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Saturday 26th May 2007
Oerlikon Leybold Vacuum offers a broad range of advanced vacuum solutions for use in manufacturing and analytical processes, as well as for research purposes. The Segment’s core capabilities centre on the development of application- and customer-specific systems for the creation of vacuums and extraction of processing gases. Areas of application are to be found in the coating of microchips, CDs and DVDs during production, as well as in the manufacturing of optical glass that can only be coated in a vacuum.
Friday 25th May 2007
WJ Communications, Inc. has announced that it has sold its wafer manufacturing equipment and entered into a technology license and foundry agreement with AmpTech, Inc.
Friday 25th May 2007
Fujitsu Limited (Fujitsu), Fujitsu Microelectronics of America, Inc. (FMA), and Jazz Semiconductor, Inc. (Jazz announced that they will work together to manufacture System-on-Chip (SoC) products for RFCMOS devices.
Friday 25th May 2007
Sequence Design has announced a collaborative effort with Mentor Graphics that has resulted in an integrated electronic system level (ESL) power exploration flow.
Thursday 24th May 2007
Brion Technologies in collaboration with Japan's Semiconductor Technology Academic Research Centre (STARC) will work to develop and test a complete design-for-manufacturing (DFM) workflow.
Thursday 24th May 2007
Dialog Semiconductor Plc and E Ink Corporation have both announced the launch of new products resulting from a strategic partnership that will open up new markets for electronic paper displays (EPD). ;;
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Thursday 24th May 2007
Hynix Semiconductor Inc. (Hynix) has entered into a strategic partnership with IMEC to perform research and development for the (sub)-32nm memory process generations.
Thursday 24th May 2007
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Thursday 24th May 2007
Akustica, Inc. and DALSA Corporation's have announced the formation of a strategic silicon foundry relationship.
Thursday 24th May 2007
EV Group (EVG) has successfully installed an EVG620 mask aligner at Danchip.
Wednesday 23rd May 2007
TechnoConcepts has announced an important milestone in the implementation of reconfigurable radio for high volume commercial markets.
Wednesday 23rd May 2007
Intel Corporation has announced that its future processors, beginning with its entire family of 45 nanometre (nm) high-k metal gate (Hi-k) processors, are going 100 percent lead-free.
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Wednesday 23rd May 2007
AMD and Taiwan Semiconductor Manufacturing Company, have announced AMD has selected TSMC's 65nm process for a broad segment of its graphics processing unit (GPU) product lineup.
Wednesday 23rd May 2007
Nanoident Technologies has announced that it has delivered what is thought to be the world's largest printed semiconductor-based photodetector array on a flexible PET foil substrate.
Wednesday 23rd May 2007
In a move that signals a firm and ongoing commitment to future technology development, IBM and its joint-development alliance partners Infineon Technologies and Freescale Semiconductor along with its Common Platform technology partners Chartered Semiconductor Manufacturing and Samsung Electronics, have signed a series of semiconductor process development and manufacturing agreements.
Wednesday 23rd May 2007
Inficon has been awarded an order of USD 2.3 million from a major memory chip manufacturer in Taiwan for multiple in situ metrology sensors, FabGuard advanced process software, and high performance leak detectors.
Wednesday 23rd May 2007
Oki Electric Industry Co and Takasago Thermal Engineering Co. have announced their agreement to form an alliance in information and telecommunication equipment.
Wednesday 23rd May 2007
Micrologic has announced that it has joined the Cadence Connections program of Cadence Design Systems. The program promotes open interoperability between Cadence technologies and other companies' design tools.
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Wednesday 23rd May 2007
AMI Semiconductor was selected by Broadcom as a design and technology partner for two new highly-integrated power sourcing equipment (PSE) controllers for use in Broadcom's Power over Ethernet (PoE) products.
Wednesday 23rd May 2007
Infineon Technologies has announced that it has been supplying semiconductors to the T-money (Transportation money) project in the greater Seoul area of Korea.
Tuesday 22nd May 2007
Vivace Semiconductor and Discretix have announced that Vivace has licensed Discretix CryptoCell security platform for Vivace's VSP family of processors.
Tuesday 22nd May 2007
Semiconductor Research Corporation (SRC) has joined with the National Science Foundation (NSF) to announce funding of $2M in grants for nanoelectronics research at six major NSF centres across ten U.S. universities.
Tuesday 22nd May 2007
QUALCOMM MEMS Technologies and Ubixon Co have announced an agreement to integrate QUALCOMM's Micro-Electro-Mechanical Systems (MEMS) displays into the next generation of Ubixon Bluetooth stereo headset products.
Tuesday 22nd May 2007
UMC has recently celebrated the grand-opening of its new R&D centre for nanometre technologies that coincided with the company's 27th anniversary.

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