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Wednesday 14th July 2004
BOC Edwards has established a joint development programme with the IMEC European research centre in Belgium. The programme focuses on the application of supercritical CO2 (scCO2) cleaning processes for the manufacture of next-generation semiconductor devices.
Wednesday 14th July 2004
European companies Soitec and ASM International claim a major breakthrough in their joint development effort to combine the speed/performance benefits of strained silicon with the power/performance benefits of silicon-on-insulator (SOI) technology with "wafer level" strain.
Wednesday 14th July 2004
Tower Semiconductor expects to ramp production of 0.13micron technology node in Fab 2, Israel, early next year.
Wednesday 14th July 2004
Texas Instruments (TI) and Japan's NTT DoCoMo have made a joint agreement to develop a multi-mode UMTS (W-CDMA/GSM/GPRS) chipset to serve the Japanese, US and global 3G handset market.
Wednesday 14th July 2004
Semitool believes that it has won a key ruling in a patent infringement lawsuit filed against Novellus Systems in June 2001.
Wednesday 14th July 2004
SEMI's semiconductor manufacturer consensus expectation is for 63% growth to revenues this year.
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Wednesday 14th July 2004
BOC Edwards has completed installation of FabWorks32, a fabwide vacuum and exhaust management monitoring system, at the new 300mm Infineon chip manufacturing facility in Dresden, Germany.
Wednesday 14th July 2004
IMEC has launched an industrial affiliation programme (IIAP) on embedded RAM concepts for second and higher levels of on-chip cache memory.
Wednesday 14th July 2004
IMEC has developed a miniature 1cm3 3-dimensional stacked system-in-a-cube (SiC) for wireless bioelectronic communications systems.
Wednesday 14th July 2004
Mitsubishi Electric has developed a 2Mpixel CCD camera module which is a mere 7.42mm thick, making it the industry's thinnest - at least on May 30, 2004.
Tuesday 13th July 2004
European companies Soitec and ASM International claim a major breakthrough in their joint development effort to combine the speed/performance benefits of strained silicon with the power/performance benefits of silicon-on-insulator (SOI) technology with “wafer-level” strain.
Monday 12th July 2004
Knights TechnologyÕs YieldManager software is to be installed into the next generation of AMDÕs Automated Precision Manufacturing technology suite, APM version 3.0. The process control system will be used at AMDÕs 300mm Fab 36 in Dresden, Germany.
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Monday 12th July 2004
AIXTRON is to take part in a project targeting the improvement of LED technology for solid state lighting. The three-year project will be conducted by the Laboratory of Semiconductor Optics, Stepanov Institute of Physics of the National Academy of Sciences of Belarus and is funded by the International Science & Technology Center in Russia (ISTC).
Friday 9th July 2004
Infineon Technologies will be offering new chip card controllers for improved security of electronic identity cards and passports when the first global tests on electronic ID cards and passports commence later this year. Infineon claims double the storage capacity at 64kBytes and state-of-the-art security features for its new products. The Infineon security controllers contain more than 50 individual security mechanisms built into the chip.
Friday 9th July 2004
Infineon Technologies has increased its automotive industry focus by joining the FlexRay consortium and is now a premium member in the AUTOSAR (AUTomotive Open System ARchitecture) development partnership.
Friday 9th July 2004
Nottingham University in the UK has ordered Veeco Instruments GEN III molecular beam epitaxy (MBE) system. The R&D system will be used to investigate multiple materials for spintronic applications.
Friday 9th July 2004
International SEMATECH in the USA and Exitech in the UK have announced an agreement to develop the world's first ultra high numerical aperture (NA=1.3) 193nm wavelength immersion lithography tool.
Friday 9th July 2004
Infineon Technologies has increased its automotive industry focus by joining the FlexRay consortium and is now a premium member in the AUTOSAR (AUTomotive Open System ARchitecture) development partnership.
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Friday 9th July 2004
SEMATECH has created an independent subsidiary from its R&D wafer fab and associated analytical laboratories.
Friday 9th July 2004
Fairchild Semiconductor has opened a joint product development laboratory with Sichuan Changhong Electric, a manufacturer of consumer devices in China.
Friday 9th July 2004
LUMILEDS has made a long-term purchase order with AIXTRON for an anticipated epi system capacity ramp up within the coming four years.
Friday 9th July 2004
Gartner released capital expenditure and equipment revenue forecasts up to 2008.
Friday 9th July 2004
ITokyo Electron (TEL) is to collaborate with IMEC in research on 193nm immersion lithography.
Friday 9th July 2004
Tessera Technologies has signed an IC packaging licensing agreement with NEC Electronics.

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