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Tuesday 27th February 2007
Sumitomo Electric Industries, Ltd. (SEI) has announced it has now shipped more than 10 million semiconductor laser diodes (LD) for the optical fiber communication applications since its first shipment in 1991.
Tuesday 27th February 2007
TAZMO Co., Ltd. and Silecs, Inc. announced that the companies have completed the installation of TAZMO's Spin Coating System at Silecs' new electronic materials production and demonstration facilities in Espoo, Finland.
Tuesday 27th February 2007
Intel Corporation has announced that it will invest $1 billion to $1.5 billion in its Rio Rancho site to retool Fab 11X for production on Intel's next generation 45 nanometre (nm) manufacturing process.
Tuesday 27th February 2007
Cymer, Inc. has announced it has reached an agreement to ship its first revolutionary XLR 500i light source, to lithography system provider--Nikon Corporation.
Tuesday 27th February 2007
Pixer Technology Ltd. (Pixer) announced the sale of a CDC101 system to a major DRAM Flash Manufacturer in Asia-Pacific.
Tuesday 27th February 2007
In the scope of project-ALEGRA" the AMO nanoelectronics group of Dr. Max Lemme was able to manufacture top-gated transistor-like field-effect devices from monolayer graphene.
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Tuesday 27th February 2007
Synova has unfolded a strategic business model allowing select partners to license its proprietary Laser MicroJet technology.
Monday 26th February 2007
Cypress Semiconductor Corp. has announced the addition of UMC as one of its primary foundry partners.
Monday 26th February 2007
Together with researchers from the Max Planck Institute for Biophysics in Frankfurt, the Nano Technology Systems Division of Carl Zeiss SMT has developed a transmission electron microscope for the high-resolution phase contrast imaging of biologic materials.
Monday 26th February 2007
Chartered Semiconductor Manufacturing has announced the extension of its joint development efforts with IBM to include 32-nanometer (nm) bulk complementary metal oxide semiconductor (CMOS) technology. Financial terms were not disclosed.
Monday 26th February 2007
Cabot Microelectronics Corporation has announced that Freescale Semiconductor has selected the Epic D100 CMP polishing pad for use in its manufacturing process
Friday 23rd February 2007
Elpida Memory, Inc. (Elpida) has announced that it has reached a basic agreement with Semiconductor Manufacturing International Corporation (SMIC) and Cension Semiconductor Manufacturing Corporation (Cension) concerning the sale of 200mm wafer processing equipment to Cension.
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Friday 23rd February 2007
API Nanotronics, Corp. announced that it's newest acquisition National Hybrid (NHI) has received over $2 million in new orders.
Thursday 22nd February 2007
Intel Corporation has announced the mobile clinical assistant (MCA), a device which enables nurses to spend more time with patients, do their jobs on the move while remaining connected, and manage the administration of medications.
Thursday 22nd February 2007
Samsung Electronics Co., Ltd has announced that it produced 117 million units in 512 megabit (Mb) equivalents of its OneNAND Flash fusion memory in 2006, a 130 percent increase in production volume from 2005.
Thursday 22nd February 2007
Magma Design Automation Inc. has announced it entered into a joint stipulation with Synopsys Inc.
Thursday 22nd February 2007
Blaze DFM announced that they have signed a letter of intent to merge with Aprio Technologies.
Thursday 22nd February 2007
Catherine Bréchignac and Arnold Migus, respectively CNRS President and General Director, and Hiroyuki Yoshikawa, President of AIST (National Japanese Institute of Advanced Industrial Science and Technology), signed an agreement to create a GDRI (International Research Network) known as ECSAW (Environmental catalysis for sustaining clean air and water).
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Thursday 22nd February 2007
Aviza Technology, Inc. has announced a follow-on shipment of its Sigma fxP physical vapour deposition (PVD) system to a leading U.S.-based supplier of devices for the communications market.
Thursday 22nd February 2007
Rudolph Technologies, Inc. has announced the sale of both front- and back-end inspection systems to austriamicrosystems
Wednesday 21st February 2007
IMEC developed a generic and versatile method to synthesize stable, biocompatible magnetic nanoparticles.
Wednesday 21st February 2007
Elron Electronic Industries Ltd. has announced that ChipX Corporation, 29% held by Elron has completed the acquisition of the US ASIC business assets of Oki Semiconductor Company, a division of Oki America Inc.
Wednesday 21st February 2007
Conexant Systems, Inc. announced that it has received $98.1 million as a result of the completion of the merger between Acquicor Technology Inc., and Jazz Semiconductor.
Wednesday 21st February 2007
ColorChip has announced that it has completed a $7.4 million funding led by Vertex Venture Capital, joining existing investors including Bessemer, Eurofund , Motorola , Polytechnos and Walden Israel Venture Capital.;;

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