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Tuesday 13th March 2007
NANOIDENT Technologies has announced it has opened a manufacturing facility for the delivery of printed semiconductor-based optoelectronics.
Tuesday 13th March 2007
Blaze DFM has announced that it has closed its Series B round of funding for $10 million.
Monday 12th March 2007
Royal Philips Electronics and Taiwan Semiconductor Manufacturing Company Ltd have jointly announced that the companies have agreed to a multi-phased plan to facilitate an orderly exit by Philips from its current shareholding in TSMC.
Monday 12th March 2007
Ceterus Networks announced a $20M funding round led by Intel Capital. Sevin Rosen and ComVentures, both investors since inception, and Aldus Equity, a new investor, also participated in the funding.
Monday 12th March 2007
CCMP Capital have reached agreement with The Linde Group to acquire BOC Edwards.
Monday 12th March 2007
Veeco Instruments Inc. has announced that its new BioScope II Atomic Force Microscope (AFM) is aiding in advanced biophysics research at the University of Pennsylvania.
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Friday 9th March 2007
The future of 193 nm immersion (193i) lithography will be driven by the demonstration of a high-index lens material, invention of a third generation immersion fluid, and development of a high-index photoresist, SEMATECH-sponsored scientists reported at last week's SPIE Advanced Lithography Symposium.
Friday 9th March 2007
Nokia and the University of Cambridge, UK, have announced an agreement to work together on an extensive and long term programme of joint research projects.
Friday 9th March 2007
With the joint support of National Basic Research Program (973 Program), the National Natural Science Foundation of China, and CAS Knowledge Innovation Program between 04/2002 and 09/2006, a research team led by Prof. HAN Xiufeng from the CAS Institute of Physics has recently developed a demo device for a new type of MRAM.
Friday 9th March 2007
Silicon Valley Technology Centre (SVTC) announced that it is now an independent company, having closed its previously announced purchase by two private equity firms. SVTC, formerly a business unit of Cypress Semiconductor Corp. was sold to Oak Hill Capital Partners and Tallwood Venture Capital.
Thursday 8th March 2007
ASML Holding NV (ASML) has announced that it has completed its acquisition of Brion Technologies, Inc.
Thursday 8th March 2007
Qimonda AG has announced the planned expansion of its existing facility for the assembly and testing of memory ICs (back-end) in the Suzhou Industrial Park.
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Thursday 8th March 2007
Xradia, Inc. has announced the closing of a $7.0 million equity in a series D financing round.
Thursday 8th March 2007
Kulicke & Soffa Industries, Inc. have announced the receipt of purchase orders for a combination of 12 Easyline die bonders and 50 Maxum Ultra/Elite wire bonders.
Thursday 8th March 2007
The Flemish Minister of Science and Innovation, Fientje Moerman, have signed a new frame agreement between IMEC and the Government of Flanders for the period 2007-2011.
Wednesday 7th March 2007
Silicon Valley Solar announced that they have finalized an agreement with Conergy AG that will enable a more rapid market introduction of the company's Sol-X2 internal concentrator solar modules.
Wednesday 7th March 2007
CICLON Semiconductor Device Corporation announced the close of its second round of financing at $12 million.
Wednesday 7th March 2007
Enuclia Semiconductor, Inc has announced the opening of an international design centre in Taiwan.
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Wednesday 7th March 2007
Freescale Semiconductor is setting up a pilot production line at its facility in Tempe, Ariz. for its recently announced Redistributed Chip Packaging (RCP) technology in preparation for volume manufacturing.
Wednesday 7th March 2007
Vette Corp has announced that it has closed $27 million in Series C financing.
Wednesday 7th March 2007
Axcelis Technologies, Inc. has announced that it has received another order for an Optima HD high dose implanter from a major Asian memory manufacturer.
Wednesday 7th March 2007
Infineon Technologies AG has signed a Memorandum of Understanding (MoU) with the Hindustan Semiconductor Manufacturing Corporation (HSMC) to license its 130nm CMOS process technology.
Tuesday 6th March 2007
Intel Corporation and AmberWave Systems Corporation have settled all patent infringement suits pending between them related to AmberWave Systems strained silicon patent portfolio.
Tuesday 6th March 2007
ARC International has announced new licensing agreements with leading European semiconductor companies and system-on-chip (SoC) design teams.

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