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Friday 15th October 2004
Oki has developed a hybrid heat radiation material that reduces 30% of intense heat generated by electronic equipment.
Friday 15th October 2004
OSRAM Opto Semiconductors is applying its thin-film technology to infrared (IR) emitter diodes.
Friday 15th October 2004
Philips Semiconductors reports Q3 sales of EUR1.388bn, a nominal increase of 11% (comparable 14%) on Q3 2003.
Friday 15th October 2004
Novellus is to pay Semitool $2.9mn under a settlement of patent litigation in the US Oregon district court.
Thursday 14th October 2004
ASM International has entered into an agreement with Europe's IMEC research centre to deliver a full suite of 300mm front-end-of-the-line (FEOL) semiconductor wafer processing equipment and to participate in several of IMEC's research programs as a strategic partner. The equipment is to be delivered in Q4 2004 and 2005. The strategic partnership includes participation for three years in IMEC's 300mm, sub-45nm related technology development programs.
Thursday 14th October 2004
EV Group and Datacon Technology have agreed joint development of advanced-chip-to-wafer (AC2W) technology. The two companies will also conduct joint strategic marketing and sales activities to promote the co-operation.
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Wednesday 13th October 2004
Chip manufacturer Philips, research institution RWTH Aachen and equipment supplier AIXTRON signed a collaboration agreement aiming at the joint development of large-area white organic light emitting diodes (OLED).
Wednesday 13th October 2004
The European Commission (EC) has decided to formally ask France, the Netherlands, Finland and Sweden for information on certain invitations to tender launched by authorities in those countries for the supply of computer equipment. The EC is concerned with tenders that require the procurement of Intel microprocessors or microprocessors using a specific clock rate.
Tuesday 12th October 2004
Freescale Semiconductor, Motorola's semiconductor spin-off, and TSMC have signed an agreement to jointly develop a new generation of silicon-on-insulator (SOI) high-performance transistor front-end technology targeted for the 65nm CMOS process node. The three-year agreement also provides TSMC with manufacturing rights to Freescale's 90nm SOI technology.
Monday 11th October 2004
STMicroelectronics is to be the first global semiconductor manufacturer to become a partner in the Chinese Open Platform Initiative that is developing a computing platform based on Linux open-source software.
Monday 11th October 2004
Infineon Technologies and Finisar have agreed to reduce the number of shares needed for Finisar is to acquire Infineon's Fibre Optics business unit based in Berlin, Germany. The terms were modified in part due to the operating results for the business unit during the past six months.
Monday 11th October 2004
International Rectifier's Newport, Wales, facility has earned a UK energy efficiency award from the National Microelectronics Institute (NMI) trade group. The annual British Energy-NMI Energy Efficiency Award is bestowed on the semiconductor facility that has best shown environmental stewardship through significantly reducing energy consumption and gas emissions.
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Monday 11th October 2004
STMicroelectronics is to be the first global semiconductor manufacturer to become a partner in the Chinese Open Platform Initiative that is developing a computing platform based on Linux open-source software.
Monday 11th October 2004
BOC Edwards has opened a new European pump remanufacturing facility at Crawley, UK.
Monday 11th October 2004
IBM researchers have created room-temperature vanadium oxide (VnOx) nanotube ferromagnets (Nature, October 7, 2004).
Monday 11th October 2004
UK firm Jennic is repositioning its wireless connectivity business from an intellectual property (IP) approach to a fabless manufacturing business model, offering complete integrated circuits (IC) directly to its customer base.
Monday 11th October 2004
KLA-Tencor and IMEC have entered into a joint-development project (JDP) to accelerate the adoption of optical critical dimension (CD) metrology technology for next-generation (65nm and below) semiconductor applications.
Monday 11th October 2004
Oxford Instrument Plasma Technology (OIPT) has officially opened a new molecular beam epitaxy (MBE) production facility in East Grinstead, UK.
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Monday 11th October 2004
Hynix Semiconductor has completed the sale of its non-memory semiconductor operations to Citigroup Venture Capital for KRW954.3bn ($831.2mn).
Monday 11th October 2004
Market researcher Gartner reports that world capital semiconductor equipment spending is "on pace" to grow 66% in 2004.
Monday 11th October 2004
The Taiwan foundries report September 2004 sales - TWD23.174tr for TSMC and TWD11.864tr for UMC.
Monday 11th October 2004
BOC Edwards will supply fluorine gas to Hynix Semiconductor's 300mm semiconductor manufacturing facility in Ichon, South Korea.
Monday 11th October 2004
Soitec is claiming the industry's first germanium-free, strained silicon-on-insulator (SOI) solution for partially-depleted (PD) CMOS IC architectures.
Monday 11th October 2004
SemiSouth Laboratories is to develop and integrate silicon carbide (SiC) power transistors and control circuitry within a compact power module with funding from a $2.67mn Advanced Technology Program (ATP) award from the US National Institute of Standards and Technology (NIST).

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