BAOBERLIN in Germany has developed a high power light emitting diode (HL-LED). The company says that the device generates 20 times higher light output because currents reach 600mA rather than the 30mA typical with 2.8x3.2mm2 formats.
SUSS MicroTec has developed a method of plasma surface activation and wafer to wafer bonding for silicon on insulator (SOI) and strained silicon applications. nano PREP reduces the process temperature to 200C allowing new applications for wafer level integration of CMOS and micro-electro-mechanical systems (MEMS) or CMOS and nanotechnology. The technology uses atmospheric pressure plasma to generate a molecular level surface modification to enable the low temperature bonding.
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The University of Duisburg has developed an optical measurement technique for quality control of nano electronic circuits that are developed using nano imprint lithography (NIL). The system was produced in co-operation with a microelectronic manufacturer.
Sigma-C has raised $2.87mn in a first round of financing from Deutsche Venture Capital (DVC). Sigma-C plans to use the money to accelerate the launch of design-to-manufacture software products for the semiconductor industry that more closely link electronic design automation (EDA) software, photomask production and wafer fabrication.
Carl Zeiss Microelectronic Systems GmbH (MES) of Jena has changed its name to Carl Zeiss SMS GmbH (Semiconductor Metrology Systems). The subsidiary of Carl Zeiss SMT AG will combine the activities of the former MES subsidiary and LEO Electron Microscopy. Carl Zeiss SMS currently has more than 80 employees.
Toshiba has produced a prototype of a compact, direct methanol fuel cell (DMFC). The company believes that this opens the way to the use of DMFC as an alternative power source to recharge batteries for personal devices.
The European IMEC research centre has installed a SUSS PAV150 at its Leuven (Belgium) facility to test micro-electro-mechanical system (MEMS) devices (in particular RF MEMS) in a high vacuum environment. The system enables reliability tests of MEMS under real-life conditions.
IBM claims to be the first to build SiGe bipolar devices using thin layer silion-on-insulator (SOI) wafers. The company believes that this paves the way to building SiGe bipolar and CMOS circuits on the same thin SOI wafer, maximising the performance of both the computing and communications functions.
STMicroelectronics released details of an advanced research programme that it hopes will substantially reduce the cost of generating electricity from solar power. The research team, based in Catania and Naples, Italy, is focusing on applying expertise in nanotechnology to the development of new solar cell technologies. It is hoped the final products will eventually be able to compete commercially with conventional electricity generation methods such as burning fossil fuels or nuclear reactors.
Applied Materials has obtained an exclusive patent licence from SCP Global Technologies to integrate single-wafer vapour drying technology on the Reflexion LK chemical mechanical planarisation (CMP) system.
eMagin’s organic light emitting diode (OLED) microdisplays are being used in the second generation of VRmagic’s EYESI virtual reality (VR) ophthalmic surgical training equipment. The system provides real-time simulation, biomechanical tissue simulation, tracking and stereo imaging.
Nippon Telegraph and Telephone (NTT) researchers have successfully prepared KTN crystals (KTa1-xNbxO3) with the highest electro-optic effect ever reported. In addition, NTT has developed film growth and lithographic techniques that can be used to fabricate optical waveguides with excellent performance.
Infineon Technologies has produced a new test chip designed to allow production processes of complex semiconductors to be tested and improved. The chip is based on a circuit developed at the Regensburg University of Applied Sciences in Germany.
Carl Zeiss Microelectronic Systems has delivered its first Aerial Image Measurement System (AIMS) for 157nm optical lithography to International SEMATECH (ISMT) in Austin, Texas. The tool is to be used to develop cutting-edge 157nm photomask technology.
The US National Electronics Manufacturing Initiative (NEMI) presented the recommendations of its Tin Whisker Accelerated Test Project. The project team has submitted a test method document to JEDEC that recommends two storage conditions and one temperature cycling condition to evaluate the propensity of tin-based plating finishes to grow whiskers.
European infrared image sensor developer XenICs has signed a sales and marketing agreement concerning its high-performance near-infrared InGaAs camera with US company Electrophysics. The camera has a spectral response in the range 0.9-1.7microns.
Electrophysics develops of near infrared, night vision and thermal imaging systems. It will add the XenICs InGaAs camera to its product line.
UK company Filtronic reports that it has been selected by a new OEM customer to supply initial quantities of an integrated radio frequency head unit to be installed in 3G wideband code division multiple access (WCDMA) base stations. Production quantities are not expected to commence until H2 2004.