Info
Info
News search:

< Page of 405 >

News


Tuesday 30th March 2004
New bonded door seals with Kalrez® perfluoroelastomer parts from DuPont Dow Elastomers make wafer processing more productive. Presented by DuPont Dow at Semicon Europa 2004 (stand B1.276) these seals are designed for etch, ash, HDPCVD, PECVD, SACVD and metal CVD wafer processing and outperform conventional O-rings in slit and gate valve door seal applications. For more details: www.kalrez.com/bonded DuPont Dow Elastomers S.A. 2, chemin du Pavillon CH-1218 Le Grand-Saconnex Geneva, Switzerland Tel: ++41 22 717 4000 Fax: ++41 22 717 4001 Kalrez® is a registered trademark of DuPont Dow Elastomers
Monday 29th March 2004
SUSS MicroTec says that it has developed a system that can for the first time carry out analytical probing of test structures as small as 30x30microns. MicroAlign is designed to meet the needs of wafer-level reliability test structures. These structures are put in the "kerf" area between the chips that is destroyed during the wafer sawing process.
Friday 26th March 2004
Dr Ulrich Schumacher resigned as chief executive of Infineon Technologies.
Wednesday 24th March 2004
We have doubled our circulation. European Semiconductor email newsletter now broadcasts to over 10,000 readers including all last years visitors to the Semicon Europa Event. We will be bringing you all the latest news and information on Semicon Europa 2004 as well as our familiar weekly content. For ES newsletter sponsorship opportunities click here
Wednesday 24th March 2004
Philips Electronics, Sony and E Ink claim the world's first consumer application of an electronic paper display module in Sony's new e-Book reader, LIBRIe, scheduled to go on sale in Japan in late April 2004. The Philips' display uses E Ink's electronic ink technology to offer a paper-like display with a contrast level similar to newsprint.
Wednesday 24th March 2004
Trikon Technologies announced successful completion of the Semiconductor Equipment Association (SEA) Advanced CVD Tool for Integration of Organosilicate Nanoporous Films (ACTION) project based at the Crolles II alliance development facility in France.
Info
Monday 22nd March 2004
The Fraunhofer Institute for Microelectronic Circuits and Systems (IMS) organisation in Germany has set up a CMOS production line in Duisburg for the ZigBee wireless standard. Fraunhofer says that the bandwidth offered by alternative standards such as Bluetooth exceed what many devices need and that the power consumption is also more than necessary.
Thursday 18th March 2004
Scientists at IBM's TJ Watson Research Center have developed a high-mobility ultrathin semiconducting film prepared by spin coating (Nature, March 18, 2004). The technique promises simple, low-cost products. The researchers have boosted electron mobilities by about 10 times over that reported for all other similar approaches.
Wednesday 17th March 2004
The European Commission approved aid for the Infineon’s DRAM packaging and final test facility in Vila do Conde, Grande Porto, Portugal. The Infineon Portugal plant is the only back-end unit in the DRAM production sector in Europe.
Wednesday 17th March 2004
Scientists in Berlin are seeking to commercialise technology designed to improve the growth efficiency of epitaxially produced quantum dot (QD) semiconductor elements such as laser diodes. The new technology significantly reduces electrical losses and optical scattering losses of the resulting semiconductor devices, reducing energy consumption.
Tuesday 16th March 2004
Infineon Technologies is to buy the 13% minority holding in the Infineon Technologies SC300 fab in Dresden, Germany, owned by Leipziger Messe and SC 300 Beteiligungs for approximately EUR278mn. The acquisition will be financed through increasing Infineon’s capital by approximately 27mn new shares through a capital increase in kind.
Tuesday 16th March 2004
French company 40-30 has acquired Incam Solutions, a spin off from the LETI French microelectronics R&D centre based in Grenoble, France, founded in 1997. Incam’s front opening unified pod (FOUP) products are dedicated to single wafer applications with the FFO (FOUP For One). The technology is protected by international patents.
Info
Tuesday 16th March 2004
Hymite has closed a second financing round totalling EUR9.7mn (DKK72.3mn). The company is developing hermetic and non-hermetic assembly and encapsulation micro-housing technologies for semiconductors, optical and micro-electro-mechanical system (MEMS) devices.
Tuesday 16th March 2004
Unitive has developed and qualified an electroplated lead-free bumping technology. Upon completing internal qualification, UST also achieved production qualification status for Infineon Technologies. The SnAg lead-free solution enables replacement of eutectic solder with a lead-free solder.
Tuesday 16th March 2004
The European Commission (EC) has approved R&D aid for Altis Semiconductor based in France. The aid is intended to help set up a "HyperSoc" research centre for the design and development of 120-90nm non-volatile magnetic memory with copper interconnects. The company hopes to develop a new generation of on-chip magnetic memory for use in computers, mobile communications, card products or other applications.
Friday 12th March 2004
German deposition equipment supplier Aixtron will install a 200/300mm multi-chamber Tricent platform in IMEC's 300mm cleanroom for Atomic Vapour Deposition (AVD) of advanced CMOS gate stacks. Aixtron is also joining IMEC's sub-45nm research platform as an equipment partner. Among the applications where Aixtron’s technology could be helpful is deposition of high-k gate oxide replacments and metal gate electrodes.
Friday 12th March 2004
Applied Materials and Soitec have agreed to jointly develop advanced germanium-on-insulator (GeOI) and other related critical Ge-based processes designed to significantly enhance transistor performance at the 45nm and beyond technology nodes. The companies will combine Soitec's Smart Cut and engineered substrate expertise with the epitaxial deposition capabilities of the Applied’s Centura reduced pressure (RP) epitaxial deposition system.
Wednesday 10th March 2004
The European Commission NANOCMOS project began March 1, 2004, to push the semiconductor industry to 45nm production and beyond. The first phase is for 27months up to June 2006. The next phase will need European Commission and MEDEA+ approval and calls for participation are expected to begin in mid-2005 for a start in 2006.
Info
Wednesday 10th March 2004
Matsushita Electric Industrial (MEI) has joined IMEC’s sub-45nm research platform as a core partner. In 2003, the European research centre launched the centralised research platform to develop sub-45nm process technologies in line with the semiconductor technology roadmap. This research platform is designed to allow companies to collaborate during the research phase and reduce individual risk and costs, while deriving results more quickly by working together in a state-of-the-art facility. The research targets technology generations two to three nodes ahead of state-of-the-art IC production.
Wednesday 10th March 2004
Philips Electronics is to extend its access to IMEC’s research facilities and expertise until the end of 2008. Philips Research’s Leuven organisation plans further joint research with IMEC on specialised semiconductor processes and advanced CMOS technologies in preparation for continued process development with Philips’ Crolles2 Alliance partners, STMicroelectronics and Motorola.
Wednesday 10th March 2004
Three labs (metrology, electronics and micro-engineering ) from the Ecole Polytechnique Federale de Lausanne (EPFL) in Switzerland have jointly realised a device integrating both optics (waveguides, interferometer) and CMOS electronics on a silicon-on-insulator (SOI) substrate. Only one extra mask and etch process was need to produce the device.
Wednesday 10th March 2004
The BAOBERLIN research group in Germany has invented a novel contact structure for electric II-VI semiconductor components such as blue-green laser diodes. The new structure is designed to significantly reduce the troublesome large contact resistance commonly hindering II-VI work.
Wednesday 10th March 2004
PolyApply is a four-year research project launched by the European Commission under its 6th Research, Technological development and Demonstration Framework Programme. The aim is to lay the foundations of a scalable and ubiquitously applicable communication technology that will make ‘ambient intelligence’ commercially viable through the use of low-cost, polymer-based electronic circuits.
Thursday 4th March 2004
PVA TePla’s Crystal Growing Systems division has successfully implemented the first commercially available production vertical gradient freeze (VGF) crystal growing system at Freiberger Compound Materials (FCM), a leading manufacturer of gallium arsenide and other compound semiconductor wafers.

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info