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Tuesday 15th July 2003
Soitec and ASM International claim a major milestone in their strained silicon-on-insulator (SOI) partnership programme with samples of a first-generation strained silicon wafer for the 65nm technology node. Work started in May 2003.
Tuesday 15th July 2003
STMicroelectronics claims the world’s smallest NOR Flash memory cell built on a 90nm process. The memory is designed for low voltage and high performance applications.
Tuesday 15th July 2003
Electroglas has sold its Design for Manufacturing (DFM) and Fab Solutions software product lines to FEI for $6mn in cash plus the assumption of certain liabilities. The product lines include Electroglas' Yield Manager and Merlin's Framework products. FEI will found a new division that will be staffed, in part, by existing Electroglas' DFM and Fab Solutions employees.
Monday 14th July 2003
The European Commission has decided to approve investment aid of EUR98mn for the setting up of a research and development facility for optical photomasks in Dresden, Germany.
Monday 14th July 2003
Nikon, Canon and Tokyo Electron made a stream of announcements in preparation for next week's SEMICON West show in the USA.
Monday 14th July 2003
Chartered Semiconductor Manufacturing has signed a multi-year agreement to provide volume manufacturing for Infineon Technologies.
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Monday 14th July 2003
Intel has acquired West Bay Semiconductor in a cash-for-assets transaction.
Monday 14th July 2003
ThreeFive Photonics has filed a "suspension of payments" request in the Dutch courts.
Monday 14th July 2003
Gartner Dataquest issued semiconductor capital and equipment spending estimates for 2003 and 2004.
Monday 14th July 2003
Micro Lithography (MLI) is to supply pellicles to DuPont Photomasks under a multi-year agreement. DuPont will begin ramping-down internal pellicle production at its facility in Connecticut immediately, ending production by September 2003. DuPont Photomasks' global workforce will be reduced by 5% (96 positions) once the move has been completed.
Monday 14th July 2003
Intellectual property company Rambus along with Toshiba and Elpida announced XDR DRAM technology.
Monday 14th July 2003
Matsushita Electric Industrial says it will start the world's first mass production of FeRAM (ferroelectric random-access memory)-embedded system-on-chips (SoC) using a 0.18micron process.
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Monday 14th July 2003
Researchers at Infineon Technologies claim to have set a new world-speed record for silicon chips.
Monday 14th July 2003
Three scientists from the University of Massachusetts Amherst and the Hong Kong University of Science and Technology have developed microcoolers based on AlGaAs superlattices (Applied Physics Letters, July 14, 2003).
Monday 14th July 2003
IMEC has launched two industrial affiliation programmes (IIAPs) targeting sub-45nm processes. The first programme aims at improving device performance by implementing strained silicon (Si) in the transistor channel for scaled planar MOS devices. The second will exploit the high-mobility features of germanium (Ge) to fabricate high-performance CMOS transistors. The programmes are inter-linked with IMEC's present advanced CMOS research programmes.
Monday 14th July 2003
Nikon has obtained a "significant" order for its NPS3301 300mm chemical mechanical planarisation (CMP) system that will be shipped to a leading development facility in Japan. The system will be focused on advanced 65nm copper/low-k interconnect polishing. Shipment is due this month, July 2003.
Monday 14th July 2003
Scientists at Tohuku university and the Semiconductor Spintronics Project of the Japan Science and Technology Corporation have been studying the use of electric fields to enable magnetisation reversal in ferromagnetic semiconductors (Sciencexpress report, July 10, 2003, 10.1126/science.1086608).
Monday 14th July 2003
BOC Edwards has been awarded a high-purity carbon dioxide supply contract from a major US semiconductor manufacturer for its supercritical CO2 process.
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Monday 14th July 2003
IMEC has launched two industrial affiliation programmes (IIAPs) targeting sub-45nm processes. The first programme aims at improving device performance by implementing strained silicon (Si) in the transistor channel for scaled planar MOS devices. The second will exploit the high-mobility features of germanium (Ge) to fabricate high-performance CMOS transistors. The programmes are inter-linked with IMEC's present advanced CMOS research programmes.
Monday 14th July 2003
BOC Edwards has been awarded a high-purity carbon dioxide supply contract from a major US semiconductor manufacturer for its supercritical CO2 process.
Monday 14th July 2003
Nikon has obtained a "significant" order for its NPS3301 300mm chemical mechanical planarisation (CMP) system that will be shipped to a leading development facility in Japan. The system will be focused on advanced 65nm copper/low-k interconnect polishing. Shipment is due this month, July 2003.
Monday 14th July 2003
The European Commission has decided to approve investment aid of EUR98mn for the setting up of a research and development facility for optical photomasks in Dresden, Germany.
Monday 14th July 2003
Chartered Semiconductor Manufacturing has signed a multi-year agreement to provide volume manufacturing for Infineon Technologies. The manufacturing agreement includes Infineon’s OptiMOS technology with potential extension to its CoolMOS process.
Thursday 10th July 2003
Researchers at New York’s Rensselaer Polytechnic Institute (RPI) have created minaturised gas ionisation sensors based on multi-wall carbon nanotube (MWNT) elements (Nature, July 10, 2003).

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