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Thursday 29th April 2004
Unaxis Wafer Processing has partnered with the University of Central Florida (UCF) in advanced optics development. These R&D efforts will use a Unaxis SHUTTLELINE plasma etch system to fabricate complex micro-optical elements using wafer based manufacturing techniques.
Thursday 29th April 2004
Six universities and seven companies in the UK began a GBP4.5mn project to halve the cost of converting the sun's rays to electricity using solar cells. New 'thin film' solar cells will be developed that while less efficient than existing single crystal silicon cells are potentially much cheaper to make.
Wednesday 28th April 2004
ASM International has agreed to buy Genitech, an atomic-layer and chemical-vapour deposition equipment supplier based in South Korea.
Wednesday 28th April 2004
Vishay Semiconductor is licensing patented Osram technology to manufacture and sell light-emitting diodes (LEDs) for white light with conversion technology and surface-mount LEDs for high-current applications (power SMT LEDs). Typical applications include automotive interior lighting.
Tuesday 27th April 2004
The University of Hanover’s Institute for Transport and Automation is to use Muehlbauer’s FCM 6000 high-volume, low-cost flip chip mounter for its flip chip technology projects. The university is also working with Muehlbauer to characterise and develop the machine for new applications.
Tuesday 27th April 2004
UPM Rafsec will supply radio frequency identification (RFID) label transponders to the South Korean pharmaceutical company Unimed Pharm for the tagging of individual packages of over-the-counter drugs. The agreement consists of the delivery of 100,000 RFID labels during 2004.
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Tuesday 27th April 2004
Trikon Technologies reported its results for Q1 2004. Revenues of $6.8mn represent an increase of 33% on Q1 2003’s $5.1mn. The net loss for the 2003 quarter was $5.9mn, an improvement on 2002’s loss of $7.3mn.
Friday 23rd April 2004
Duke University engineers in the USA have used organic enzymes to create nanoscale patterns on a gold surface (Journal of the American Chemical Society, May 2004, available online March 27, 2004).
Friday 23rd April 2004
Infineon Technologies is to make a capacity expansion at its US subsidiary fab in Virginia. The $1bn expansion at Infineon Technologies Richmond will begin with an initial equipment move in to start production of advanced DRAM chips on 300mm wafers beginning in early 2005.
Thursday 22nd April 2004
STMicroelectronics reports Q1 2004 net revenues at $.2029bn, 25.4% up on Q1 2003. Net income is down marginally at $77mn, compared with $79mn in Q1 2003. Gross profit is $718mn compared with last year’s $566mn.
Thursday 22nd April 2004
Researchers at Turkey’s National Research Institute of Electronics and Cryptology (TUBITAK UEKAE) have been studying the synthesis of ammonium silicon fluoride cryptocrystals on silicon by dry etching with applications from device fabrication to ultra-high density read-write optical information storage. Cryptocrystals have a crystalline structure so fine that no distinct particles are recognisable under the microscope.
Thursday 22nd April 2004
Philips Electronics has taken up a five-year, global, non-exclusive, royalty-bearing licence to MOSAID Technologies patents for embedded memory. George Cwynar, president and CEO for MOSAID, comments: "Philips is the first European company to license MOSAID's patents as well as our second running royalty licensee."
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Thursday 22nd April 2004
BOC Edwards has successfully completed a wastewater treatment evaluation programme with STMicroelectronics (ST). The programme demonstrated the capabilities of BOC Edwards’ copper no suspended solids (CuNoSS) liquid abatement system. The technique removes copper ions (Cu2+) from copper effluents, which also contain suspended solids, oxidisers and organics.
Wednesday 21st April 2004
Carl Zeiss SMT has integrated the electron beam technology business formerly marketed under the LEO brand into its corporate organisation. The integration of electron beam technology adds to Carl Zeiss SMT’s light optical systems for semiconductor manufacture applications. LEO will become Carl Zeiss SMT’s new Nanotechnology Systems division.
Wednesday 21st April 2004
Rohm and Haas Electronic Materials is to work with France’s CEA-Leti microelectronic development centre on IC process integration technology targeted at the 45nm and lower nodes.
Wednesday 21st April 2004
Swiss assembly tool supplier Alphasem acquired Sister Semiconductor Equipment (SSE) based in Singen, Germany. Alphasem believes that the combined product lines resulting from the take over offer a complete range of equipment needed for the production and the packaging of microsystem (MEMS) modules.
Wednesday 21st April 2004
Swiss assembly tool supplier Alphasem acquired Sister Semiconductor Equipment (SSE) based in Singen, Germany. Alphasem believes that the combined product lines resulting from the take over offer a complete range of equipment needed for the production and the packaging of microsystem (MEMS) modules.
Wednesday 21st April 2004
Inviron’s Climate Systems business has completed a GBP430,000 clean room for OpTIC Technium, a $29mn incubator for the optoelectronics industry based in North Wales (Bulletin 515, January 30, 2004).
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Tuesday 20th April 2004
Philips Electronics claims availability of the industry's first RFID chip compliant to worldwide regulations supporting the EPCglobal standardisation activity for UHF devices. The new Philips UCODE EPC 1.19 chip is designed for pallet and case identification supporting the 96bit EPCglobal code. Philips hopes to find customers among vendors and suppliers needing EPCglobal Class G2 compliance in the shortest possible timeframe.
Tuesday 20th April 2004
Aviza Technology has been awarded a US patent for a new multi-layer composite dielectric film concept for improving electrical properties and thermal stability of gate dielectrics in advanced semiconductor devices. The new film is a composite of high-k metal oxide and metal silicate that enhances compatibility with a poly electrode and silicon substrate at the transistor level. The patented concept was developed for devices with feature sizes of 65nm and below but also has applications at the 90nm level.
Tuesday 20th April 2004
Optical Metrology Innovations (OMI) announced the first sale of its OMISTRAIN advanced packaging metrology system to the National Taiwan University. OMISTRAIN is a deformation strain and stress measurement system based on digital imaging correlation technology and is used to rapidly assess new IC package designs and develop more robust and reliable packages for the semiconductor and electronics industries. The OMISTRAIN product will be shipped to Taiwan this month (April 2004).
Tuesday 20th April 2004
ASML introduced the TWINSCAN XT:1400, a 0.93 numerical aperture (NA), 193nm scanner that images at the 65nm node in volume production environments. The XT:1400 can also be used for pre-production testing and development at the 45nm node. The first shipments are due December 2004.
Monday 19th April 2004
Aixtron gave details of use of its Tricent atomic vapour deposition (AVD) technology in research by the MEDEA+ T207 programme to integrate high-k materials into the standard CMOS devices for sub-65nm technology nodes. The company announced complementary research using its technology at IMEC a few weeks ago (Bulletin 522, March 17, 2004).
Monday 19th April 2004
EV Group has installed three equipment systems at MicroEmissive Displays (MED) in Scotland, UK. The tools have been specially configured for the developer of polymer-based microdisplays. The MED sale represents a new market for EV Group.

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