BOC Edwards has opened a new European pump remanufacturing facility at Crawley, UK. The GBP1.2mn facility includes decontamination facilities, two flow-lines, a clean room and an award winning wastewater-recycling plant.
Soitec is claiming the industry's first germanium-free, strained silicon-on-insulator (SOI) solution for partially-depleted (PD) CMOS IC architectures. The new PD-sSOI has a thick 40nm strained silicon layer that exhibits excellent thickness and strain uniformity across the entire wafer. Testing also verifies that this high-level strain can be maintained throughout the subsequent high-temperature processes used in the semiconductor manufacturing cycle.
UK firm Jennic is repositioning its wireless connectivity business from an intellectual property (IP) approach to a fabless manufacturing business model, offering complete integrated circuits (IC) directly to its customer base.
KLA-Tencor and IMEC have entered into a joint-development project (JDP) to accelerate the adoption of optical critical dimension (CD) metrology technology for next-generation (65nm and below) semiconductor applications.
Hungarian semiconductor materials metrology company Semilab has completed the acquisition of substantially all of the assets of SemiTest, a US based manufacturer of semiconductor metrology systems. The transaction was structured as a purchase of all assets related to SemiTest's Surface Charge Analyzer (SCA) and epitaxial growth metrology (Epimet) product lines for an undisclosed cash amount.
Austriamicrosystems Full Service Foundry business unit has produced a fully automotive qualified CMOS 50V high voltage process for its 0.35micron technology platform. The process is a modular extension of the 0.35micron CMOS licensed from TSMC permitting reuse of digital designs.
Oxford Instrument Plasma Technology (OIPT) has officially opened a new molecular beam epitaxy (MBE) production facility in East Grinstead, UK. Oxford Instruments acquired VG SemiconÕs MBE business from Thermo Electron Corporation in October 2003.
Business software developer SAP and chipmaker Infineon Technologies have jointly produced a radio frequency identification (RFID) platform to connect and manage RFID hardware and software from multiple vendors.