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Wednesday 27th February 2008
Rohm and Haas announces further IBM partnership
Wednesday 27th February 2008
MAPPER Lithography receives millions in subsidy from EU
Wednesday 27th February 2008
Accretech joins SEMATECH’s collaborative programme
Tuesday 26th February 2008
Axcelis Technologies unanimously rejects unsolicited takeover proposal
Tuesday 26th February 2008
Carl Zeiss & SEMATECH develop novel design
Tuesday 26th February 2008
Phoenix Solar AG signs module supply contract
Tuesday 26th February 2008
Qimonda announces technology breakthrough
Tuesday 26th February 2008
Materials for thin film and organic photovoltaics will reach $3.8 billion by 2015
Tuesday 26th February 2008
3DLABS establishes design and support office in Hangzhou, China
Tuesday 26th February 2008
Micromem has designed a new process architecture for MRAM
Tuesday 26th February 2008
OMRON to release new MEMS mass flow sensor for fuel cells
Tuesday 26th February 2008
STMicroelectronics and Freescale joint design efforts deliver “first silicon”
Monday 25th February 2008
IMEC obtains record efficiency of 24.7% for GaAs solar cells
Monday 25th February 2008
Nokia and University of Cambridge launch the Morph
Monday 25th February 2008
Rohm and Haas announces agreement with IBM
Monday 25th February 2008
Synova teams with Fraunhofer ISE and photovoltaic manufacturers
Friday 22nd February 2008
Credence sells its diagnostics and characterisation business
Friday 22nd February 2008
Australian research team develops very fast radio chip, struth!!!
Thursday 21st February 2008
Lithography technology for the 32 nm generation
Thursday 21st February 2008
Sun selects TSMC to fab 45 nm and future generation processors
Thursday 21st February 2008
West Bengal hard sells Kolkata to semiconductor industry
Thursday 21st February 2008
Berkeley Design Automation selected by Japanese supercomputer project
Thursday 21st February 2008
Agilent Technologies Joins LTE/SAE Trial Initiative
Thursday 21st February 2008
KLA-Tencor enters photovoltaic market
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