced the Company has completed the closing of the Agreement and Plan of Merger with Image Labs International (ILI).
Tuesday 6th March 2007
MOSIS has announced that it will introduce low cost access to the latest 65nm wafer fabrication technologies from IBM, including the foundry's low power and RF technologies.
Tuesday 6th March 2007
Taiwan Semiconductor Manufacturing Company, Ltd. has announced what it claims to be as the foundry's industry first functional 65nm embedded DRAM customer product.
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Tuesday 6th March 2007
Asyst Technologies, Inc. has announced that Asyst's automated material handling system (AMHS) has been selected for Toshiba's newest Fab 4 in Yokkaichi, Japan.
Monday 5th March 2007
Aeroflex Incorporated has announced that it has entered into an agreement to be acquired by General Atlantic and Francisco Partners in a transaction valued at approximately $1.0 billion.
Monday 5th March 2007
MOSIS has announced, prototype and low volume fabrication access to IBM's fourth generation foundry technology, 8WL, the 130 nanometre (nm) silicon germanium (SiGe) bipolar complementary metal oxide semiconductor (BiCMOS) process.
Monday 5th March 2007
Micronic Laser Systems AB announced that another Asian customer has ordered the company's newest tool, the FPS5100 laser pattern generator for advanced electronic packaging applications.
Monday 5th March 2007
Akros Silicon, a fabless semiconductor company has announced that it has secured $10.1 million in Series B financing led by Levensohn Venture Partners.
Monday 5th March 2007
Despite the traditional slow start for January, the European market was relatively stable in comparison with the sales reported in December, on a three months rolling average, in comparison to the weaker results reported from the other Regions.
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Monday 5th March 2007
Applied Materials, Inc. has announced, it has been selected by Moser;Baer India Limited to develop and install in New Delhi, India, the first;Generation (Gen) 8.5 Thin Film Solar Module Production;Line.
Monday 5th March 2007
Global-Tech Appliances announced approval for a capital appropriation for its wholly owned subsidiary, Global Optics Limited ("GOL"), in order to expand GOL's complementary metal oxide semiconductor (CMOS) camera module (CCM) manufacturing facility in Dongguan, China.
Monday 5th March 2007
PI (Physik Instrumente) has announced its 4th annual NanoInnovation Grant.
Sunday 4th March 2007
Good Energies and NorSun have established Sunfilm to manufacture, what they claim to be as, the world's first 5.7m2 tandem thin film photovoltaic modules on glass substrates on a production line supplied by Applied Materials.
Sunday 4th March 2007
Harvard University's Office of Technology Development (OTD) and Rohm and Haas Electronic Materials ( NYSE:ROH )have announced the signing of an agreement licensing to Rohm and Haas a novel class of metal amidinate compounds useful for making thin films of metals and metal compounds by atomic layer deposition.
Sunday 4th March 2007
ASML has announced that it has signed a contract with the Taiwanese Ministry of Economic Affairs (MOEA) to establish the ASML Centre of Excellence (ACE) near Taipei.

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