ASM International has entered into a definitive agreement to acquire NuTool, owner of the patented Electrochemical Mechanical Deposition (ECMD) copper deposition technology. ECMD is early in its development but is expected to grow substantially over the coming years.
A French company has developed a process to manufacture very large area flexible displays assembled from carbon nanotube-based microCRTs (miniature cathode ray tubes) mounted on a flexible polymer substrate. The company - working through the Chambre de Commerce et d'Industrie de Paris - is now looking for manufacturing, technical and licensing alliances. A prototype/demonstrator is available for testing.
Philips Research has developed a variable-focus lens system that mimics the action of the human eye. The technology is to be demonstrated at this year’s CeBIT Exhibition in Hannover, Germany (March 18-24, 2004).
austriamicrosystems signed a development contract for the design and supply of an ultra-low power heart-rate receiver application specific integrated circuit (ASIC) for POLAR Electro, a Finnish producer of heart-rate monitors (HRMs).
Extreme ultraviolet (EUV) lithography sources have reached 20% of the power that will be needed for commercial high-volume systems, according to presentations at an International SEMATECH (ISMT) workshop. Progress in the three areas of source power, debris mitigation and longer collector lifetimes was demonstrated at the ISMT-sponsored workshop.
Bookham Technology and Colibrys have jointly established MEMS design and fabrication processes for variable optical attenuator (VOA) modules in a complementary relationship. VOAs are used in the optical networking industry.
Bookham Technology and Colibrys have jointly established micro-electro-mechanical system (MEMS) design and fabrication processes for variable optical attenuator (VOA) modules in a complementary relationship. VOAs are used in the optical networking industry.
SIGMA-C has updated its lithography simulation software for immersion. SOLID-C 6.4 now focuses on technical obstacles that hinder the adoption of immersion lithography. This is achieved by expanding the capability to simulate arbitrary polarisation in source, projector and mask to mitigate the so-called "hyper-NA effects". Radial-, azimuthal- or even completely user-defined polarisation can be analysed.
The European Commission (EC) NaPa project on emerging nanopatterning methods aims at integrating top down miniaturisation and bottom-up self-assembly fabrication approaches. NaPa aims to build upon know-how acquired in different countries and in several projects funded within the EC Framework 5 (FP5) research structure.
International Rectifier has opened a research and design centre in Denmark for advanced high-reliability DC-to-DC converters and other power management solutions. IR Denmark ApS (IRD) is located in Skovlunde near Copenhagen.
Optoelectronic chipmaker Intense is expanding headcount and facilities at its UK semiconductor fabrication plant in Glasgow from 50 in late 2003 to 65 now. The company’s initial focus on the telecom sector has been broadened to markets such as printing and defence.
Intel Capital has made an equity investment in Italian optics manufacturer Media Lario International for the development of key optical components for extreme ultraviolet (EUV) lithography, due for commercialisation by 2009 (32nm node).
Corning Tropel announced commercial availability of an immersion micro-objective lens, the AquaCAT. This new lens assembly is aimed at extending 193nm lithography capabilities. In a Rochester Institute of Technology (RIT) laboratory, site of the new product's first installation, an AquaCAT micro-objective recently yielded image resolution of less than 100nm.
Wacker’s Siltronic silicon wafer division has signed a license for Soitec's proprietary Smart Cut technology to produce silicon-on-insulator (SOI) and strained SOI wafers. A joint programme between the companies aims to accelerate the development of strained SOI wafers. Siltronic will be able to provide bonded SOI wafers based on Smart Cut in 2005.
SUSS MicroTec reports that it has delivered the world's first semi-automatic pressure chamber prober to their MEMUNITY partner DELTA (Danish Electronics Light and Acoustics). The PAP200 probes in a controlled environment from 1mbar vacuum up to 50bar - the pressure at 500m below sea level.
SUSS MicroTec’s French subsidiary has signed a joint development programme agreement with European microelectronics research centre IMEC on bonding technologies for micro-electro-mechanical system (MEMS) production.
Researchers at Infineon Technologies says that they have succeeded, for the first time, in using carbon nanotubes to manufacture power semiconductors. The nanotube switch can control light emitting diodes (LEDs) or electric motors. The scientists consider this a breakthrough, since it was previously assumed that atomic-scale components were not suitable for the high voltages and currents used in power applications.
UK-based AML has abandoned the design house/foundry model for the fabrication of micro-electro-mechanical system (MEMS) devices that it has been pursuing for a number of years. The company says that the approach does not work since the foundry production processes are too inflexible for the fabrication of the wide variety of MEMS devices being proposed – it’s like asking the Mini car production line in Oxford, UK, to make coffee cups.
Bilkent University of Ankara in Turkey has ordered an AIX 200/4 RF-S MOCVD system from Aixtron. Bilkent's Department of Physics has decided on a new research focus - AlGaN based devices used as UV photodetectors. These devices could be used in medical applications. Bilkent has invested in a new institute building with cleanroom facilities to house this activity.
Nikon says that it has accelerated its development plans for ArF immersion and will ship a system with a projection lens numerical aperture (NA) of greater than or equal to 1.0 in H2 2005. Nikon's previous plan was to market an immersion system with an NA of 0.92 by mid 2005.
STMicroelectronics inaugurated its third state-of-the-art design and development facility in India at Noida, near New Delhi. The new wing will be able to house 550 additional skilled design/embedded software engineers.
Infineon Technologies has joined the X Initiative semiconductor supply-chain consortium. Infineon has tested its X Architecture manufacturing readiness with the successful fabrication of a 130nm test chip and plans to further validate production designs in 2004.