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Tuesday 12th August 2003
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Monday 11th August 2003
Genus announced multiple orders for its StrataGem200 atomic layer deposition (ALD) tool from a major European DRAM manufacturer.
Friday 8th August 2003
Tecan Components says that it is experiencing "significant interest" in its electroformed parts for micro-applications.
Thursday 7th August 2003
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Thursday 7th August 2003
The Fraunhofer Institute for Interfacial Engineering and Biotechnology (IGB) has developed a new type of protein analysis chip based on silica-nanoparticles.
Thursday 7th August 2003
Chartered Semiconductor Manufacturing, IBM and Infineon Technologies have agreed joint 65nm semiconductor manufacturing process development.
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Thursday 7th August 2003
Contacting carbon nanotubes with palladium (Pd) greatly reduces or eliminates the barriers for current, according to researchers from Stanford and Purdue universities (Nature, August 7, 2003). The researchers have realised high-performance ballistic nanotube field-effect transistors with zero or slightly negative Schottky barriers.
Wednesday 6th August 2003
International SEMATECH (ISMT) and Exitech have agreed to jointly develop the world's first 13.5nm wavelength aerial image monitor tool for pattern and defect inspection of extreme ultraviolet (EUV) reticles. This first alpha tool built by Exitech will be used for EUV mask blank and defect inspection at the International SEMATECH North (ISMTN) NanoFab 1 EUV mask blank facility in Albany, New York. The tool is scheduled for delivery in Q3 2005
Wednesday 6th August 2003
Taiwan foundry UMC is to buy back Infineon’s equity share in the UMCi 300mm joint venture fab in Singapore. UMCi is the Singapore manufacturing venture formed in April 2001 by Infineon, UMC and Singapore’s Economic Development Board investment arm (EDBI). EDBI will retain its equity position.
Friday 1st August 2003
Friday 1st August 2003
Bookham is launching new cost cutting initiatives that include reallocating and reducing its R&D spending in recognition of slower market growth and pursuing restructuring efforts to reduce manufacturing overheads.
Wednesday 30th July 2003
Bookham Technology and BTI Photonic Systems have formed a technology, product and commercial association to deliver optimised optical subsystems. The aim is to speed introduction of advanced optical solutions based on Bookham's portfolio of erbium doped fibre amplifiers (EDFA) and optical add/drop multiplexers (OADM), together with BTI's Netstender family of intelligent link systems.
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Wednesday 30th July 2003
International SEMATECH (ISMT) and Exitech have agreed to jointly develop the world's first 13.5nm wavelength aerial image monitor tool for pattern and defect inspection of extreme ultraviolet (EUV) reticles. This first alpha tool built by Exitech will be used for EUV mask blank and defect inspection at the International SEMATECH North (ISMTN) NanoFab 1 EUV mask blank facility in Albany, New York. The tool is scheduled for delivery in Q3 2005.
Wednesday 30th July 2003
ASM International has shipped its Levitor 4000 RTP system for nickel silicide (NiSi) anneal applications to a customer in Japan. The Japanese customer will develop processes in the temperature range of 200-550C for the 65nm and 45nm technology nodes.
Wednesday 30th July 2003
With the semiconductor industry management and infrastructure 100% recession-oriented, it’ll be tough going for some moving into the next recovery, according to Malcolm Penn of Future Horizons. He predicts restructuring of the industry next year as some won’t be able to handle the pace of the turn-around.
Wednesday 30th July 2003
Malaysian foundry 1st Silicon will license 0.25micron embedded Flash memory technology from Silicon Storage Technology (SST).
Wednesday 30th July 2003
International SEMATECH (ISMT) has tested and qualified a fourth-generation automated material handling (AMH) system that combines two independently made overheard transport (OHT) and conveyor systems within a 300mm fab.
Monday 28th July 2003
Infineon Technologies and the China-Singapore Suzhou Industrial Park Venture (CSVC) are setting up a joint venture for the assembly and testing of memory ICs. The agreement provides for the construction of a joint facility in the Suzhou Industrial Park (SIP), 80 km from Shanghai.
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Monday 28th July 2003
Infineon Technologies and the China-Singapore Suzhou Industrial Park Venture (CSVC) are setting up a joint venture for the assembly and testing of memory ICs. The agreement provides for the construction of a joint facility in the Suzhou Industrial Park (SIP), 80 km from Shanghai.
Thursday 24th July 2003
Cree has purchased a portfolio of patents and patent applications relating to silicon carbide (SiC) technology from Scandinavian company ABB Research. The technology covered by the patents ranges from epitaxial growth to device and circuit-level technology.
Thursday 24th July 2003
IC Insights Top Ten IC company rankings for H2 2003 contain three from Europe, three from Japan, two from the USA, one from Korea and one from Taiwan. The market researcher comments that this is the first time that there are more European than US companies in the list.
Thursday 24th July 2003
BASF Venture Capital is investing in Scottish microdisplay company MicroEmissive Displays (MED). BASF Venture Capital and other venture capital providers including 3i will supply a total of $7.5mn in a first closing of a Series C round. Scottish Equity Partners will act as lead investor.
Thursday 24th July 2003
IC Insights Top Ten IC company rankings for H2 2003 contain three from Europe, three from Japan, two from the USA, one from Korea and one from Taiwan. The market researcher comments that this is the first time that there are more European than US companies in the list.
Tuesday 22nd July 2003
IMEC looks to strained silicon and germanium on insulator IMEC has launched two industrial affiliation programmes (IIAPs) targeting sub-45nm processes. The first programme aims at improving device performance by implementing strained silicon (Si) in the transistor channel for scaled planar MOS devices. The second will exploit the high-mobility features of germanium (Ge) to fabricate high-performance CMOS transistors. The programmes are inter-linked with IMEC's present advanced CMOS research programmes.

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